公开(公告)号：US20230268199A1

公开(公告)日：2023-08-24

申请号：US18091633

申请日：2022-12-30

Applicant: SEMES CO., LTD.

Inventor： Jehyoung LEE ,  Joon Hwan JANG ,  Shi Hyun PARK ,  Inhwang PARK

IPC: H01L21/67 ,  F01N13/00

CPC classification number: H01L21/67017 ,  F01N13/008 ,  F01N13/002 ,  F01N2270/08 ,  F01N2390/04 ,  F01N2590/10

Abstract: Provided is a gas exhaust apparatus for expelling a gas in a treatment space of a wafer treatment apparatus to outside, the gas exhaust apparatus including a main exhaust line connected to the treatment space, and an auxiliary exhaust line having an end connected to the main exhaust line to supply an external air current to the main exhaust line, wherein an automatic closer is disposed at another end of the auxiliary exhaust line to close the other end of the auxiliary exhaust line in a specific situation.

公开(公告)号：US20230317479A1

公开(公告)日：2023-10-05

申请号：US18114749

申请日：2023-02-27

Applicant: SEMES CO., LTD.

Inventor： Shi Hyun PARK ,  Joon Hwan JANG ,  Inhwang PARK

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67196 ,  H01L21/68707 ,  H01L21/67178 ,  H01L21/67253 ,  H01L21/67017 ,  H01L21/67201

Abstract: Provided is a transfer chamber disposed between a buffer unit providing a space where wafers stay before being transferred, and process chambers each providing a space where a wafer processing process is performed, to transfer the wafers, the transfer chamber including a main robot for transferring the wafers between the buffer unit and the process chambers, or between the process chambers, a guide rail connected to the main robot to move the main robot, and a frame defining a space where the main robot and the guide rail of the transfer chamber operate, wherein a plurality of closers are connected to the frame to close a plurality of opening regions formed by the frame.

公开(公告)号：US20210008606A1

公开(公告)日：2021-01-14

申请号：US16924633

申请日：2020-07-09

Applicant: SEMES CO., LTD.

Inventor： Inhwang PARK ,  Gui Su PARK ,  Young Hun LEE ,  Youngseop CHOI ,  Seung Hoon OH ,  Jonghyeon WOO ,  Jin Mo JAE

IPC: B08B7/00 ,  H01L21/67

Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space for treating the substrate; a fluid supply unit for supplying fluid to the treatment space, wherein the fluid supply unit includes: a supply pipe connected to the treatment space to supply the fluid to the treatment space; a pump installed in the supply pipe to provide flow pressure to the fluid; a vent line installed between the pump and the process chamber to discharge pressure in the fluid to an outside; a relief valve installed in the vent line to open and close the vent line; and a reservoir installed between the pump and a branch point wherein the vent line branches from the supply pipe, wherein the reservoir has a cross-sectional area larger than a cross-sectional area of a portion of the supply pipe located between the pump and the branch point.