公开(公告)号：US20230311153A1

公开(公告)日：2023-10-05

申请号：US18101121

申请日：2023-01-25

Applicant: SEMES CO., LTD.

Inventor： Sung Hun EOM ,  Tae Won YUN ,  Yun Hwa HONG ,  Jong Kook BAE

IPC: B05C5/00 ,  B05C11/08 ,  B05D1/00

CPC classification number: B05C5/001 ,  B05C11/08 ,  B05D1/005

Abstract: A substrate processing apparatus, which may suppress occurrence of temperature deviation caused by an air current, is provided. The substrate processing apparatus includes a chamber including an upper body and a lower body and having a processing space formed therein by the upper body and the lower body, a substrate support unit disposed in the processing space and having a support surface on which the substrate is supported, a heater disposed to heat gas in the processing space, an introduction unit configured to supply gas toward an edge of the support surface, and a discharge unit configured to discharge the gas in the processing space. The discharge unit may include a plurality of outlets spaced apart from a centerline of the support surface in the upper body and disposed to be closer to the centerline of the support surface than to the introduction unit.

公开(公告)号：US20240160119A1

公开(公告)日：2024-05-16

申请号：US18139381

申请日：2023-04-26

Applicant: SEMES CO., LTD.

Inventor： Nam Ki HONG ,  Ick Kyun KIM ,  Jae Wook LEE ,  Seung Kyu PARK ,  Tae Won YUN ,  Si Hwan YANG

IPC: G03F7/20 ,  B05B1/16 ,  B05B1/30 ,  B05B15/55 ,  H01L21/67

CPC classification number: G03F7/70925 ,  B05B1/16 ,  B05B1/30 ,  B05B15/55 ,  G03F7/70808 ,  H01L21/67051

Abstract: A home port for a semiconductor manufacturing nozzle head includes a body having a discharge space configured to receive treatment liquid discharged from a plurality of nozzles, discharge flow passages connected to be in communication with the discharge space and penetrating through the body so as to face the plurality of nozzles, and a cleaning liquid distribution system, which is formed to penetrate through the body, and is connected to transfer a cleaning liquid to the discharge flow passages. The cleaning liquid distribution system includes supply flow passages connected to supply the cleaning liquid to the discharge flow passages, and a lead-in passage connected to and which joins the supply flow passages, and connected to receive the cleaning liquid injected from the outside.

公开(公告)号：US20230311172A1

公开(公告)日：2023-10-05

申请号：US18094344

申请日：2023-01-06

Applicant: SEMES CO., LTD.

Inventor： Sung Hun EOM ,  Tae Won YUN

IPC: B08B3/12 ,  B08B3/08

CPC classification number: B08B3/123 ,  B08B3/08

Abstract: A substrate processing apparatus includes a substrate support unit, supporting a substrate, and an ultrasonic cleaning module disposed in a location lower than an upper surface of the substrate support unit. The ultrasonic cleaning module may include a receiving portion receiving a chemical, an opening portion in which at least a portion of an upper surface of the receiving portion is opened, and an ultrasonic vibration unit disposed to be directed toward the opening portion from the receiving portion, and may be configured in such a manner that a liquid surface of the chemical, rising by the ultrasonic vibration unit, touches the substrate through the opening portion.