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公开(公告)号：US20140060575A1
公开(公告)日：2014-03-06
申请号：US14012523
申请日：2013-08-28
Applicant: SEMES CO. LTD
Inventor： Kang Suk Lee , Jae Myoung Lee , Bok Kyu Lee , Yong Hee Lee , Jin Bok Lee
IPC: H01L21/02
CPC classification number: H01L21/02057 , H01L21/67028 , H01L21/6715
Abstract: Provided is a substrate treating method. The substrate treating method may include treating a substrate by using a chemical solution; rinsing the substrate by using pure water after treating the substrate by using the chemical solution; and treating the substrate by using an organic solvent, wherein the substrate treating method further includes coating the substrate with a hydrophobic membrane between the treating of the chemical solution and the treating of the organic solvent.
Abstract translation: 提供了一种基板处理方法。 基板处理方法可以包括使用化学溶液处理基板; 通过使用化学溶液处理基材后，使用纯水冲洗基材; 以及使用有机溶剂处理所述基材，其中所述基材处理方法还包括在所述化学溶液的处理和所述有机溶剂的处理之间用疏水膜涂覆所述基材。
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公开(公告)号：US12040216B2
公开(公告)日：2024-07-16
申请号：US17386829
申请日：2021-07-28
Applicant: SEMES Co., Ltd.
Inventor： Yong Hoon Hong , Kang Suk Lee , Hyeon Jun Lee , So Young Jang
IPC: H01L21/687 , H01L21/67
CPC classification number: H01L21/68742 , H01L21/67023 , H01L21/68792 , H01L21/67051 , H01L21/67253
Abstract: A substrate supporting member capable of controlling the flow of charges on a substrate by controlling ground resistance values of a guide pin and a support pin using a variable resistor, and a substrate treating apparatus including the same are provided. The substrate supporting member includes the body; a support pin installed on the body and for supporting the substrate; a guide pin installed on the body and for supporting the substrate; and a charge control device for controlling a charge around the substrate by controlling an electrical connection between the support pin and a first resistor and an electrical connection between the guide pin and a second resistor.
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公开(公告)号：US10460923B2
公开(公告)日：2019-10-29
申请号：US15635535
申请日：2017-06-28
Applicant: SEMES CO., LTD.
Inventor： Young Ha Kim , Se Jeong Choi , Kang Suk Lee , Kiyoung Kwark , Jeoung Eun Park , Jeong Yeong Park
Abstract: Disclosed are an apparatus and a method for liquid-treating a substrate. The method for liquid-treating a substrate includes a first treatment liquid supplying operation of supplying a first treatment liquid to a treatment location of the substrate, and a wetting operation of, after the first treatment liquid supplying operation, supplying a wetting liquid onto the substrate, wherein the wetting operation includes a simultaneous supply operation of supplying the wetting liquid to the first location while the first treatment liquid is supplied, and wherein the first location is a location deviating from the treatment location. Accordingly, the surface of the substrate may be prevented from being dried while the treatment liquid is converted to a wetting liquid.
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公开(公告)号：US11772115B2
公开(公告)日：2023-10-03
申请号：US17028211
申请日：2020-09-22
Applicant: SEMES CO., LTD.
Inventor： Kang Suk Lee , Joo Sung Lee , Soon Kab Kwon
CPC classification number: B05B12/10 , B05B12/12 , B08B3/08 , H01L21/02057 , H01L21/6715 , H01L21/67051 , H01L21/67248 , H01L21/67017
Abstract: Disclosed is an apparatus for treating a substrate. The apparatus includes a substrate support unit that supports the substrate, a nozzle unit that dispenses a treatment liquid onto the substrate supported on the substrate support unit, and a liquid supply unit that supplies the treatment liquid to the nozzle unit. The liquid supply unit includes a main supply line that is connected to the nozzle unit and that supplies the treatment liquid to the nozzle unit, wherein the treatment liquid is prepared by mixing a chemical with DIW at a first temperature and DIW at a second temperature higher than the first temperature, and temperature of the treatment liquid is adjusted by regulating a flow rate of the DIW at the first temperature and a flow rate of the DIW at the second temperature without a separate heater.
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