公开(公告)号：US12300519B2

公开(公告)日：2025-05-13

申请号：US18215128

申请日：2023-06-27

Applicant: SEMES CO., LTD.

Inventor： Jung Suk Goh ,  Sun Mi Kim ,  Ji Su Hong ,  Kuk Saeng Kim ,  Cheng Bin Cui ,  Pil Kyun Heo

IPC: H01L21/67 ,  B08B3/04

Abstract: Disclosed is a substrate treatment apparatus. The apparatus includes a support unit that supports and rotates a substrate and a spray unit equipped with one or more nozzles to spray a dual fluid that is a mixture of a cleaning agent and carbon dioxide onto the substrate.

公开(公告)号：US11705350B2

公开(公告)日：2023-07-18

申请号：US16705065

申请日：2019-12-05

Applicant: SEMES CO., LTD.

Inventor： Sun Mi Kim ,  Jisu Hong ,  Moonsik Choi ,  Oh Jin Kwon

IPC: H01L21/67 ,  H01L21/027

CPC classification number: H01L21/6715 ,  H01L21/0273 ,  H01L21/67051

Abstract: The inventive concept provides an apparatus and method for removing a film formed on a substrate. A method for treating the substrate includes a primary solvent dispensing step of dispensing an organic solvent onto the substrate to remove a photoresist film on the substrate and an ozone dispensing step of dispensing a liquid containing ozone onto the substrate to remove organic residue on the substrate, after the primary solvent dispensing step.

公开(公告)号：US20220206399A1

公开(公告)日：2022-06-30

申请号：US17404240

申请日：2021-08-17

Applicant: SEMES Co., Ltd.

Inventor： Oh Jin Kwon ,  Ji Su Hong ,  Sun Mi Kim

IPC: G03F7/20

Abstract: A substrate processing apparatus and method for effectively removing an organic material such as a photoresist without using sulfuric acid are provided. The substrate processing apparatus includes a support module, in which a substrate is inverted and seated, and an ultraviolet light source is installed, wherein the substrate is arranged so that one surface of the substrate faces the support module, and the ultraviolet light source irradiates ultraviolet rays to one surface of the substrate; a nozzle installed in the support module; and a fluid supply module for supplying a fluid to one surface of the substrate through the nozzle.

公开(公告)号：US12205833B2

公开(公告)日：2025-01-21

申请号：US18202396

申请日：2023-05-26

Applicant: SEMES CO., LTD.

Inventor： Sun Mi Kim ,  Jisu Hong ,  Moonsik Choi ,  Oh Jin Kwon

IPC: H01L21/67 ,  H01L21/027

Abstract: The inventive concept provides an apparatus and method for removing a film formed on a substrate. A method for treating the substrate includes a primary solvent dispensing step of dispensing an organic solvent onto the substrate to remove a photoresist film on the substrate and an ozone dispensing step of dispensing a liquid containing ozone onto the substrate to remove organic residue on the substrate, after the primary solvent dispensing step.

公开(公告)号：US11764084B2

公开(公告)日：2023-09-19

申请号：US16951718

申请日：2020-11-18

Applicant: SEMES CO., LTD.

Inventor： Jung Suk Goh ,  Sun Mi Kim ,  Ji Su Hong ,  Kuk Saeng Kim ,  Cheng Bin Cui ,  Pil Kyun Heo

IPC: H01L21/67 ,  B08B3/04

CPC classification number: H01L21/6708 ,  B08B3/041 ,  H01L21/67253

Abstract: Disclosed is a substrate treatment apparatus. The apparatus includes a support unit that supports and rotates a substrate and a spray unit equipped with one or more nozzles to spray a dual fluid that is a mixture of a cleaning agent and carbon dioxide onto the substrate.

公开(公告)号：US11520245B2

公开(公告)日：2022-12-06

申请号：US17404240

申请日：2021-08-17

Applicant: SEMES Co., Ltd.

Inventor： Oh Jin Kwon ,  Ji Su Hong ,  Sun Mi Kim

IPC: G03F7/20

Abstract: A substrate processing apparatus and method for effectively removing an organic material such as a photoresist without using sulfuric acid are provided. The substrate processing apparatus includes a support module, in which a substrate is inverted and seated, and an ultraviolet light source is installed, wherein the substrate is arranged so that one surface of the substrate faces the support module, and the ultraviolet light source irradiates ultraviolet rays to one surface of the substrate; a nozzle installed in the support module; and a fluid supply module for supplying a fluid to one surface of the substrate through the nozzle.