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公开(公告)号:US12300519B2
公开(公告)日:2025-05-13
申请号:US18215128
申请日:2023-06-27
Applicant: SEMES CO., LTD.
Inventor: Jung Suk Goh , Sun Mi Kim , Ji Su Hong , Kuk Saeng Kim , Cheng Bin Cui , Pil Kyun Heo
Abstract: Disclosed is a substrate treatment apparatus. The apparatus includes a support unit that supports and rotates a substrate and a spray unit equipped with one or more nozzles to spray a dual fluid that is a mixture of a cleaning agent and carbon dioxide onto the substrate.
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公开(公告)号:US11703520B2
公开(公告)日:2023-07-18
申请号:US17482845
申请日:2021-09-23
Applicant: SEMES CO., LTD.
Inventor: Yong-Jun Seo , Sang Hyun Son , Ji Su Hong , Jae Myoung Lee , Dong Ok Ahn
CPC classification number: G01P5/12 , G01P13/006 , G01P13/02 , G01P13/045
Abstract: The inventive concept provides a wafer type sensor unit which acquires data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus. The unit comprising a wafer-shaped circuit board and a hot-wired wind velocity sensor placed apart from an upper surface of the circuit board.
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公开(公告)号:US20220206399A1
公开(公告)日:2022-06-30
申请号:US17404240
申请日:2021-08-17
Applicant: SEMES Co., Ltd.
Inventor: Oh Jin Kwon , Ji Su Hong , Sun Mi Kim
IPC: G03F7/20
Abstract: A substrate processing apparatus and method for effectively removing an organic material such as a photoresist without using sulfuric acid are provided. The substrate processing apparatus includes a support module, in which a substrate is inverted and seated, and an ultraviolet light source is installed, wherein the substrate is arranged so that one surface of the substrate faces the support module, and the ultraviolet light source irradiates ultraviolet rays to one surface of the substrate; a nozzle installed in the support module; and a fluid supply module for supplying a fluid to one surface of the substrate through the nozzle.
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公开(公告)号:US11764084B2
公开(公告)日:2023-09-19
申请号:US16951718
申请日:2020-11-18
Applicant: SEMES CO., LTD.
Inventor: Jung Suk Goh , Sun Mi Kim , Ji Su Hong , Kuk Saeng Kim , Cheng Bin Cui , Pil Kyun Heo
CPC classification number: H01L21/6708 , B08B3/041 , H01L21/67253
Abstract: Disclosed is a substrate treatment apparatus. The apparatus includes a support unit that supports and rotates a substrate and a spray unit equipped with one or more nozzles to spray a dual fluid that is a mixture of a cleaning agent and carbon dioxide onto the substrate.
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公开(公告)号:US11520245B2
公开(公告)日:2022-12-06
申请号:US17404240
申请日:2021-08-17
Applicant: SEMES Co., Ltd.
Inventor: Oh Jin Kwon , Ji Su Hong , Sun Mi Kim
IPC: G03F7/20
Abstract: A substrate processing apparatus and method for effectively removing an organic material such as a photoresist without using sulfuric acid are provided. The substrate processing apparatus includes a support module, in which a substrate is inverted and seated, and an ultraviolet light source is installed, wherein the substrate is arranged so that one surface of the substrate faces the support module, and the ultraviolet light source irradiates ultraviolet rays to one surface of the substrate; a nozzle installed in the support module; and a fluid supply module for supplying a fluid to one surface of the substrate through the nozzle.
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