GAS PIPING SYSTEM, CHEMICAL VAPOR DEPOSITION DEVICE, FILM DEPOSITION METHOD, AND METHOD FOR PRODUCING SiC EPITAXIAL WAFER

    公开(公告)号:US20190169742A1

    公开(公告)日:2019-06-06

    申请号:US16314084

    申请日:2017-06-12

    Abstract: This gas piping system is a run-vent mode gas piping system in which, the gas piping system including a plurality of supply lines through which plural gases are fed individually, an exhaust line that leads from a reactor to an exhaust pump, a run line having one or plural pipes which respectively branch from the plural supply lines, plural vent lines which respectively branch from the supply lines and are connected to the exhaust line, and plural valves which are respectively provided at the branch points of the plural supply lines, and switches between feeding a gas to the run line side and feeding a gas to the vent line side, wherein the plural vent lines are separated from each other until the vent lines reach the exhaust line, and the inner diameter of the exhaust line is greater than the inner diameter of the plural vent lines.

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