公开(公告)号：US20160194753A1

公开(公告)日：2016-07-07

申请号：US14655822

申请日：2013-12-11

Applicant: SHOWA DENKO K.K.

Inventor： Daisuke MUTO ,  Yusuke KIMURA ,  Tomoya UTASHIRO ,  Seiichi TAKAHASHI ,  Kenji MOMOSE

IPC: C23C16/32 ,  C23C16/46 ,  C23C16/455

CPC classification number: C23C16/325 ,  C23C16/45502 ,  C23C16/45514 ,  C23C16/45517 ,  C23C16/45519 ,  C23C16/46

Abstract: A CVD device including: a chamber containing a substrate having a SiC-film formation surface; a heating mechanism for heating the substrate from a direction opposite the film formation surface; a third supply space (231) for supplying a third raw-material gas containing carbon in a direction (X) toward the substrate from the lateral side of the substrate; a second supply space (221) for supplying a second raw-material gas containing silicon in the direction (X) from the lateral side of the substrate toward the side farther than the third raw-material gas when viewed from the film formation surface; and a blocking gas supply section for supplying a blocking gas for suppressing the upward movement of the third raw-material gas and the second raw-material gas in a second direction from the side facing the film formation surface toward the film formation surface.

Abstract translation: 1.一种CVD装置，包括：包含具有SiC膜形成表面的基板的室; 加热机构，用于从与所述成膜表面相反的方向加热所述基底; 第三供应空间（231），用于从所述基板的横向侧朝向所述基板从所述方向（X）供给包含碳的第三原料气体; 第二供给空间（221），从成膜面观察时，从所述基板的侧面朝向比所述第三原料气体更远的方向从所述方向（X）向所述方向（X）供给含硅的第二原料气体; 以及阻挡气体供给部，其从面向成膜面的一侧向成膜面供给用于抑制第三原料气体和第二原料气体沿第二方向的向上运动的阻塞气体。

公开(公告)号：US20150345046A1

公开(公告)日：2015-12-03

申请号：US14655827

申请日：2013-12-11

Applicant: SHOWA DENKO K.K.

Inventor： Daisuke MUTO ,  Yusuke KIMURA ,  Tomoya UTASHIRO ,  Seiichi TAKAHASHI ,  Kenji MOMOSE ,  Hisanori KURIBAYASHI ,  Naoki YASUDA

IPC: C30B25/08 ,  C30B25/10 ,  C30B29/36 ,  C30B25/20

CPC classification number: C30B25/08 ,  C23C16/325 ,  C23C16/45502 ,  C23C16/45514 ,  C23C16/45517 ,  C23C16/45519 ,  C23C16/463 ,  C30B25/10 ,  C30B25/14 ,  C30B25/20 ,  C30B29/36

Abstract: A CVD device equipped with a container chamber (100) having an interior space (100a), and containing a substrate in a manner such that the film formation surface thereof faces upward from the bottom side (fifth region (A5)) of the interior space (100a). Silane gas and propane gas are supplied to the interior space (100a). A stainless-steel ceiling (120) is provided on the top of the interior space (100a). The ceiling (120) is provided with first through third partition members (171-173) attached thereto which comprise stainless steel, are positioned so as to extend in the -Z-direction and transect the X-direction, and divide the top side of the interior space (100a) into first through fourth regions (A1-A4). The substrate positioned inside the interior space (100a) is heated to 1600° C. The first through third partition members (171-173) and the ceiling (120) are cooled to 300° C. or lower by a cooling mechanism.

Abstract translation: 一种装备有具有内部空间（100a）的容器室（100）的CVD装置，并且以使其成膜表面从内部空间的底侧（第五区域（A5））向上方的方式包含基板 （100a）。 硅烷气体和丙烷气体被供应到内部空间（100a）。 在内部空间（100a）的顶部设置有不锈钢天花板（120）。 天花板（120）设置有附接到其上的第一至第三分隔构件（171-173），其包括不锈钢，定位成沿-Z方向延伸并横切X方向，并且将 所述内部空间（100a）进入第一至第四区域（A1-A4）。 将位于内部空间（100a）内的基板加热至1600℃。通过冷却机构将第一至第三分隔部件（171-173）和顶板（120）冷却至300℃以下。

公开(公告)号：US20180371640A1

公开(公告)日：2018-12-27

申请号：US16063391

申请日：2016-12-12

Applicant: SHOWA DENKO K.K.

Inventor： Jia YU ,  Naoto ISHIBASHI ,  Keisuke FUKADA ,  Tomoya UTASHIRO ,  Hironori ATSUMI

IPC: C30B25/12 ,  C23C16/458 ,  H01L21/687 ,  C30B25/10 ,  C30B25/14

Abstract: A wafer supporting mechanism including: a wafer supporting table; and a movable part supported by the wafer supporting table, wherein the wafer supporting table includes a wafer supporting portion for transfer that stands up from a first surface opposing a back surface of a wafer to be placed and is provided further toward an inner side than an outer peripheral edge of the wafer to be placed, and the movable part includes a wafer supporting portion for film formation that is positioned further toward an outer peripheral side of the wafer to be placed than the wafer supporting portion for transfer and is relatively movable with respect to the wafer supporting table in a standing direction of the wafer supporting portion for transfer.

公开(公告)号：US20190169742A1

公开(公告)日：2019-06-06

申请号：US16314084

申请日：2017-06-12

Applicant: SHOWA DENKO K.K.

Inventor： Naoto ISHIBASHI ,  Keisuke FUKADA ,  Tomoya UTASHIRO ,  Akira BANDO

IPC: C23C16/455 ,  C23C16/32 ,  C30B29/36 ,  C30B25/14 ,  H01L21/02

Abstract: This gas piping system is a run-vent mode gas piping system in which, the gas piping system including a plurality of supply lines through which plural gases are fed individually, an exhaust line that leads from a reactor to an exhaust pump, a run line having one or plural pipes which respectively branch from the plural supply lines, plural vent lines which respectively branch from the supply lines and are connected to the exhaust line, and plural valves which are respectively provided at the branch points of the plural supply lines, and switches between feeding a gas to the run line side and feeding a gas to the vent line side, wherein the plural vent lines are separated from each other until the vent lines reach the exhaust line, and the inner diameter of the exhaust line is greater than the inner diameter of the plural vent lines.