Coated article
    1.
    发明授权

    公开(公告)号:US10731247B2

    公开(公告)日:2020-08-04

    申请号:US15683399

    申请日:2017-08-22

    Applicant: SILCOTEK CORP.

    Abstract: The present invention relates to a coated article. The coated article includes a first layer, a second layer, and a diffusion region between the first layer and the second layer. The first layer has a first atomic concentration of C, a first atomic concentration of Si, and a first atomic concentration of O. The second layer has a first atomic concentration of Fe, a first atomic concentration of Cr, and a first atomic concentration of Ni. The diffusion region has a second atomic concentration of the C, a second atomic concentration of the Si, a second atomic concentration of the O, a second atomic concentration of the Fe, a second atomic concentration of the Cr, and a second atomic concentration of the Ni. All of the atomic concentrations are based upon Auger Electron Spectroscopy.

    Silicon-nitride-containing thermal chemical vapor deposition coating

    公开(公告)号:US10087521B2

    公开(公告)日:2018-10-02

    申请号:US14970015

    申请日:2015-12-15

    Applicant: SILCOTEK CORP.

    Abstract: Surfaces, articles, and processes having silicon-nitride-containing thermal chemical vapor deposition coating are disclosed. A process includes producing a silicon-nitride-containing thermal chemical vapor deposition coating on a surface within a chamber. Flow into and from the chamber is restricted or halted during the producing of the silicon-nitride-containing thermal chemical vapor deposition coating on the surface. A surface includes a silicon-nitride-containing thermal chemical vapor deposition coating. The surface has at least a concealed portion that is obstructed from view. An article includes a silicon-nitride-containing thermal chemical vapor deposition coating on a surface within a chamber. The surface has at least a concealed portion that is obstructed from view.

    Thermal chemical vapor deposition process and coated article

    公开(公告)号:US10323321B1

    公开(公告)日:2019-06-18

    申请号:US14990889

    申请日:2016-01-08

    Applicant: SILCOTEK CORP.

    Abstract: Thermal chemical vapor deposition processes and coated articles are disclosed. The coated article includes a surface having a surface impurity and a coating on the surface formed by thermally reacting a gas. In comparison to a comparable coating without the surface impurity, the coating on the surface has substantially the same level of adhesion, corrosion resistance over 24 hours in 6M HCl, corrosion resistance over 72 hours in NaClO, and electrochemical impedance spectroscopy results. Additionally or alternatively, the surface impurity has properties that reduce or eliminate adhesion of a comparative coating produced by decomposition of silane on a comparative surface following exposure of the surface to a temperature.

    Semiconductor fabrication process
    6.
    发明授权
    Semiconductor fabrication process 有权
    半导体制造工艺

    公开(公告)号:US09340880B2

    公开(公告)日:2016-05-17

    申请号:US14464748

    申请日:2014-08-21

    Applicant: SILCOTEK CORP.

    CPC classification number: C23C16/56 B05D1/60 C09D7/00 C23C16/22

    Abstract: Semiconductor fabrication processes are described. An embodiment of the semiconductor fabrication process includes providing a layer formed by decomposition of dimethylsilane through chemical vapor deposition, the layer being applied by a fluid material, and then positioning the layer in a system for producing a semiconductor product. Additionally or alternatively, the semiconductor product is produced and/or the layer is on a substrate.

    Abstract translation: 描述半导体制造工艺。 半导体制造工艺的一个实施例包括通过化学气相沉积提供由二甲基硅烷分解形成的层,该层由流体材料施加,然后将该层定位在用于制造半导体产品的系统中。 另外或替代地,制造半导体产品和/或该层在基底上。

    Chemical vapor deposition process and coated article

    公开(公告)号:US11261524B2

    公开(公告)日:2022-03-01

    申请号:US16379236

    申请日:2019-04-09

    Applicant: SILCOTEK CORP.

    Abstract: Chemical vapor deposition processes and coated articles are disclosed. The process includes a first introducing of a first amount of silane to the enclosed chamber, the first amount of the silane remaining within the enclosed chamber for a first period of time, a first decomposing of the first amount of the silane during at least a portion of the first period of time, a second introducing of a second amount of the silane to the enclosed chamber, the second amount of the silane remaining within the enclosed chamber for a second period of time, and a second decomposing of the second amount of the silane during at least a portion of the second period of time. The process is devoid of inert gas purging between the first decomposing and the second introducing and/or produces a chemical vapor deposition coating devoid of hydrogen bubbles.

    Silicon-nitride-containing thermal chemical vapor deposition coating

    公开(公告)号:US10851455B2

    公开(公告)日:2020-12-01

    申请号:US16121994

    申请日:2018-09-05

    Applicant: SILCOTEK CORP.

    Abstract: Surfaces, articles, and processes having silicon-nitride-containing thermal chemical vapor deposition coating are disclosed. A process includes producing a silicon-nitride-containing thermal chemical vapor deposition coating on a surface within a chamber. Flow into and from the chamber is restricted or halted during the producing of the silicon-nitride-containing thermal chemical vapor deposition coating on the surface. A surface includes a silicon-nitride-containing thermal chemical vapor deposition coating. The surface has at least a concealed portion that is obstructed from view. An article includes a silicon-nitride-containing thermal chemical vapor deposition coating on a surface within a chamber. The surface has at least a concealed portion that is obstructed from view.

    Chemical vapor deposition process and coated article

    公开(公告)号:US09915001B2

    公开(公告)日:2018-03-13

    申请号:US14821949

    申请日:2015-08-10

    Applicant: SILCOTEK CORP.

    CPC classification number: C23C16/52 C23C16/22 C23C16/30 C23C16/46 C23C16/56

    Abstract: A chemical vapor deposition process and coated article are disclosed. The chemical vapor deposition process includes positioning an article in a chemical vapor deposition chamber, then introducing a deposition gas to the chemical vapor deposition chamber at a sub-decomposition temperature that is below the thermal decomposition temperature of the deposition gas, and then heating the chamber to a super-decomposition temperature that is equal to or above the thermal decomposition temperature of the deposition gas resulting in a deposited coating on at least a surface of the article from the introducing of the deposition gas. The chemical vapor deposition process remains within a pressure range of 0.01 psia and 200 psia and/or the deposition gas is dimethylsilane. The coated article includes a substrate subject to corrosion and a deposited coating on the substrate, the deposited coating having silicon, and corrosion resistance.

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