公开(公告)号：US20140352889A1

公开(公告)日：2014-12-04

申请号：US14285730

申请日：2014-05-23

Applicant: SPTS TECHNOLOGIES LIMITED

Inventor： OLIVER ANSELL ,  BRIAN KIERNAN ,  TOBY JEFFERY ,  MAXIME VARVARA

IPC: H01L21/02

CPC classification number: H01L21/02019 ,  H01J37/32357 ,  H01J37/32449 ,  H01J37/32633 ,  H01J37/32862

Abstract: An apparatus for processing a semiconductor workpiece includes a first chamber having a first plasma production source and a first gas supply for introducing a supply of gas into the first chamber, a second chamber having a second plasma production source and a second gas supply for introducing a supply of gas into the second chamber, a workpiece support positioned in the second chamber, and a plurality of gas flow pathway defining elements for defining a gas flow pathway in the vicinity of the workpiece when positioned on the workpiece support. The gas flow path defining elements include at least one wafer edge region protection element for protecting the edge of the wafer and/or a region outwardly circumjacent to the edge of the wafer, and at least one auxiliary element spaced apart from the wafer edge region protection element to define the gas flow pathway.

Abstract translation: 一种用于处理半导体工件的设备包括具有第一等离子体生产源和用于将气体供应引入第一室的第一气体供应的第一室，具有第二等离子体生产源和第二气体供应源的第二室， 将气体供应到第二室中，位于第二室中的工件支撑件以及多个气体流动通道限定了用于在定位在工件支撑件上时在工件附近限定气体流动通道的元件。 气流通道限定元件包括至少一个晶片边缘区域保护元件，用于保护晶片的边缘和/或向外周向于晶片的边缘的区域，以及至少一个与晶片边缘区域保护隔开的辅助元件 元素来定义气体流动路径。

公开(公告)号：US20160126129A1

公开(公告)日：2016-05-05

申请号：US14925715

申请日：2015-10-28

Applicant: SPTS TECHNOLOGIES LIMITED

Inventor： ANTHONY BARKER ,  HUMA ASHRAF ,  BRIAN KIERNAN

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/3065 ,  H01J37/32

CPC classification number: H01L21/68728 ,  H01J37/32082 ,  H01L21/3065 ,  H01L21/67069 ,  H01L21/68721

Abstract: A clamp assembly is for clamping an outer peripheral portion of a substrate to a support in a plasma processing chamber. An RF bias power is applied to the support during the plasma processing of the substrate. The clamp assembly includes an outer clamp member, and an inner clamp member which is received by the outer clamp member, the inner clamp member defining an aperture which exposes the substrate to the plasma processing. The outer clamp member has an inner portion terminating in an inner edge, wherein the inner portion is spaced apart from the inner clamp member.

Abstract translation: 夹具组件用于将衬底的外周部分夹持到等离子体处理室中的支撑件上。 在衬底的等离子体处理期间将RF偏置功率施加到支撑件。 夹紧组件包括外部夹紧构件和内部夹紧构件，其由外部夹紧构件接收，内部夹具构件限定将衬底暴露于等离子体处理的孔。 外部夹紧构件具有终止于内部边缘的内部部分，其中内部部分与内部夹紧构件间隔开。