公开(公告)号：US20040200062A1

公开(公告)日：2004-10-14

申请号：US10835419

申请日：2004-04-29

Applicant: STMicroelectronics, Inc.

Inventor： Harry M. Siegel ,  Anthony M. Chiu

IPC: H01L021/44

CPC classification number: H01L21/568 ,  H01L21/566 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/85444 ,  H01L2224/8547 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49172 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A method for providing a leadframeless package structure is provided. The method includes providing a temporary carrier. The temporary carrier is coupled to a metal foil layer with a temporary adhesive layer. An integrated circuit chip is coupled to the metal foil layer. The temporary adhesive layer and the temporary carrier are removed to form the leadframeless package structure after molding.

Abstract translation: 提供了一种提供无引线封装结构的方法。 该方法包括提供临时载体。 临时载体与临时粘合剂层耦合到金属箔层。 集成电路芯片耦合到金属箔层。 在模制之后，移除临时粘合剂层和临时载体以形成无引线包装结构。

公开(公告)号：US20040017668A1

公开(公告)日：2004-01-29

申请号：US10205692

申请日：2002-07-26

Applicant: STMicroelectronics, Inc.

Inventor： Harry M. Siegel ,  Anthony M. Chiu

IPC: H05K003/02 ,  H05K007/02 ,  H02G003/00

CPC classification number: H01L21/568 ,  H01L21/566 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/85444 ,  H01L2224/8547 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49172 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A method for providing a leadframeless package structure is provided. The method includes providing a temporary carrier. The temporary carrier is coupled to a metal foil layer with a temporary adhesive layer. An integrated circuit chip is coupled to the metal foil layer. The temporary adhesive layer and the temporary carrier are removed to form the leadframeless package structure after molding.

公开(公告)号：US20040017002A1

公开(公告)日：2004-01-29

申请号：US10206641

申请日：2002-07-26

Applicant: STMicroelectronics, Inc.

Inventor： Harry M. Siegel ,  Anthony M. Chiu

IPC: H01L023/06

CPC classification number: G06K9/0002 ,  H01L21/565 ,  H01L23/3107 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/48 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/85051 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An integrated circuit (IC) device comprising: 1) an integrated circuit (IC) die having a first surface, a second surface opposite the first surface, and sidewalls extending between the first surface and the second surface; and 2) an integrated circuit (IC) package for supporting the IC die, wherein the IC package is attached to at least one of the sidewalls of the IC die such that at least a portion of the IC die first surface and at least a portion of the IC die second surface are exposed.

Abstract translation: 1.一种集成电路（IC）装置，包括：1）具有第一表面，与第一表面相对的第二表面和在第一表面和第二表面之间延伸的侧壁的集成电路（IC）模具; 以及2）用于支撑所述IC芯片的集成电路（IC）封装，其中所述IC封装被附接到所述IC管芯的至少一个侧壁，使得所述IC的至少一部分裸片的第一表面和至少一部分 的IC芯片第二表面露出。