Read only memory
    5.
    发明授权

    公开(公告)号:US12063775B2

    公开(公告)日:2024-08-13

    申请号:US18484906

    申请日:2023-10-11

    IPC分类号: H10B20/00 H01L23/00 G11C16/04

    摘要: The present description concerns a ROM including at least one first rewritable memory cell. In an embodiment, a method of manufacturing a read-only memory (ROM) comprising a plurality of memory cells is proposed. Each of the plurality of memory cells includes a rewritable first transistor and a rewritable second transistor. An insulated gate of the rewritable first transistor is connected to an insulated gate of the rewritable second transistor. The method includes successively depositing, on a semiconductor structure, a first insulating layer and a first gate layer, wherein the first insulating layer is arranged between the semiconductor structure and the first gate layer, wherein the rewritable second transistor further includes a well-formed between an associated first insulating layer and the semiconductor structure, and wherein the rewritable first insulating layer is in direct contact with the semiconductor structure; and successively depositing a second insulating layer and a second gate layer.

    READ ONLY MEMORY
    6.
    发明公开
    READ ONLY MEMORY 审中-公开

    公开(公告)号:US20240040781A1

    公开(公告)日:2024-02-01

    申请号:US18484906

    申请日:2023-10-11

    IPC分类号: H10B20/00

    CPC分类号: H10B20/367 H01L23/57

    摘要: The present description concerns a ROM including at least one first rewritable memory cell. In an embodiment, a method of manufacturing a read-only memory (ROM) comprising a plurality of memory cells is proposed. Each of the plurality of memory cells includes a rewritable first transistor and a rewritable second transistor. An insulated gate of the rewritable first transistor is connected to an insulated gate of the rewritable second transistor. The method includes successively depositing, on a semiconductor structure, a first insulating layer and a first gate layer, wherein the first insulating layer is arranged between the semiconductor structure and the first gate layer, wherein the rewritable second transistor further includes a well-formed between an associated first insulating layer and the semiconductor structure, and wherein the rewritable first insulating layer is in direct contact with the semiconductor structure; and successively depositing a second insulating layer and a second gate layer.