公开(公告)号：US08847340B2

公开(公告)日：2014-09-30

申请号：US13907077

申请日：2013-05-31

Applicant: STMicroelectronics S.r.I.

Inventor： Lorenzo Baldo ,  Chantal Combi ,  Mario Francesco Cortese

IPC: H01L29/84 ,  G01L19/14 ,  B81B7/00

CPC classification number: B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C2203/0154 ,  G01L19/141 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaves the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.

Abstract translation: 包括设置有至少一个通过开口的基板的电子设备，具有差分传感器的MEMS装置，其具有第一和第二表面，所述第一和第二表面具有至少一部分，其对于与第一和第二表面相对应地存在的流体的化学和/或物理变化敏感; 其第二相对的有效表面。 MEMS器件的第一表面离开暴露的第一有源表面，并且第二表面设置有暴露所述第二相对有效表面的另一开口，该电子器件的特征在于，MEMS器件的第一表面面向衬底，并且是 与其隔开预定距离，敏感部分与衬底的通过开口对准，并且其还包括至少部分地结合MEMS器件和衬底的保护封装。

公开(公告)号：US20140299949A1

公开(公告)日：2014-10-09

申请号：US14312307

申请日：2014-06-23

Applicant: STMicroelectronics S.r.I.

Inventor： Sebastiano Conti ,  Benedetto Vigna ,  Mario Francesco Cortese

IPC: H04R19/00 ,  H04R19/04

CPC classification number: B81C1/00158 ,  B81B3/0018 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R1/06 ,  H04R1/086 ,  H04R1/2838 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H01L2224/48471 ,  H01L2224/4554 ,  H01L2924/00012

Abstract: A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.

Abstract translation: 微机电声换能器组件具有：集成具有膜的MEMS感测结构的第一模具，其具有与前室相反流体连通的第一表面和与第一表面相对的第二表面，其与背面流体连通 微机电声换能器的腔室能够经受作为入射声压波函数的变形，并且面向刚性电极以形成可变电容电容器; 集成了可操作地耦合到MEMS感测结构并且提供作为电容变化的函数的电输出信号的电子阅读电路; 以及包装体，其容纳所述第一模具和所述第二模具，并且具有带有外部电触点的基底基板。 第一和第二骰子堆叠在包装中并机械和电气直接连接在一起; 该包装限定前室和后室中的至少一个。

公开(公告)号：US20130221457A1

公开(公告)日：2013-08-29

申请号：US13861324

申请日：2013-04-11

Applicant: STMicroelectronics S.r.I.

Inventor： Sebastiano Conti ,  Benedetto Vigna ,  Mario Francesco Cortese

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81C1/00158 ,  B81B3/0018 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R1/06 ,  H04R1/086 ,  H04R1/2838 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H01L2224/48471 ,  H01L2224/4554 ,  H01L2924/00012

Abstract: A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.

Abstract translation: 微机电声换能器组件具有：集成具有膜的MEMS感测结构的第一模具，其具有与前室相反流体连通的第一表面和与第一表面相对的第二表面，与第一表面流体连通， 微机电声换能器的腔室能够经受作为入射声压波函数的变形，并且面向刚性电极以形成可变电容电容器; 集成了可操作地耦合到MEMS感测结构并且提供作为电容变化的函数的电输出信号的电子阅读电路; 以及包装体，其容纳所述第一模具和所述第二模具，并且具有带有外部电触点的基底基板。 第一和第二骰子堆叠在包装中并机械和电气直接连接在一起; 该包装限定前室和后室中的至少一个。