公开(公告)号：US20130294622A1

公开(公告)日：2013-11-07

申请号：US13936104

申请日：2013-07-05

Applicant: STMicroelectronics S.r.I. ,  Omron Corporation

Inventor： Takashi Kasai ,  Shobu Sato ,  Yuki Uchida ,  Igino Padovani ,  Filippo David ,  Sebastiano Conti

IPC: H04R3/00

CPC classification number: H04R19/04 ,  B81B3/0021 ,  H04R1/023 ,  H04R1/086 ,  H04R3/00 ,  H04R3/005 ,  H04R19/005 ,  H04R19/016 ,  H04R31/00 ,  H04R2201/003 ,  H04R2499/11

Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.

Abstract translation: 提供一种声换能器，包括：半导体基板; 设置在所述半导体基板上方的包括振动电极的振动膜; 以及设置在所述半导体衬底上方的固定膜，包括固定电极，所述声换能器根据所述振动电极和所述固定电极之间的电容的变化来检测声波，将所述声波转换为电信号，并输出所述电信号。 振动电极和固定电极中的至少一个分为多个分割电极，多个分割电极输出电信号。

公开(公告)号：US20140299949A1

公开(公告)日：2014-10-09

申请号：US14312307

申请日：2014-06-23

Applicant: STMicroelectronics S.r.I.

Inventor： Sebastiano Conti ,  Benedetto Vigna ,  Mario Francesco Cortese

IPC: H04R19/00 ,  H04R19/04

CPC classification number: B81C1/00158 ,  B81B3/0018 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R1/06 ,  H04R1/086 ,  H04R1/2838 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H01L2224/48471 ,  H01L2224/4554 ,  H01L2924/00012

Abstract: A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.

Abstract translation: 微机电声换能器组件具有：集成具有膜的MEMS感测结构的第一模具，其具有与前室相反流体连通的第一表面和与第一表面相对的第二表面，其与背面流体连通 微机电声换能器的腔室能够经受作为入射声压波函数的变形，并且面向刚性电极以形成可变电容电容器; 集成了可操作地耦合到MEMS感测结构并且提供作为电容变化的函数的电输出信号的电子阅读电路; 以及包装体，其容纳所述第一模具和所述第二模具，并且具有带有外部电触点的基底基板。 第一和第二骰子堆叠在包装中并机械和电气直接连接在一起; 该包装限定前室和后室中的至少一个。

公开(公告)号：US20130221457A1

公开(公告)日：2013-08-29

申请号：US13861324

申请日：2013-04-11

Applicant: STMicroelectronics S.r.I.

Inventor： Sebastiano Conti ,  Benedetto Vigna ,  Mario Francesco Cortese

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81C1/00158 ,  B81B3/0018 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R1/06 ,  H04R1/086 ,  H04R1/2838 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H01L2224/48471 ,  H01L2224/4554 ,  H01L2924/00012

Abstract: A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.

Abstract translation: 微机电声换能器组件具有：集成具有膜的MEMS感测结构的第一模具，其具有与前室相反流体连通的第一表面和与第一表面相对的第二表面，与第一表面流体连通， 微机电声换能器的腔室能够经受作为入射声压波函数的变形，并且面向刚性电极以形成可变电容电容器; 集成了可操作地耦合到MEMS感测结构并且提供作为电容变化的函数的电输出信号的电子阅读电路; 以及包装体，其容纳所述第一模具和所述第二模具，并且具有带有外部电触点的基底基板。 第一和第二骰子堆叠在包装中并机械和电气直接连接在一起; 该包装限定前室和后室中的至少一个。

公开(公告)号：US20140010374A1

公开(公告)日：2014-01-09

申请号：US13936110

申请日：2013-07-05

Applicant: STMicroelectronics S.r.I. ,  Omron Corporation

Inventor： Takashi Kasai ,  Shobu Sato ,  Yuki Uchida ,  Igino Padovani ,  Filippo David ,  Sebastiano Conti ,  Martino Zerbini ,  Luca Molinari

IPC: H04R3/00

CPC classification number: H04R3/00 ,  H01L2224/48137 ,  H01L2924/16152 ,  H04R1/086 ,  H04R19/005 ,  H04R19/016 ,  H04R31/00

Abstract: The present disclosure is directed to an acoustic transducer configured to detect a sound wave according to changes in capacitances between a vibrating electrode and a fixed electrode. At least one of the vibrating electrode and the fixed electrode being divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting electrical signals. The disclosure includes a digital interface circuit coupled to the divided electrodes. The circuit includes a recombination stage, which supplies a mixed signal by combining the first digital processed signal and the second digital processed signal with a respective weight that is a function of a first level value of the first processed signal. An output stage is included, which supplies, selectively and alternatively, a first processed signal, a second processed signal, or a mixed signal.

Abstract translation: 本公开涉及一种被配置为根据振动电极和固定电极之间的电容的变化来检测声波的声学换能器。 振动电极和固定电极中的至少一个分为多个分割电极，多个分割电极输出电信号。 本公开包括耦合到分割电极的数字接口电路。 电路包括复合级，其通过将第一数字处理信号和第二数字处理信号组合为具有作为第一处理信号的第一电平值的函数的相应权重来提供混合信号。 包括输出级，其选择性地或替代地提供第一处理信号，第二处理信号或混合信号。

公开(公告)号：US20140314254A1

公开(公告)日：2014-10-23

申请号：US14254511

申请日：2014-04-16

Applicant: STMicroelectronics S.r.I.

Inventor： Sebastiano Conti ,  Marco Salina ,  Luca Lamagna ,  Matteo Perletti

IPC: H04R23/00 ,  H04R31/00

CPC classification number: H04R23/00 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  Y10T29/49005

Abstract: A micromechanical structure for a MEMS capacitive acoustic transducer, has: a substrate made of semiconductor material, having a front surface lying in a horizontal plane; a membrane, coupled to the substrate and designed to undergo deformation in the presence of incident acoustic-pressure waves; a fixed electrode, which is rigid with respect to the acoustic-pressure waves and is coupled to the substrate by means of an anchorage structure, in a suspended position facing the membrane to form a detection capacitor. The anchorage structure has at least one pillar element, which is at least in part distinct from the fixed electrode and supports the fixed electrode in a position parallel to the horizontal plane.

Abstract translation: 一种用于MEMS电容式声换能器的微机械结构，具有：由半导体材料制成的基板，其前表面位于水平面; 膜，其耦合到基底并设计成在存在入射声压波的情况下经历变形; 固定电极，其相对于声压波是刚性的，并且通过锚定结构耦合到衬底，处于面向膜的悬挂位置以形成检测电容器。 锚固结构具有至少一个柱元件，其至少部分地不同于固定电极，并且将固定电极支撑在平行于水平面的位置。