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公开(公告)号：US09237644B2
公开(公告)日：2016-01-12
申请号：US14225625
申请日：2014-03-26
Applicant: STMicroelectronics S.r.l.
CPC classification number: H05K1/0204 , B23K1/0016 , B23K1/085 , B23K35/025 , H01L23/3677 , H01L2224/13 , H01L2924/13091 , H05K1/181 , H05K13/0465 , H05K2201/066 , H01L2924/00
Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink.
Abstract translation: 电子设备附接到包括通孔的板的第一表面。 用于电子设备的散热器前体附着到电子板的第二表面。 散热器前体包括面向通孔的空腔。 将一波焊膏施加到第二表面。 焊膏渗透到散热器前体的空腔中并通过毛细作用流过通孔，以将电子器件的散热器和/或电子接触焊接到通孔。 焊膏进一步保留在空腔中以形成相应的散热器。
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公开(公告)号：US20140301042A1
公开(公告)日：2014-10-09
申请号：US14225625
申请日：2014-03-26
Applicant: STMicroelectronics S.r.l.
CPC classification number: H05K1/0204 , B23K1/0016 , B23K1/085 , B23K35/025 , H01L23/3677 , H01L2224/13 , H01L2924/13091 , H05K1/181 , H05K13/0465 , H05K2201/066 , H01L2924/00
Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink.
Abstract translation: 电子设备附接到包括通孔的板的第一表面。 用于电子设备的散热器前体附着到电子板的第二表面。 散热器前体包括面向通孔的空腔。 将一波焊膏施加到第二表面。 焊膏渗透到散热器前体的空腔中并通过毛细作用流过通孔，以将电子器件的散热器和/或电子接触焊接到通孔。 焊膏进一步保留在空腔中以形成相应的散热器。
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公开(公告)号：US09615444B2
公开(公告)日：2017-04-04
申请号：US14951085
申请日：2015-11-24
Applicant: STMicroelectronics S.r.l.
CPC classification number: H05K1/0204 , B23K1/0016 , B23K1/085 , B23K35/025 , H01L23/3677 , H01L2224/13 , H01L2924/13091 , H05K1/181 , H05K13/0465 , H05K2201/066 , H01L2924/00
Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder is applied to the second surface. The solder penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to join a thermal radiator and/or electronic contact of the electronic device to the vias. The solder further remains in the cavity to form a corresponding heat sink.
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公开(公告)号：US20160081179A1
公开(公告)日：2016-03-17
申请号：US14951085
申请日：2015-11-24
Applicant: STMicroelectronics S.r.l.
CPC classification number: H05K1/0204 , B23K1/0016 , B23K1/085 , B23K35/025 , H01L23/3677 , H01L2224/13 , H01L2924/13091 , H05K1/181 , H05K13/0465 , H05K2201/066 , H01L2924/00
Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink.
Abstract translation: 电子设备附接到包括通孔的板的第一表面。 用于电子设备的散热器前体附着到电子板的第二表面。 散热器前体包括面向通孔的空腔。 将一波焊膏施加到第二表面。 焊膏渗透到散热器前体的空腔中并通过毛细作用流过通孔，以将电子器件的散热器和/或电子接触焊接到通孔。 焊膏进一步保留在空腔中以形成相应的散热器。
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