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公开(公告)号：US20130083489A1
公开(公告)日：2013-04-04
申请号：US13626322
申请日：2012-09-25
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Matteo Sebastiano Dimauro , Sebastiano Russo , Rosalba Cacciola , Cristiano Gianluca Stella
CPC classification number: H05K1/111 , H05K3/3431 , H05K2201/0373 , H05K2201/09663 , H05K2201/10166 , H05K2201/10969 , H05K2203/1178 , Y02P70/611 , Y02P70/613 , Y10T29/49149
Abstract: An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic system further includes at least one conducting contact element at least partially exposed on the coupling surface. Each conducting contact element has a soldering surface supporting reflow soldering of the conducting contact element with a corresponding further contact element of the further electronic system. In addition, each conducting contact element has at least one lateral surface protruding from the insulating structural element. The soldering surface of the conducting contact element includes at least one channel having an opened end at the protruding lateral surface, the channel configured to facilitate dispersion of waste gas produced during reflow soldering.
Abstract translation: 电子系统包括绝缘结构元件，其具有被配置为将电子系统与至少一个另外的电子系统耦合的耦合表面。 电子系统还包括至少一个至少部分地暴露在耦合表面上的导电接触元件。 每个导电接触元件具有支撑导电接触元件的回流焊接的焊接表面与另外的电子系统的相应的另外的接触元件。 此外，每个导电接触元件具有从绝缘结构元件突出的至少一个侧表面。 导电接触元件的焊接表面包括在突出侧表面具有开口端的至少一个通道，该通道构造成便于在回流焊接期间产生的废气的分散。
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公开(公告)号：US09237644B2
公开(公告)日：2016-01-12
申请号：US14225625
申请日：2014-03-26
Applicant: STMicroelectronics S.r.l.
CPC classification number: H05K1/0204 , B23K1/0016 , B23K1/085 , B23K35/025 , H01L23/3677 , H01L2224/13 , H01L2924/13091 , H05K1/181 , H05K13/0465 , H05K2201/066 , H01L2924/00
Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink.
Abstract translation: 电子设备附接到包括通孔的板的第一表面。 用于电子设备的散热器前体附着到电子板的第二表面。 散热器前体包括面向通孔的空腔。 将一波焊膏施加到第二表面。 焊膏渗透到散热器前体的空腔中并通过毛细作用流过通孔，以将电子器件的散热器和/或电子接触焊接到通孔。 焊膏进一步保留在空腔中以形成相应的散热器。
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公开(公告)号：US20140301042A1
公开(公告)日：2014-10-09
申请号：US14225625
申请日：2014-03-26
Applicant: STMicroelectronics S.r.l.
CPC classification number: H05K1/0204 , B23K1/0016 , B23K1/085 , B23K35/025 , H01L23/3677 , H01L2224/13 , H01L2924/13091 , H05K1/181 , H05K13/0465 , H05K2201/066 , H01L2924/00
Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink.
Abstract translation: 电子设备附接到包括通孔的板的第一表面。 用于电子设备的散热器前体附着到电子板的第二表面。 散热器前体包括面向通孔的空腔。 将一波焊膏施加到第二表面。 焊膏渗透到散热器前体的空腔中并通过毛细作用流过通孔，以将电子器件的散热器和/或电子接触焊接到通孔。 焊膏进一步保留在空腔中以形成相应的散热器。
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Patent Agency Ranking
公开(公告)号：US09013878B2
公开(公告)日：2015-04-21
申请号：US13626322
申请日：2012-09-25
Applicant: STMicroelectronics S.r.l.
Inventor： Matteo Sebastiano Dimauro , Sebastiano Russo , Rosalba Cacciola , Cristiano Gianluca Stella
CPC classification number: H05K1/111 , H05K3/3431 , H05K2201/0373 , H05K2201/09663 , H05K2201/10166 , H05K2201/10969 , H05K2203/1178 , Y02P70/611 , Y02P70/613 , Y10T29/49149
Abstract: An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic system further includes at least one conducting contact element at least partially exposed on the coupling surface. Each conducting contact element has a soldering surface supporting reflow soldering of the conducting contact element with a corresponding further contact element of the further electronic system. In addition, each conducting contact element has at least one lateral surface protruding from the insulating structural element. The soldering surface of the conducting contact element includes at least one channel having an opened end at the protruding lateral surface, the channel configured to facilitate dispersion of waste gas produced during reflow soldering.
Abstract translation: 电子系统包括绝缘结构元件，其具有被配置为将电子系统与至少一个另外的电子系统耦合的耦合表面。 电子系统还包括至少一个至少部分地暴露在耦合表面上的导电接触元件。 每个导电接触元件具有支撑导电接触元件的回流焊接的焊接表面与另外的电子系统的相应的另外的接触元件。 此外，每个导电接触元件具有从绝缘结构元件突出的至少一个侧表面。 导电接触元件的焊接表面包括在突出侧表面具有开口端的至少一个通道，该通道构造成便于在回流焊接期间产生的废气的分散。
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公开(公告)号：US20130083490A1
公开(公告)日：2013-04-04
申请号：US13626229
申请日：2012-09-25
Applicant: STMicroelectronics S.r.l.
Inventor： Cristiano Gianluca Stella , Rosalba Cacciola
CPC classification number: H05K3/3468 , H01L2224/73203 , H01L2924/13091 , H05K1/111 , H05K3/305 , H05K2201/09381 , H05K2201/09472 , H05K2201/09745 , H05K2203/044 , H01L2924/00012 , H01L2924/00
Abstract: An electronic board includes conducting traces having an upper surface at least partially sunken with respect to a gluing surface of the board. A surface mount technology electronic device for mounting to the board includes insulating windows that define gluing sites within one or more pins. An electronic system is formed by one or more of such surface mount technology electronic devices mounted to electronic board. The devices are attached using a wave soldering technique that flows through channels formed by the sunken conductive traces.
Abstract translation: 电子板包括具有相对于板的胶合表面至少部分凹陷的上表面的导电迹线。 用于安装到板上的表面贴装技术电子器件包括限定一个或多个引脚内的胶合位置的绝缘窗。 电子系统由安装到电子板的一种或多种这样的表面贴装技术电子装置形成。 这些装置使用波峰焊技术连接，该技术流过由凹陷的导电迹线形成的通道。
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公开(公告)号：US09615444B2
公开(公告)日：2017-04-04
申请号：US14951085
申请日：2015-11-24
Applicant: STMicroelectronics S.r.l.
CPC classification number: H05K1/0204 , B23K1/0016 , B23K1/085 , B23K35/025 , H01L23/3677 , H01L2224/13 , H01L2924/13091 , H05K1/181 , H05K13/0465 , H05K2201/066 , H01L2924/00
Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder is applied to the second surface. The solder penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to join a thermal radiator and/or electronic contact of the electronic device to the vias. The solder further remains in the cavity to form a corresponding heat sink.
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公开(公告)号：US20160081179A1
公开(公告)日：2016-03-17
申请号：US14951085
申请日：2015-11-24
Applicant: STMicroelectronics S.r.l.
CPC classification number: H05K1/0204 , B23K1/0016 , B23K1/085 , B23K35/025 , H01L23/3677 , H01L2224/13 , H01L2924/13091 , H05K1/181 , H05K13/0465 , H05K2201/066 , H01L2924/00
Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink.
Abstract translation: 电子设备附接到包括通孔的板的第一表面。 用于电子设备的散热器前体附着到电子板的第二表面。 散热器前体包括面向通孔的空腔。 将一波焊膏施加到第二表面。 焊膏渗透到散热器前体的空腔中并通过毛细作用流过通孔，以将电子器件的散热器和/或电子接触焊接到通孔。 焊膏进一步保留在空腔中以形成相应的散热器。
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公开(公告)号：US09012787B2
公开(公告)日：2015-04-21
申请号：US13626229
申请日：2012-09-25
Applicant: STMicroelectronics S.r.l.
Inventor： Cristiano Gianluca Stella , Rosalba Cacciola
CPC classification number: H05K3/3468 , H01L2224/73203 , H01L2924/13091 , H05K1/111 , H05K3/305 , H05K2201/09381 , H05K2201/09472 , H05K2201/09745 , H05K2203/044 , H01L2924/00012 , H01L2924/00
Abstract: An electronic board includes conducting traces having an upper surface at least partially sunken with respect to a gluing surface of the board. A surface mount technology electronic device for mounting to the board includes insulating windows that define gluing sites within one or more pins. An electronic system is formed by one or more of such surface mount technology electronic devices mounted to electronic board. The devices are attached using a wave soldering technique that flows through channels formed by the sunken conductive traces.
Abstract translation: 电子板包括具有相对于板的胶合表面至少部分凹陷的上表面的导电迹线。 用于安装到板上的表面贴装技术电子器件包括限定一个或多个引脚内的胶合位置的绝缘窗。 电子系统由安装到电子板的一种或多种这样的表面贴装技术电子装置形成。 这些装置使用波峰焊技术连接，该技术流过由凹陷的导电迹线形成的通道。
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