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公开(公告)号：US20240234009A9
公开(公告)日：2024-07-11
申请号：US18535085
申请日：2023-12-11
Applicant: SUMIDA CORPORATION
Inventor： Shinichi SAKAMOTO , Zhigang CHENG , Fernando CHAN MOCK , Mitsugu KAWARAI
CPC classification number: H01F27/2828 , H01F27/24 , H01F27/29 , H01F27/292 , H01F27/30 , H01F41/0206 , H01F41/04 , H01F41/061 , Y10T29/49073
Abstract: An electronic component comprises: a magnetic core having a flat base and a core, the flat base having a top, a bottom, and first and second opposite sides, the core is on the top; a winding having an edgewise coil including a wound flat wire and the core, the winding having two non-wound flat wires extending therefrom; and a magnetic exterior body covering the core and the edgewise coil. The two non-wound flat wires extend along the top, the first side, the bottom and then the second side, and the two non-wound flat wires are non-adhesively positioned around the flat base. The two non-wound flat wires on the bottom are externally exposed electrodes. The second side inclines towards the core. The two ends of the two non-wound flat wires are embedded into the magnetic exterior body to fix the two non-wound flat wires to the magnetic exterior body.
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公开(公告)号：US20140259640A1
公开(公告)日：2014-09-18
申请号：US13804857
申请日：2013-03-14
Applicant: SUMIDA CORPORATION
Inventor： Shinichi SAKAMOTO , Douglas James MALCOLM
IPC: H01F41/06
CPC classification number: H01F41/064 , H01F17/04 , H01F27/022 , H01F27/24 , H01F27/255 , H01F27/2828 , H01F27/29 , H01F41/0246 , H01F2017/048 , Y10T29/4902 , Y10T29/49071
Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.
Abstract translation: 一种用于制造用于避免电磁干扰的电子部件的方法包括：（a）将T形芯和空芯线圈放置在金属模具中; （b）将复合磁性材料和树脂的混合物注入到金属模具中，使得T型芯和空芯线圈被混合物嵌入; （c）在第一温度下加热混合物; （d）调整外形同时去除过量的混合物; 和（e）硬化混合物。 该方法还可以包括抛光硬化混合物的外部的过程。 该方法可以进一步包括向混合物施加0.1至20.0kg / cm2的压力以在硬化过程之前通过冲压机的活动冲头调节混合物的外形的工艺。
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公开(公告)号：US20230253151A1
公开(公告)日：2023-08-10
申请号：US18301604
申请日：2023-04-17
Applicant: SUMIDA CORPORATION
Inventor： Shinichi SAKAMOTO , Douglas James MALCOLM
IPC: H01F41/064 , H01F17/04 , H01F27/29 , H01F27/255 , H01F41/02 , H01F27/02 , H01F27/24 , H01F27/28
CPC classification number: H01F41/064 , H01F17/04 , H01F27/29 , H01F27/255 , H01F41/0246 , H01F27/022 , H01F27/24 , H01F27/2828 , H01F41/02 , Y10T29/4902 , Y10T29/49071 , H01F2017/048
Abstract: An inductor includes an air-core coil assembled with a T-shaped core and a composite magnetic material and resin mixture embedding the T-shaped core and the air-core coil. The air-core coil has: a coil member having a coil axis and first and second sides opposite to each other; and first and second leads that are integrally connected to the coil member. The first and second leads respectively have: first and second bent members at the first side; first and second ends at the second side; and first and second bottom extensions respectively connected between the first and second bent members and the first and second ends. The first and second bent members extend in a first direction parallel to the coil axis, the first and second ends extend in a second direction parallel to the coil axis, and the first and second bottom extensions extend perpendicular to the coil axis.
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公开(公告)号：US20200373086A1
公开(公告)日：2020-11-26
申请号：US16991131
申请日：2020-08-12
Applicant: SUMIDA CORPORATION
Inventor： Shinichi SAKAMOTO , Douglas James MALCOLM
IPC: H01F41/064 , H01F17/04 , H01F27/29 , H01F27/255 , H01F41/02 , H01F27/02 , H01F27/24 , H01F27/28
Abstract: A method for manufacturing an electronic component is provided. The method includes: placing an air-core coil in a mold; placing a mixture of an Fe—Si—Cr alloy, a thermosetting resin, and a solvent into the mold so as to embed the air-core coil in the mixture; after placing the mixture, applying pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.
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公开(公告)号：US20180033551A1
公开(公告)日：2018-02-01
申请号：US15726616
申请日：2017-10-06
Applicant: SUMIDA CORPORATION
Inventor： Shinichi SAKAMOTO , Douglas James MALCOLM
CPC classification number: H01F41/064 , H01F17/04 , H01F27/022 , H01F27/24 , H01F27/255 , H01F27/2828 , H01F27/29 , H01F41/0246 , H01F2017/048 , Y10T29/4902 , Y10T29/49071
Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.
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Patent Agency Ranking
公开(公告)号：US20220203582A1
公开(公告)日：2022-06-30
申请号：US17699583
申请日：2022-03-21
Applicant: SUMIDA CORPORATION
Inventor： Motomi TAKAHASHI , Tomohiro KAJIYAMA , Teruaki TANAKA , Shinichi SAKAMOTO , Juichi OKI , Mitsugu KAWARAI , Tsutomu OTSUKA
IPC: B29C43/18 , H01F41/00 , B29C43/00 , H01F27/28 , H01F27/29 , H01F17/04 , H01F41/061 , H01F41/076 , H01F41/02 , B22F1/10 , B29C43/52
Abstract: A manufacturing method of a coil component comprising the steps of: preparing a coil assembly body in which a coil is attached on a magnetic core and a mold body which is formed with a cavity portion in the inside thereof and which includes at least one opening portion, putting a viscous admixture including magnetic powders and thermosetting resin and the coil assembly body in the cavity portion, pushing the put-in viscous admixture in the mold body, and thermally-curing the pushed-in viscous admixture and forming a magnetic exterior body which covers the coil assembly body.
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公开(公告)号：US20200368944A1
公开(公告)日：2020-11-26
申请号：US16989192
申请日：2020-08-10
Applicant: SUMIDA CORPORATION
Inventor： Motomi TAKAHASHI , Tomohiro KAJIYAMA , Teruaki TANAKA , Shinichi SAKAMOTO , Juichi OKI , Mitsugu KAWARAI , Tsutomu OTSUKA
IPC: B29C43/18 , H01F41/00 , B22F1/00 , B29C43/00 , H01F27/28 , H01F27/29 , H01F17/04 , H01F41/061 , H01F41/076 , H01F41/02 , B29C43/52
Abstract: A manufacturing method of a coil component comprising the steps of: preparing a coil assembly body in which a coil is attached on a magnetic core and a mold body which is formed with a cavity portion in the inside thereof and which includes at least one opening portion, putting a viscous admixture including magnetic powders and thermosetting resin and the coil assembly body in the cavity portion, pushing the put-in viscous admixture in the mold body, and thermally-curing the pushed-in viscous admixture and forming a magnetic exterior body which covers the coil assembly body.
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公开(公告)号：US20200098515A1
公开(公告)日：2020-03-26
申请号：US16698609
申请日：2019-11-27
Applicant: SUMIDA CORPORATION
Inventor： Shinichi SAKAMOTO , Douglas James MALCOLM
IPC: H01F41/064 , H01F17/04 , H01F27/29 , H01F27/255 , H01F41/02 , H01F27/02 , H01F27/24 , H01F27/28
Abstract: A method for manufacturing an electronic component is provided. The method includes: placing an air-core coil in a mold; placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the air-core coil in the mixture; after placing the mixture, applying a pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened, wherein a viscosity of the mixture is 1,000 to 1,000,000 mPa·s at room temperature.
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公开(公告)号：US20170084381A1
公开(公告)日：2017-03-23
申请号：US15364749
申请日：2016-11-30
Applicant: SUMIDA CORPORATION
Inventor： Shinichi SAKAMOTO , Zhigang CHENG , Fernando Chan Mock , Mitsugu KAWARAI
CPC classification number: H01F27/2828 , H01F27/24 , H01F27/29 , H01F27/292 , H01F27/30 , H01F41/0206 , H01F41/04 , H01F41/061 , Y10T29/49073
Abstract: An electronic component includes a magnetic core member, a winding and a magnetic exterior body. The magnetic core member has a flat base and a core. The flat base has a top surface, a bottom surface, a first side surface and a second side surface opposite to the first side surface. The core is located on the top surface of the flat base. A winding has an edgewise coil and two non-wound flat wires that extend from the edgewise coil. A magnetic exterior body covers at least the core and the edgewise coil. The two non-wound flat wires continuously extend along the top surface, the first side surface, the bottom surface and the second side surface of the flat base in this order. The two non-wound flat wires located on the bottom surface work as electrodes.
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公开(公告)号：US20240136108A1
公开(公告)日：2024-04-25
申请号：US18535085
申请日：2023-12-11
Applicant: SUMIDA CORPORATION
Inventor： Shinichi SAKAMOTO , Zhigang CHENG , Fernando CHAN MOCK , Mitsugu KAWARAI
CPC classification number: H01F27/2828 , H01F27/24 , H01F27/29 , H01F27/292 , H01F27/30 , H01F41/0206 , H01F41/04 , H01F41/061 , Y10T29/49073
Abstract: An electronic component comprises: a magnetic core having a flat base and a core, the flat base having a top, a bottom, and first and second opposite sides, the core is on the top; a winding having an edgewise coil including a wound flat wire and the core, the winding having two non-wound flat wires extending therefrom; and a magnetic exterior body covering the core and the edgewise coil. The two non-wound flat wires extend along the top, the first side, the bottom and then the second side, and the two non-wound flat wires are non-adhesively positioned around the flat base. The two non-wound flat wires on the bottom are externally exposed electrodes. The second side inclines towards the core. The two ends of the two non-wound flat wires are embedded into the magnetic exterior body to fix the two non-wound flat wires to the magnetic exterior body.
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