公开(公告)号：US11798912B2

公开(公告)日：2023-10-24

申请号：US17123836

申请日：2020-12-16

Applicant: Samsung Display Co., LTD.

Inventor： Taeyoung Park ,  Jungseon Park ,  Jun-Hee Lee ,  Hyunwoo Lee

IPC: B32B41/00 ,  H01L23/00 ,  H05K3/32 ,  H10K59/131

CPC classification number: H01L24/80 ,  H01L24/74 ,  H01L24/75 ,  H01L24/83 ,  H05K3/323 ,  H05K3/328 ,  H01L2224/75701 ,  H01L2224/75753 ,  H01L2224/75754 ,  H01L2224/75804 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80205 ,  H01L2224/8313 ,  H01L2224/83132 ,  H05K2203/0285 ,  H05K2203/1509 ,  H05K2203/166 ,  H05K2203/167 ,  H10K59/131

Abstract: A method of fabricating a display device may include disposing a display panel on a stage to be parallel to an XZ-plane defined by a horizontal X-axis and a vertical Z-axis, measuring a height of a first side surface of the display panel in a direction of the Z-axis, rotating the stage such that the first side surface is parallel to a reference horizontal line in case that a result of the measured height indicates that the first side surface includes an inclined surface, moving the display panel in a direction of the Z-axis such that a first pad disposed on the first side surface overlaps the reference horizontal line, and bonding a second pad of a printed circuit board with the first pad.

公开(公告)号：US11877400B2

公开(公告)日：2024-01-16

申请号：US17356977

申请日：2021-06-24

Applicant: Samsung Display Co., Ltd.

Inventor： Jungseon Park ,  Wunbong Tak ,  Jaeseong Lee

IPC: H05K13/00 ,  H05K13/08 ,  H05K1/18

CPC classification number: H05K13/0015 ,  H05K1/181 ,  H05K13/0812 ,  H05K13/0813 ,  H05K2201/10128 ,  H05K2201/10212

Abstract: A panel alignment device for a display device includes a stage supporting a panel and including a transmitting portion that includes a first region having a first thickness and a second region having a second thickness greater than the first thickness, a head disposed over the stage and supporting a driving chip, a vision camera which is disposed under the stage, captures a first alignment mark of the panel through the first region, and captures a second alignment mark of the driving chip through the second region, and a controller which controls at least one of a movement and a rotation of each of the stage and the head based on first image information related to a position of the first alignment mark and second image information related to a position of the second alignment mark.

公开(公告)号：US11528807B2

公开(公告)日：2022-12-13

申请号：US17147446

申请日：2021-01-12

Applicant: Samsung Display Co., Ltd.

Inventor： Jungseon Park ,  Taeyoung Park ,  Jun-Hee Lee ,  Hyunwoo Lee

IPC: B32B41/00 ,  H05K3/10 ,  H05K3/32

Abstract: A bonding device includes: a bonding head configured to move in a vertical direction; a stage disposed under the bonding head and including a first portion, the first portion having a first plane surface facing the bonding head and a first support surface opposite to the first plane surface; and a supporter disposed under the stage and including a second support surface facing the first support surface, wherein the second support surface of the supporter has a recess portion having a first radius of curvature.

公开(公告)号：US12199055B2

公开(公告)日：2025-01-14

申请号：US17116902

申请日：2020-12-09

Applicant: Samsung Display Co., Ltd.

Inventor： Hyunwoo Lee ,  Jungseon Park ,  Taeyoung Park ,  Jun-Hee Lee

IPC: H01L23/00 ,  H05K1/14

Abstract: A bonding device includes a stage supporting a display panel including a first area through which a pad is exposed, a sensor disposed on the stage and facing the first area, and a handler disposing a circuit board on the first area. The handler includes a body supporting the circuit board and a rod connected to the body and selectively in contact with a second area of the circuit board overlapping the first area.

公开(公告)号：US20210305183A1

公开(公告)日：2021-09-30

申请号：US17116902

申请日：2020-12-09

Applicant: Samsung Display Co., Ltd.

Inventor： HYUNWOO LEE ,  Jungseon Park ,  Taeyoung Park ,  Jun-Hee Lee

IPC: H01L23/00 ,  H05K1/14

Abstract: A bonding device includes a stage supporting a display panel including a first area through which a pad is exposed, a sensor disposed on the stage and facing the first area, and a handler disposing a circuit board on the first area. The handler includes a body supporting the circuit board and a rod connected to the body and selectively in contact with a second area of the circuit board overlapping the first area.