公开(公告)号：US20180020550A1

公开(公告)日：2018-01-18

申请号：US15467004

申请日：2017-03-23

Applicant: Samsung Display Co., Ltd.

Inventor： Sehui JANG ,  Sung-dong PARK ,  Chongguk LEE ,  Byoungdoo JEONG

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/189 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10128

Abstract: A flexible film includes a base film including an edge portion which extends in a first direction, a plurality of wirings disposed on the base film, and a plurality of pads which is disposed in the edge portion of the base film and connected to the plurality of wirings. The plurality of pads disposed in the edge portion include a plurality of horizontal pads horizontally arranged in the first direction to define a pad row extended in the first direction; and a vertical pad including a plurality of vertically arranged pads arranged in a second direction perpendicular to the first direction, within a same pad row in which the plurality of horizontal pads are horizontally arranged.

公开(公告)号：US20190198412A1

公开(公告)日：2019-06-27

申请号：US16221697

申请日：2018-12-17

Applicant: Samsung Display Co., LTD.

Inventor： Sehui JANG ,  Jihyun KIM ,  Chongguk LEE

IPC: H01L23/31 ,  H01L23/498 ,  H01L27/12 ,  G02F1/1345 ,  H05K1/02

CPC classification number: H01L23/3114 ,  G02F1/13452 ,  H01L23/4985 ,  H01L27/124 ,  H05K1/028

Abstract: A chip on film package includes a driving integrated circuit chip; a base substrate including: a driving integrated circuit region, and a first region at which stress is converged by the base substrate bent along a side surface of the display panel; and an electrical ground pattern structure on the base substrate in the first region thereof at which the stress is converged. The electrical ground pattern structure is connected to a first side of the driving integrated circuit chip, and the ground pattern structure includes extended from the first side of the driving integrated circuit chip: in a first portion of the first region, ground patterns each inclined in a first direction, and in a second portion of the first region, ground patterns each inclined in a second direction different from the first direction.