公开(公告)号：US11639470B2

公开(公告)日：2023-05-02

申请号：US17388712

申请日：2021-07-29

Applicant: Samsung Display Co., Ltd.

Inventor： Jonghee Park ,  Hyoung Sik Kim ,  O Byoung Kwon ,  Gi-Yong Nam ,  Kyungchan Min ,  Suck Jun Lee ,  Youngmin Kim ,  Jinhyung Kim ,  Donghun Lee ,  Kyu-Hun Lim ,  Dongmin Jang

IPC: C09K13/06 ,  C23F1/44 ,  H01L51/00 ,  C23F1/02

Abstract: An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water.

公开(公告)号：US11225721B2

公开(公告)日：2022-01-18

申请号：US16284629

申请日：2019-02-25

Applicant: SAMSUNG DISPLAY CO., LTD. ,  DONGWOO FINE-CHEM Co., Ltd.

Inventor： Jinhyung Kim ,  Joohwan Chung ,  Jinsook Kim ,  Haccheol Kim ,  Byungsu Lee ,  Changsoo Kim ,  Jungseek Jung ,  Dongki Kim ,  Sangtae Kim ,  Giyong Nam ,  Youngchul Park ,  Kyungbo Shim ,  Daesung Lim ,  Sanghoon Jang

IPC: C23F1/30 ,  H01L21/3213 ,  C09K13/04 ,  C09K13/00 ,  H01L21/465 ,  C09K13/06 ,  H01L21/302 ,  H01L21/306 ,  H01L29/786 ,  C23F1/16

Abstract: A thin film etchant composition for preventing re-adsorption of an etched metal and uniformly etching a thin film is provided. The thin film etchant composition includes about 43 wt % to about 46 wt % of phosphoric acid, about 5 wt % to about 8 wt % of nitric acid, about 10 wt % to about 17 wt % of acetic acid, about 1 wt % to about 3 wt % of iron nitrate, about 0.7 wt % to about 1.5 wt % of phosphate, and deionized water as a remaining amount based on a total weight of the thin film etchant composition.

公开(公告)号：US12031076B2

公开(公告)日：2024-07-09

申请号：US18122706

申请日：2023-03-17

Applicant: Samsung Display Co., Ltd.

Inventor： Jonghee Park ,  Hyoung Sik Kim ,  O Byoung Kwon ,  Gi-Yong Nam ,  Kyungchan Min ,  Suck Jun Lee ,  Youngmin Kim ,  Jinhyung Kim ,  Donghun Lee ,  Kyu-Hun Lim ,  Dongmin Jang

IPC: C09K13/06 ,  C23F1/02 ,  C23F1/44 ,  H10K59/12 ,  H10K71/00 ,  H10K71/20

CPC classification number: C09K13/06 ,  C23F1/02 ,  C23F1/44 ,  H10K59/1201 ,  H10K71/233 ,  H10K71/621

Abstract: An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water.