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公开(公告)号:US20190259439A1
公开(公告)日:2019-08-22
申请号:US16405219
申请日:2019-05-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Chang Hoon JEON , Yong Seok KIM , Jun Hee LIM
IPC: G11C11/40 , H01L27/11573 , H01L27/11575 , H01L27/11582 , H01L21/8238 , H01L27/092 , G11C16/04 , H01L21/8234
Abstract: A semiconductor device includes a memory cell region including memory cells arranged along channel holes, the channel holes being provided on a substrate to extend in a direction perpendicular to an upper surface of the substrate, and a peripheral circuit region disposed outside of the memory cell region and including low voltage transistors and high voltage transistors. The low voltage transistors include first transistors including a first gate dielectric layer and a first gate electrode layer including a metal, and the high voltage transistors include second transistors including a second gate dielectric layer having a dielectric constant lower than a dielectric constant of the first gate dielectric layer, and a second gate electrode layer including polysilicon.
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公开(公告)号:US20180358079A1
公开(公告)日:2018-12-13
申请号:US15794628
申请日:2017-10-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Chang Hoon JEON , Yong Seok KIM , Jun Hee LIM
IPC: G11C11/40
CPC classification number: G11C11/40
Abstract: A semiconductor device includes a memory cell region including memory cells arranged along channel holes, the channel holes being provided on a substrate to extend in a direction perpendicular to an upper surface of the substrate, and a peripheral circuit region disposed outside of the memory cell region and including low voltage transistors and high voltage transistors, The low voltage transistors include first transistors including a first gate dielectric layer and a first gate electrode layer including a metal, and the high voltage transistors include second transistors including a second gate dielectric layer having a dielectric constant lower than a dielectric constant of the first gate dielectric layer, and a second gate electrode layer including polysilicon.
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公开(公告)号:US20190267088A1
公开(公告)日:2019-08-29
申请号:US16059317
申请日:2018-08-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chang Hoon JEON , Yoo Cheol Shin , Jun Hee Lim , Sung Kweon Baek , Chan Ho Lee , Won Chul Jang , Sun Gyung Hwang
IPC: G11C14/00 , G11C11/401 , H01L27/108 , H01L23/532
Abstract: A semiconductor device includes a substrate having a volatile memory region and a non-volatile memory region. The volatile memory region includes a cell capacitor disposed in the substrate and a cell transistor connected to the cell capacitor. The non-volatile memory region includes a plurality of non-volatile memory cells disposed on the substrate. The volatile memory region and the non-volatile memory region are disposed side by side.
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