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    Pipe structure and semiconductor module testing equipment including the same
    1.
    发明授权
    Pipe structure and semiconductor module testing equipment including the same 有权

    公开(公告)号：US10330722B2

    公开(公告)日：2019-06-25

    申请号：US15670379

    申请日：2017-08-07

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Min-woo Kim ,  Yong-dae Ha ,  Chang-ho Lee ,  Seul-ki Han

    IPC: G01R31/00 ,  G01R31/26 ,  G01R31/28

    Abstract: Semiconductor module testing equipment includes a test board, a plurality of pipe structures extending from an upper surface of the test board in a first direction and spaced apart from one another in a second direction that intersects the first direction, wherein the first and second directions are substantially parallel to a plane of the test board, at least one semiconductor module socket disposed between a pair of neighboring pipe structures of the plurality of pipe structures, and a plurality of nozzles disposed on each pipe structure of the plurality of pipe structures, wherein the plurality of nozzles is configured to discharge a fluid laterally.

    MEMORY TEST APPARATUS
    2.
    发明申请
    MEMORY TEST APPARATUS 审中-公开
    内存测试装置

    公开(公告)号：US20160111169A1

    公开(公告)日：2016-04-21

    申请号：US14881579

    申请日：2015-10-13

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min-woo Kim ,  Chang-ho Lee ,  Chang-yong Park ,  Bo-won Han

    IPC: G11C29/12

    CPC classification number: G11C29/12005 ,  G11C29/12015 ,  G11C29/26 ,  G11C29/56 ,  G11C2029/2602

    Abstract: A memory test apparatus includes a test board unit including a first test board configured to load for testing a first memory system including a plurality of memory modules. A second test board is configured to load for testing a second memory system including a plurality of memory modules. A power unit comprises a first power supply unit configured to supply the first test board with a first power for testing the first memory system, a second power supply unit configured to supply the second test board with a second power for testing the second memory system, and a power supply control unit configured to control at least one of a supply timing of the first power and a supply timing of the second power.

    Abstract translation: 存储器测试装置包括测试板单元，其包括被配置为加载用于测试包括多个存储器模块的第一存储器系统的第一测试板。 第二测试板被配置为加载用于测试包括多个存储器模块的第二存储器系统。 电源单元包括：第一电源单元，被配置为向第一测试板提供用于测试第一存储器系统的第一电源;第二电源单元，被配置为向第二测试板提供用于测试第二存储器系统的第二电源， 以及电源控制单元，被配置为控制第一功率的供给定时和第二功率的供给定时中的至少一个。

    TEST CHAMBER FOR MEMORY DEVICE, TEST SYSTEM FOR MEMORY DEVICE HAVING THE SAME AND METHOD OF TESTING MEMORY DEVICES USING THE SAME
    3.
    发明申请
    TEST CHAMBER FOR MEMORY DEVICE, TEST SYSTEM FOR MEMORY DEVICE HAVING THE SAME AND METHOD OF TESTING MEMORY DEVICES USING THE SAME 审中-公开

    公开(公告)号：US20190285695A1

    公开(公告)日：2019-09-19

    申请号：US16182148

    申请日：2018-11-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min-Woo Kim ,  Chang-ho Lee ,  Jin-Ho Choi

    IPC: G01R31/28

    Abstract: A test system for a memory device includes: a chamber including at least one test socket column having a plurality of test sockets arranged in a first direction, wherein memory devices to be tested are in respective ones of the plurality of test sockets, a temperature adjusting apparatus configured to supply air into the chamber according to a temperature control signal to control a temperature of the chamber, a test device electrically connected to the test sockets and configured to test the memory devices, and a temperature controller configured to receive temperature information of the memory devices from temperature sensors of the memory devices and to output to the temperature adjusting apparatus the temperature control signal to compensate for a temperature difference between a detected temperature of the memory devices and a target temperature.

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