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    AUTOMATIC MODULE APPARATUS FOR MANUFACTURING SOLID STATE DRIVES (SSD)
    1.
    发明申请
    AUTOMATIC MODULE APPARATUS FOR MANUFACTURING SOLID STATE DRIVES (SSD) 有权
    用于制造固态驱动的自动模块装置（SSD）

    公开(公告)号：US20150077153A1

    公开(公告)日：2015-03-19

    申请号：US14465364

    申请日：2014-08-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min-woo Kim ,  Dong-woo Shin ,  IL-hyoung Koo ,  Do-young Jung

    IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  G01R31/28

    CPC classification number: H01L21/68707 ,  G01R31/2893 ,  G11C16/00 ,  G11C29/56016 ,  H01L21/67271 ,  H01L21/67294

    Abstract: An automatic module apparatus for manufacturing a solid state drive (SSD) includes a labeling apparatus, one or more test handler apparatuses and a sorting apparatus. The labeling apparatus is for printing a label on a SSD mounted on a carrier tray. The one or more test handler apparatuses are for transporting the carrier tray on which the labeled SSD is mounted and for testing the labeled SSDs to determine whether the labeled SSDs have any defects. The SSD sorting apparatus is for transporting the carrier tray on which the tested SSDs are mounted and sorting non-defective defective SSDs tested by the test handler apparatuses. The SSD labeling apparatus, the test handler apparatuses, and the SSD sorting apparatus are in-line and automated.

    Abstract translation: 用于制造固态驱动器（SSD）的自动模块装置包括标签装置，一个或多个测试处理装置和分拣装置。 标签装置用于在安装在托盘上的SSD上印刷标签。 一个或多个测试处理设备用于传送其上安装有标记的SSD的载体盘，并且用于测试标记的SSD以确定标记的SSD是否具有任何缺陷。 SSD分类装置用于运送安装有测试SSD的托盘，并对由测试处理设备测试的无缺陷缺陷SSD进行排序。 SSD标签装置，测试处理装置和SSD分类装置是线上自动的。

    MEMORY TEST APPARATUS
    2.
    发明申请
    MEMORY TEST APPARATUS 审中-公开
    内存测试装置

    公开(公告)号：US20160111169A1

    公开(公告)日：2016-04-21

    申请号：US14881579

    申请日：2015-10-13

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min-woo Kim ,  Chang-ho Lee ,  Chang-yong Park ,  Bo-won Han

    IPC: G11C29/12

    CPC classification number: G11C29/12005 ,  G11C29/12015 ,  G11C29/26 ,  G11C29/56 ,  G11C2029/2602

    Abstract: A memory test apparatus includes a test board unit including a first test board configured to load for testing a first memory system including a plurality of memory modules. A second test board is configured to load for testing a second memory system including a plurality of memory modules. A power unit comprises a first power supply unit configured to supply the first test board with a first power for testing the first memory system, a second power supply unit configured to supply the second test board with a second power for testing the second memory system, and a power supply control unit configured to control at least one of a supply timing of the first power and a supply timing of the second power.

    Abstract translation: 存储器测试装置包括测试板单元，其包括被配置为加载用于测试包括多个存储器模块的第一存储器系统的第一测试板。 第二测试板被配置为加载用于测试包括多个存储器模块的第二存储器系统。 电源单元包括：第一电源单元，被配置为向第一测试板提供用于测试第一存储器系统的第一电源;第二电源单元，被配置为向第二测试板提供用于测试第二存储器系统的第二电源， 以及电源控制单元，被配置为控制第一功率的供给定时和第二功率的供给定时中的至少一个。

    Pipe structure and semiconductor module testing equipment including the same
    3.
    发明授权
    Pipe structure and semiconductor module testing equipment including the same 有权

    公开(公告)号：US10330722B2

    公开(公告)日：2019-06-25

    申请号：US15670379

    申请日：2017-08-07

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Min-woo Kim ,  Yong-dae Ha ,  Chang-ho Lee ,  Seul-ki Han

    IPC: G01R31/00 ,  G01R31/26 ,  G01R31/28

    Abstract: Semiconductor module testing equipment includes a test board, a plurality of pipe structures extending from an upper surface of the test board in a first direction and spaced apart from one another in a second direction that intersects the first direction, wherein the first and second directions are substantially parallel to a plane of the test board, at least one semiconductor module socket disposed between a pair of neighboring pipe structures of the plurality of pipe structures, and a plurality of nozzles disposed on each pipe structure of the plurality of pipe structures, wherein the plurality of nozzles is configured to discharge a fluid laterally.

    Method of manufacturing integrated circuit device
    4.
    发明授权
    Method of manufacturing integrated circuit device 有权

    公开(公告)号：US10115640B2

    公开(公告)日：2018-10-30

    申请号：US15460273

    申请日：2017-03-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hee-don Hwang ,  Young-wook Park ,  Min-woo Kim ,  Yoo-jin Jeong

    IPC: H01L21/76 ,  H01L21/8234 ,  H01L21/308

    Abstract: A method of manufacturing an integrated circuit device includes providing a substrate with a pattern structure, the pattern structure including a plurality of first patterns that extend in a first direction, are parallel to one another, and are separated from one another with a space therebetween. At least one support structure that contacts an upper surface of the pattern structure and extends on the pattern structure in a second direction that crosses the first direction is formed. A buried layer that fills the spaces between the plurality of first patterns while the at least one support structure contacts the upper surface of the pattern structure is formed. The at least one support structure is separated from the pattern structure.

    METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE
    5.
    发明申请
    METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE 审中-公开

    公开(公告)号：US20180025947A1

    公开(公告)日：2018-01-25

    申请号：US15460273

    申请日：2017-03-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hee-don Hwang ,  Young-wook Park ,  Min-woo Kim ,  Yoo-jin Jeong

    IPC: H01L21/8234 ,  H01L21/308

    CPC classification number: H01L21/823481 ,  H01L21/3086 ,  H01L21/823431 ,  H01L21/823475

    Abstract: A method of manufacturing an integrated circuit device includes providing a substrate with a pattern structure, the pattern structure including a plurality of first patterns that extend in a first direction, are parallel to one another, and are separated from one another with a space therebetween. At least one support structure that contacts an upper surface of the pattern structure and extends on the pattern structure in a second direction that crosses the first direction is formed. A buried layer that fills the spaces between the plurality of first patterns while the at least one support structure contacts the upper surface of the pattern structure is formed. The at least one support structure is separated from the pattern structure.

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