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    ELECTRONIC DEVICE AND METHOD FOR PROVIDING CALL SERVICES FOR THE SAME
    2.
    发明申请
    ELECTRONIC DEVICE AND METHOD FOR PROVIDING CALL SERVICES FOR THE SAME 有权
    用于为其提供呼叫服务的电子设备和方法

    公开(公告)号：US20150282012A1

    公开(公告)日：2015-10-01

    申请号：US14662883

    申请日：2015-03-19

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sunggi BAEK ,  Jiyeon Lee ,  Jonghwa Choi ,  Dongwoo Kim ,  Jinhong Seol ,  Changhwan Lee ,  Yonggil Han

    IPC: H04W36/00 ,  H04W4/16 ,  H04L29/06

    CPC classification number: H04W36/0022 ,  H04L65/1006 ,  H04L65/1016 ,  H04L65/1069 ,  H04L65/1076 ,  H04L65/1096 ,  H04W4/16

    Abstract: A method of providing call services for an electronic device is provided. The method may include receiving a call request from the user; determining whether the call request is a request for a call via an Internet Protocol (IP) Multimedia System (IMS) network; making, when it is determined that the call request is a request for a call via an IMS network, an attempt to set up the call via the IMS network; determining whether the attempt for the call setup via the IMS network is successful; and performing Circuit Switched Fallback (CSFB) when it is determined that the attempt for the call setup via the IMS network is unsuccessful.

    Abstract translation: 提供了一种为电子设备提供呼叫服务的方法。 该方法可以包括从用户接收呼叫请求; 确定所述呼叫请求是否是经由因特网协议（IP）多媒体系统（IMS）网络的呼叫请求; 当确定呼叫请求是经由IMS网络进行呼叫的请求时，尝试通过IMS网络建立呼叫; 确定通过IMS网络建立呼叫的尝试是否成功; 并且当确定通过IMS网络建立呼叫的尝试不成功时执行电路交换回退（CSFB）。

    SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
    3.
    发明申请
    SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME 有权

    公开(公告)号：US20220367359A1

    公开(公告)日：2022-11-17

    申请号：US17567249

    申请日：2022-01-03

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Junhyoung Kim ,  Kangmin Kim ,  Changhwan Lee ,  Taemin Eom ,  Seungmin Lee

    IPC: H01L23/535 ,  H01L27/11556 ,  H01L27/11529 ,  H01L27/11582 ,  H01L27/11573

    Abstract: A semiconductor device includes a first structure including a substrate, circuit devices, a lower interconnection structure electrically connected to the circuit devices, and a second structure on the first structure. The second structure includes a conductive plate layer; gate electrodes on the conductive plate layer and extending in a first direction; separation regions penetrating through the gate electrodes and extending in the first direction; channel structures penetrating through the gate electrodes and respectively including a channel layer; through-contact plugs spaced apart from the gate electrodes and extending in the vertical direction to be electrically connected to the lower interconnection structure of the first structure; first and second contacts electrically connected to the channel layer and the through-contact plugs, respectively; bitlines electrically connecting at least one of each of the first and second contacts to each other; and dummy contacts connected to the bitlines and spaced apart from the through-contact plugs.

    Electronic device comprising multiple microphones
    4.
    发明授权
    Electronic device comprising multiple microphones 有权

    公开(公告)号：US11622184B2

    公开(公告)日：2023-04-04

    申请号：US17250590

    申请日：2019-08-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jinwoo Kim ,  Sujin Jung ,  Hakrae Kang ,  Heejun Park ,  Minseok Shin ,  Changhwan Lee

    IPC: H04R1/04 ,  H05K5/00

    Abstract: According to an embodiment of the present invention, an electronic device may comprise: a housing; a printed circuit board disposed inside the housing, the printed circuit board comprising a first surface, a second surface facing away from the first surface, and a first through-hole and a second through-hole penetrating the first surface and the second surface; a first microphone disposed on the second surface so as to at least partially overlap the first through-hole when seen from above the first surface; a second microphone disposed on the second surface so as to at least partially overlap the second through-hole when seen from above the first surface; a support member disposed on the first surface, the support member comprising a third surface facing the first surface, a fourth surface facing away from the third surface, a third through-hole at least partially overlapping the first through-hole when seen from above the first surface, and a fourth through-hole at least partially overlapping the second through-hole when seen from above the first surface; a first sound-transmitting member disposed on the fourth surface so as to at least partially overlap the third through-hole; and a second sound-transmitting member disposed on the fourth surface so as to at least partially overlap the fourth through-hole. Various other embodiments may be included.

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