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公开(公告)号：US20210253796A1
公开(公告)日：2021-08-19
申请号：US17246926
申请日：2021-05-03
Applicant: SAMSUNG ELECTRONICS CO., LTD. , SAMSUNG SDI CO., LTD.
Inventor： A Ra JO , Chanjae AHN , Sungwon CHOI , Won Suk CHANG , Boreum JEONG
Abstract: A poly(amide-imide) copolymer that is a reaction product of a substituted or unsubstituted linear aliphatic diamine including two terminals, a diamine represented by Chemical Formula 1, a dicarbonyl compound represented by Chemical Formula 2, and a tetracarboxylic acid dianhydride represented by Chemical Formula 3: wherein, in Chemical Formulae 1 to 3, A, R3, R10, R12, R13, X, n7 and n8 are the same as defined in the specification.
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2.发明申请公开(公告)号：US20180148543A1
公开(公告)日：2018-05-31
申请号：US15816079
申请日：2017-11-17
Applicant: SAMSUNG ELECTRONICS CO., LTD. , SAMSUNG SDI CO., LTD.
Inventor： Jungha CHAE , Chanjae AHN , Kyeong-sik JU
CPC classification number: C08G73/14 , C08J5/18 , C08J2379/08
Abstract: A polyimide film having tensile modulus of greater than or equal to about 5 gigapascals, and yellowness index of less than 2.5, when measured at a thickness of the film between 50 micrometers to 100 micrometers, wherein the polyimide film is a reaction product of a combination including an aromatic dianhydride and an aromatic diamine, wherein the aromatic dianhydride includes 4,4′-oxydiphthalic anhydride.
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公开(公告)号：US20180113350A1
公开(公告)日：2018-04-26
申请号：US15789695
申请日：2017-10-20
Applicant: SAMSUNG ELECTRONICS CO., LTD. , SAMSUNG SDI CO., LTD.
Inventor： Sang Soo JEE , Sun Jin SONG , Chanjae AHN , Sungwon CHOI
IPC: G02F1/1333 , C08G73/14 , C08K5/5419 , C08L79/08
CPC classification number: G02F1/133305 , C08G73/14 , C08J7/047 , C08J2379/08 , C08J2483/06 , C08K5/5419 , C08L79/08 , C09D183/06
Abstract: A flexible plastic substrate includes a film including a poly(amide-imide) copolymer; and a hard coating layer disposed on a first surface of the film, wherein the hard coating layer includes a crosslinked siloxane copolymer, and wherein the flexible plastic substrate has pencil hardness of greater than or equal to 2H under a vertical load of 1 kilogram according to ASTM D3363, a total light transmittance of greater than or equal to about 89% in a wavelength region of 350 nanometers to 750 nanometers.
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公开(公告)号：US20170342224A1
公开(公告)日：2017-11-30
申请号：US15602616
申请日：2017-05-23
Applicant: SAMSUNG ELECTRONICS CO., LTD. , Samsung SDI Co., Ltd.
Inventor： Jungha CHAE , Chanjae AHN , Kyeong-sik JU
Abstract: A poly(amide-imide) copolymer film having a tensile modulus of greater than or equal to 5.4 GPa, and a yellowness index of less than or equal to 3.6, wherein the poly(amide-imide) copolymer film is a reaction product of an aromatic dianhydride including biphenyl tetracarboxylic dianhydride and 4,4′-hexafluoroisopropylidene diphthalic dianhydride, an aliphatic dianhydride including 1,2,3,4-cyclobutane tetracarboxylic dianhydride, an aromatic diamine including 2,2-bis(trifluoromethyl) benzidine, and an aromatic dicarbonyl compound including terephthaloyl dichloride.
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公开(公告)号：US20170121460A1
公开(公告)日：2017-05-04
申请号：US15341318
申请日：2016-11-02
Applicant: SAMSUNG ELECTRONICS CO., LTD. , Samsung SDI Co., Ltd.
Inventor： Sung Woo HONG , Chanjae AHN , Hyunjeong JEON , Sang Soo JEE , Hongkyoon CHOI , Byunghee SOHN , Sungwon CHOI
IPC: C08G73/14
CPC classification number: C08G73/14 , C08G73/1028 , C08G73/1039 , C08G73/1042 , C08G73/1067
Abstract: A poly(imide-amide) copolymer, which is a product of a reaction between a diamine including an amide structural unit-containing oligomer represented by Chemical Formula 1 and a dianhydride represented by Chemical Formula 3: wherein, groups and variables in Chemical Formulae 1 and 3 are the same as described in the specification.
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Patent Agency Ranking
6.发明申请POLY(IMIDE-AMIDE) COPOLYMER, ARTICLE CONTAINING POLY(IMIDE-AMIDE) COPOLYMER, AND DISPLAY DEVICE INCLUDING SAME 有权聚（酰胺）共聚物，含有聚（酰胺）共聚物的制品，以及包括其的显示装置公开(公告)号：US20160222166A1
公开(公告)日：2016-08-04
申请号：US14741959
申请日：2015-06-17
Applicant: SAMSUNG ELECTRONICS CO., LTD. , SAMSUNG SDI CO., LTD.
Inventor： Chanjae AHN , Sungwon CHOI , Sungwoo HONG , Byunghee SOHN , Sun Jin SONG , Kyeong-sik JU
IPC: C08G73/14
CPC classification number: C08G73/14 , C08G73/1039
Abstract: A poly(amide-imide) copolymer including a structural unit represented by Chemical Formula 1; a structural unit represented by Chemical Formula 2, and/or an amic acid precursor structural unit which forms the structural unit represented by Chemical Formula 2 through imidization; and a structural unit represented by Chemical Formula 3, and/or an amic acid precursor structural unit which forms the structural unit represented by Chemical Formula 3 through imidization, wherein the poly(amide-imide) copolymer has a modulus of greater than or equal to about 5.5 giga Pascals after being cured, a yellowness index YI of less than or equal to about 3.5, and an increase in yellowness index ΔYI of less than or equal to about 0.7 after being exposed to ultraviolet light for 72 hours: wherein in Chemical Formulae 1 to 3, groups and variables are the same as described in the specification.
Abstract translation: 包含由化学式1表示的结构单元的聚酰胺 - 酰亚胺共聚物; 由化学式2表示的结构单元和/或通过酰亚胺化形成由化学式2表示的结构单元的酰胺酸前体结构单元; 和由化学式3表示的结构单元和/或通过酰亚胺化形成由化学式3表示的结构单元的酰胺酸前体结构单元，其中聚（酰胺 - 酰亚胺）共聚物的模量大于或等于 固化后约5.5千兆帕斯卡，黄色指数YI小于或等于约3.5，黄色指数ΔYI在暴露于紫外线72小时后增加小于或等于约0.7：其中化学式 如图1至图3所示，组和变量与说明书中描述的相同。
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7.发明公开公开(公告)号：US20240043592A1
公开(公告)日：2024-02-08
申请号：US18068365
申请日：2022-12-19
Applicant: Samsung Electronics Co., Ltd.,
Inventor： Minsang KIM , Haengdeog KOH , Yoonhyun KWAK , Chanjae AHN , Jungha CHAE , Sungwon CHOI , Minyoung HA
IPC: C08F220/18 , C07C381/12 , G03F7/039 , G03F7/038 , C08F212/14
CPC classification number: C08F220/1807 , C07C381/12 , G03F7/039 , G03F7/038 , C08F212/24
Abstract: Provided are a polymer including a repeating unit represented by Formula 1, a photoresist composition including the polymer, and a method of forming a pattern by using the photoresist composition:
wherein the details of R11, L11, a11, A11−, and B11+in Formula 1 are provided in the present specification.-
公开(公告)号：US20200223983A1
公开(公告)日：2020-07-16
申请号：US16837193
申请日：2020-04-01
Applicant: SAMSUNG ELECTRONICS CO., LTD. , Samsung SDI Co., Ltd.
Inventor： Sung Woo HONG , Chanjae AHN , Hyunjeong JEON , Sang Soo JEE , Hongkyoon CHOI , Byunghee SOHN , Sungwon CHOI
Abstract: A poly(imide-amide) copolymer, which is a product of a reaction between a diamine including an amide structural unit-containing oligomer represented by Chemical Formula 1 and a dianhydride represented by Chemical Formula 3: wherein, groups and variables in Chemical Formulae 1 and 3 are the same as described in the specification.
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公开(公告)号：US20190077916A1
公开(公告)日：2019-03-14
申请号：US16126250
申请日：2018-09-10
Applicant: SAMSUNG ELECTRONICS CO., LTD. , SAMSUNG SDI CO., LTD.
Inventor： A Ra JO , Chanjae AHN , Sungwon CHOI , Won Suk CHANG , Boreum JEONG
Abstract: A poly(amide-imide) copolymer that is a reaction product of a substituted or unsubstituted linear aliphatic diamine including two terminals, a diamine represented by Chemical Formula 1, a dicarbonyl compound represented by Chemical Formula 2, and a tetracarboxylic acid dianhydride represented by Chemical Formula 3: wherein, in Chemical Formulae 1 to 3, A, R3, R10, R12, R13, X, n7 and n8 are the same as defined in the specification.
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10.发明申请公开(公告)号：US20180355108A1
公开(公告)日：2018-12-13
申请号：US16003651
申请日：2018-06-08
Applicant: SAMSUNG ELECTRONICS CO., LTD. , SAMSUNG SDI CO., LTD.
Inventor： A Ra JO , Chanjae AHN , Sungwon CHOI , Sun Jin SONG , Boreum JEONG , Won Suk CHANG
CPC classification number: C08G73/1067 , C08J5/18 , C08J2379/08 , G02F1/133305
Abstract: A film comprising a polyimide or poly(imide-amide) copolymer, wherein the film has an amplitude of a surface roughness curve of less than or equal to 270 nanometers.
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