公开(公告)号：US20240162188A1

公开(公告)日：2024-05-16

申请号：US18356771

申请日：2023-07-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chajea JO ,  Dohyun KIM ,  Seungryong OH

IPC: H01L25/065 ,  H01L23/31

CPC classification number: H01L25/0652 ,  H01L23/3128 ,  H01L24/16 ,  H01L2224/16145 ,  H01L2224/16227

Abstract: A semiconductor package includes a substrate; a first chip structure on the substrate and having a first thickness in a first direction; a second chip structure on the substrate adjacent to the first chip structure along a second direction and having a second thickness in the first direction; a third chip structure on the substrate and adjacent to the first chip structure and the second chip structure in a third direction perpendicular to the second direction; and an encapsulant covering the first chip structure, the second chip structure, and the third chip structure, wherein the third chip structure includes a lower chip structure that overlaps a first portion of a space between the first chip structure and the second chip structure in the third direction, and an upper chip structure on the lower chip structure such that a second portion of the space is exposed in the third direction.

公开(公告)号：US20200340476A1

公开(公告)日：2020-10-29

申请号：US16861673

申请日：2020-04-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghoon PARK ,  Sunghea CHO ,  Jongcheun SEO ,  Namkyu CHO ,  Dohyun KIM ,  Junguk JUN

IPC: F04C18/02 ,  F04C29/12

Abstract: A scroll compressor includes a main body, a cover to divide the main body into a low pressure section and a high pressure section, a fixed scroll including a first discharge port, an orbiting scroll to rotate with respect to the fixed scroll and to form a compression chamber together with the fixed scroll, a discharge guide disposed between the fixed scroll and the cover and including a second discharge port connected to the first discharge port, and a back pressure actuator configured to form a back pressure chamber together with the discharge guide and to move in a direction toward the cover with respect to the discharge guide to selectively connect the second discharge port with the high pressure section. The fixed scroll includes a bypass flow path connecting the compression chamber and the second discharge port and a bypass valve to open or close the bypass flow path.

公开(公告)号：US20230366401A1

公开(公告)日：2023-11-16

申请号：US18358408

申请日：2023-07-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yanghee CHO ,  Sunghea CHO ,  Dohyun KIM ,  Jongcheun SEO ,  Junguk JUN ,  Namkyu CHO

IPC: F04C29/12 ,  F04C18/02

CPC classification number: F04C29/12 ,  F04C18/0215

Abstract: A scroll compressor is provided. The scroll compressor includes a fixed scroll having an outlet and multiple release holes, a release valve ring installed on the top surface of the fixed scroll and formed to open and close the multiple release holes, and a retainer ring installed on the release valve ring and formed to restrict the movement of the release valve ring. The release valve ring has a ring shape, and comprises a fixing part, multiple release valves, and at least one connection part. The retainer ring comprises a retainer fixing part, multiple retainers, and at least one retainer connection part connecting at least one of the multiple retainers to the retainer fixing part.

公开(公告)号：US20240342336A1

公开(公告)日：2024-10-17

申请号：US18755195

申请日：2024-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongkwan CHO ,  Youngchul KO ,  Keonpyo KOO ,  Dohyun KIM ,  Kyoungmok KIM ,  Donghyo KIM

IPC: A61L9/20 ,  A61L9/014 ,  B01D53/00 ,  B01D53/04 ,  B01D53/88 ,  B09B3/35 ,  B09B3/38 ,  B09B3/40 ,  B09B101/70

CPC classification number: A61L9/205 ,  A61L9/014 ,  B01D53/007 ,  B01D53/04 ,  B01D53/885 ,  B09B3/35 ,  B09B3/38 ,  B09B3/40 ,  A61L2209/12 ,  A61L2209/22 ,  B01D2253/102 ,  B01D2257/90 ,  B01D2258/0275 ,  B01D2259/804 ,  B09B2101/70

Abstract: A food waste disposal apparatus, according to one embodiment of the present disclosure, comprises: a chamber for accommodating food waste; and a deodorizing device for deodorizing gas inside the chamber. The deodorizing device may comprise: a photocatalyst filter arranged to be inclined; a light source unit for irradiating light having a frequency within a specific range to the photocatalyst filter; and an activated carbon filter in which activated carbon is accommodated so as to deodorize gas passing through the photocatalyst filter.

公开(公告)号：US20240091785A1

公开(公告)日：2024-03-21

申请号：US18237734

申请日：2023-08-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongkwan CHO ,  Youngchul KO ,  Dohyun KIM ,  Jaewan HONG ,  Donghyo KIM ,  Kisup LEE

IPC: B02C18/00 ,  B02C18/12 ,  B02C18/16 ,  B02C23/26

CPC classification number: B02C18/0092 ,  B02C18/12 ,  B02C18/16 ,  B02C23/26

Abstract: A food waste disposer including a housing; a grinding device inside the housing to grind food waste; an exhaust fan inside the housing to form an air flow; an exhaust pipe connected to the exhaust fan to form an exhaust flow path along which air from the grinding device flows via the air flow formed by the exhaust fan; a filter assembly to adsorb contaminants from the air flowing along the exhaust flow path; a branch pipe branching from the exhaust pipe between the grinding device and the exhaust fan to form a connection flow path communicating with the exhaust flow path; and a sterilization device connected to the branch pipe to selectively open and close the connection flow path, and, with the connection flow path being open, generate and supply plasma to the exhaust pipe through the connection flow path via an intake airflow formed by the exhaust fan.

公开(公告)号：US20230287886A1

公开(公告)日：2023-09-14

申请号：US18123712

申请日：2023-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunghea CHO ,  Dohyun KIM ,  Jongcheun SEO

IPC: F04C29/02 ,  F04C18/02

CPC classification number: F04C29/02 ,  F04C18/0215

Abstract: A scroll compressor including a fixed scroll including a wrap accommodation portion having an inner space extending inside the wrap accommodation portion, a thrust surface around the inner space, a fixed wrap in the inner space, and an oil groove on the thrust surface; an orbiting scroll to rotate with respect to the fixed scroll, and including a mirror plate, an orbiting wrap extending from the mirror plate to engage with the fixed wrap, and at least one oil supply groove on the mirror plate facing the thrust surface of the fixed scroll; and a driving motor to rotate the orbiting scroll. When the orbiting scroll rotates, the at least one oil supply groove of the orbiting scroll moves from a first position to receive oil from the oil groove, to a second position to supply the oil to the inner space of the wrap accommodation portion.

公开(公告)号：US20230193901A1

公开(公告)日：2023-06-22

申请号：US17985372

申请日：2022-11-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghea CHO ,  Jongcheun SEO ,  Dohyun KIM

IPC: F04C18/02

CPC classification number: F04C18/0215 ,  F04C2240/50

Abstract: A scroll compressor including a housing, a fixed scroll fixed to an inside of the housing and including a fixed wrap, an orbiting scroll including an orbiting wrap disposed on a first surface of the orbiting scroll facing the fixed scroll to form a compression chamber together with the fixed wrap, and a first receiving groove formed on a second surface, opposite to the first surface, of the orbiting scroll, a frame fixed to the inside of the housing and including a second receiving groove formed on a surface of the frame member facing the second surface of the orbiting scroll, a guide member between the orbiting scroll and the frame to prevent the orbiting scroll from rotating, and a plurality of bearing members some of which are disposed in the first receiving groove and others of which are disposed in the second receiving groove, and each bearing member of the plurality of bearing members includes an inner ring fixed to the guide member.

公开(公告)号：US20250105127A1

公开(公告)日：2025-03-27

申请号：US18659864

申请日：2024-05-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dohyun KIM ,  Yeongseon KIM ,  JUHYEON KIM ,  HYOEUN KIM ,  SUNKYOUNG SEO ,  Haksun LEE

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/48 ,  H01L23/528 ,  H01L23/544 ,  H01L25/10

Abstract: A semiconductor package may include a first dielectric structure, a first pad in the first dielectric structure, a first semiconductor chip provided on the first dielectric structure, and a bump electrically connected to the first pad. The first semiconductor chip includes: a first substrate; a first chip dielectric layer in contact with the first dielectric structure; and a first chip pad in contact with a top surface of the first pad. The first pad may be provided between the bump and the first chip of the first semiconductor chip. The first pad may include a first conductive layer and a second conductive layer covered by the first conductive layer. The bump may be positioned closer to the first conductive layer than to the second conductive layer.

公开(公告)号：US20240290669A1

公开(公告)日：2024-08-29

申请号：US18385082

申请日：2023-10-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunkyoung SEO ,  Dohyun KIM ,  Yeongseon KIM ,  Juhyeon KIM ,  Hyoeun KIM ,  Jeongoh HA

IPC: H01L21/66 ,  H01L23/00 ,  H01L25/065 ,  H10B80/00

CPC classification number: H01L22/32 ,  H01L24/08 ,  H01L25/0657 ,  H10B80/00 ,  H01L2224/08145 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2924/1436

Abstract: A semiconductor structure according to an embodiment may include: an interconnect structure on a substrate; an interlayer dielectric layer on the interconnect structure; a first conductive pad within the interlayer dielectric layer and electrically coupled with the interconnect structure; a second conductive pad within the interlayer dielectric layer and electrically decoupled from the interconnect structure; a first via plug within the interlayer dielectric layer; and a bonding structure on the interlayer dielectric layer and including a first bonding pad, a plurality of second bonding pads, and a bonding dielectric layer, wherein the first bonding pad is electrically coupled to the first via plug, some of the plurality of second bonding pads are spaced apart from the first conductive pad in a vertical direction, and others of the plurality of second bonding pads are spaced apart from the second conductive pad in the vertical direction.

公开(公告)号：US20240243111A1

公开(公告)日：2024-07-18

申请号：US18489493

申请日：2023-10-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chajea JO ,  Dohyun KIM ,  SeungRyong OH

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L23/522 ,  H01L25/065

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/5226 ,  H01L24/16 ,  H01L25/0657 ,  H01L24/17 ,  H01L24/30 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/30181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253

Abstract: A semiconductor package includes a lower package and an upper package on the lower package. The lower package includes a first substrate, chip stacks on the first substrate, a first mold structure on the first substrate that covers the chip stacks, and a second substrate on the first mold structure. The chip stacks include a first semiconductor chip and a second semiconductor chip on the first semiconductor chip. The first semiconductor chip includes a first semiconductor substrate, a first wiring layer adjacent the first semiconductor substrate and including wiring patterns, a first circuit layer on the first semiconductor substrate and including a transistor and circuit wirings connected to the transistor, and a chip through electrode penetrating at least a portion of the first circuit layer and the first semiconductor substrate and a height of the chip through electrode ranges from 2 μm to 50 μm.