公开(公告)号：US12009299B2

公开(公告)日：2024-06-11

申请号：US18137733

申请日：2023-04-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-Hyuk Choi ,  Wonchul Lee ,  Joonhyoung Yang

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/522 ,  H01L23/528 ,  H01L29/06

CPC classification number: H01L23/528 ,  H01L23/5226 ,  H01L29/0649

Abstract: A semiconductor device includes; a semiconductor substrate including a first region and a second region, a first interlayer insulating layer on the second region, a capping layer disposed on the first interlayer insulating layer, an upper surface of the capping layer includes a first trench, conductive patterns spaced apart on the capping layer, side surfaces of the conductive patterns are aligned with inner side surfaces of the first trench, and a peripheral separation pattern disposed in the first trench to cover the side surfaces of the conductive patterns. The peripheral separation pattern has a first thickness on the side surfaces of the conductive patterns and a second thickness greater than or equal to the first thickness on a lower surface.

公开(公告)号：US10452063B2

公开(公告)日：2019-10-22

申请号：US15605056

申请日：2017-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-Eun Ha ,  Chang-Sik Kim ,  Han-Bit Kim ,  In-Hyuk Choi ,  Jae-Woo Choi ,  Youn-Lea Kim ,  Ha-Sik Moon

IPC: G05D1/00 ,  G06F7/00 ,  B64C39/02

Abstract: According to various embodiments, an electronic device for controlling a movement of an unmanned aerial vehicle, the electronic device comprising: a display that displays information associated with the movement of the unmanned aerial vehicle; a user interface disposed to be rotatable around the display and configured to detect an input; at least one processor configured to generate a control signal to control the movement of the unmanned aerial vehicle based on an input through at least one of the display and the user interface; and a communication interface that is configured to transmit the control signal to the unmanned aerial vehicle.

公开(公告)号：US20240282703A1

公开(公告)日：2024-08-22

申请号：US18652628

申请日：2024-05-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-Hyuk Choi ,  Wonchul Lee ,  Joonhyoung Yang

IPC: H01L23/528 ,  H01L23/522 ,  H01L29/06

CPC classification number: H01L23/528 ,  H01L23/5226 ,  H01L29/0649

Abstract: A semiconductor device includes; a semiconductor substrate including a first region and a second region, a first interlayer insulating layer on the second region, a capping layer disposed on the first interlayer insulating layer, an upper surface of the capping layer includes a first trench, conductive patterns spaced apart on the capping layer, side surfaces of the conductive patterns are aligned with inner side surfaces of the first trench, and a peripheral separation pattern disposed in the first trench to cover the side surfaces of the conductive patterns. The peripheral separation pattern has a first thickness on the side surfaces of the conductive patterns and a second thickness greater than or equal to the first thickness on a lower surface.

公开(公告)号：US10693969B2

公开(公告)日：2020-06-23

申请号：US16230918

申请日：2018-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ki-Soo Cho ,  Aravind Iyer ,  Mahesh Anjanappa ,  Ranjeet Kumar Patro ,  Prasad Tirumala Sree Hari Vara Vadlapudi ,  Suck-Ho Seo ,  In-Hyuk Choi ,  Il-Sung Hong ,  Abhijit C Pathak ,  Amit Prabhudesai ,  Ashok Subash ,  Ravindra Balkrishna Shet ,  Dong-Hyoun Son ,  Byeong-Ho Shim ,  Ji-Ryang Chung ,  Kangli Hao ,  Madhavan Vasudevan ,  Mahesh Malagouda Patil ,  M. S. S. K. Sharma ,  Ranjitsinh Udaysinh Wable ,  Shekhar Anantha Ambekar ,  Subba Reddy Venkata Kota ,  Raghavendra Vaddarahalli Ramegowda ,  Varunjith Therath Kainoth ,  Vishwanath Balekudige Gopalakrishna ,  Nam-Kun Kim ,  Young-Ju Kim ,  Jeong-Mi Kim ,  Chang-Sik Kim ,  Hyeong-Geun Kim ,  Shashanka Dasari ,  Gyu-Seok Shim ,  Won-Geun Shim ,  Anil Agiwal ,  Jin-Hyuk Lee ,  Sang-Hyun Han ,  In-Hyup Hwang ,  Ji-Young Hwang

IPC: H04L29/08 ,  H04W76/14 ,  H04W4/80 ,  H04W4/12 ,  H04L29/06 ,  G06F9/54 ,  H04W88/06

Abstract: An apparatus and method for providing one or more protocols for one or more electronic devices are provided. The method includes establishing, by an electronic device configured to provide a framework interface by executing instructions stored in a memory, one or more physical channels with an external electronic device, using one or more communication modules, executing, by the electronic device, two or more application programs to interface with the framework interface, and communicating, via the framework interface, data from the two or more application programs through the one or more physical channels to the external electronic device, using at least one logical channel or session for a respective one of the two or more application programs.

公开(公告)号：US11670591B2

公开(公告)日：2023-06-06

申请号：US17404757

申请日：2021-08-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-Hyuk Choi ,  Wonchul Lee ,  Joonhyoung Yang

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/528 ,  H01L29/06 ,  H01L23/522

CPC classification number: H01L23/528 ,  H01L23/5226 ,  H01L29/0649

Abstract: A semiconductor device includes; a semiconductor substrate including a first region and a second region, a first interlayer insulating layer on the second region, a capping layer disposed on the first interlayer insulating layer, an upper surface of the capping layer includes a first trench, conductive patterns spaced apart on the capping layer, side surfaces of the conductive patterns are aligned with inner side surfaces of the first trench, and a peripheral separation pattern disposed in the first trench to cover the side surfaces of the conductive patterns. The peripheral separation pattern has a first thickness on the side surfaces of the conductive patterns and a second thickness greater than or equal to the first thickness on a lower surface.

公开(公告)号：US10373483B2

公开(公告)日：2019-08-06

申请号：US15896564

申请日：2018-02-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bo-Kun Choi ,  Youn-Lea Kim ,  In-Hyuk Choi ,  Sung-Jun Kim ,  Seung-Nyun Kim

IPC: B64C39/02 ,  B64D47/08 ,  G08C17/02 ,  H04W4/20 ,  G08G5/00 ,  H04L29/08 ,  H04W4/44

Abstract: A system, devices and method are disclosed herein. The system may include a network interface, a memory, the two devices and a processor, which implements the method. The method may include receiving by a first device a location of a second device through the network interface, retrieving by the second device a plurality of media related to the received location, transmitting by the second device the plurality of media to the first device through the network interface, in response to receiving a selection of one of the plurality of media, transmit, through the network interface, transmitting by the first device control information for controlling a particular UAV selected from the plurality of UAVs based on corresponding with the selected one of the plurality of media to the second device.

公开(公告)号：US09974103B2

公开(公告)日：2018-05-15

申请号：US15152148

申请日：2016-05-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaewoo Choi ,  In-Hyuk Choi ,  Gyu-Seok Shim ,  Ki Soo Cho

IPC: H04B7/00 ,  H04W76/02 ,  H04W4/00

CPC classification number: H04W76/14 ,  H04W4/80 ,  H04W76/19

Abstract: Methods and apparatuses are provided for connecting with an external device. A current status of an electronic device is determined when wireless communication with at least one external device is disconnected. A preset time interval corresponding to the current status is determined. An attempt is made to reconnect with the at least one external device based on the preset time interval.