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公开(公告)号:US20180374926A1
公开(公告)日:2018-12-27
申请号:US15861949
申请日:2018-01-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: DONGSOO LEE , WONKEUN CHUNG , HOONJOO NA , SUYOUNG BAE , JAEYEOL SONG , JONGHAN LEE , HYUNGSUK JUNG , SANGJIN HYUN
Abstract: Disclosed are semiconductor devices and methods of manufacturing the same. The semiconductor device comprises a first transistor on a substrate, and a second transistor on the substrate. Each of the first and second transistors includes a plurality of semiconductor patterns vertically stacked on the substrate and vertically spaced apart from each other, and a gate dielectric pattern and a work function pattern filling a space between the semiconductor patterns. The work function pattern of the first transistor includes a first work function metal layer, the work function pattern of the second transistor includes the first work function metal layer and a second work function metal layer, the first work function metal layer of each of the first and second transistors has a work function greater than that of the second work function metal layer, and the first transistor has a threshold voltage less than that of the second transistor.
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公开(公告)号:US20220406914A1
公开(公告)日:2022-12-22
申请号:US17691680
申请日:2022-03-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: JAEHYUN LEE , JONGHAN LEE , HYUNGKOO KANG , JONGHOON BAEK
IPC: H01L29/423 , H01L29/786 , H01L29/06 , H01L27/088 , H01L29/417 , H01L29/49
Abstract: A semiconductor device includes an active fin protruding from a substrate; a plurality of channel layers on the active fin and spaced apart from each other in a vertical direction; a gate pattern intersecting the active fin and the plurality of channel layers; and source/drain regions on recessed regions of the active fin on both sides of the gate pattern. The gate pattern includes a gate dielectric layer, inner conductive layers, and a conductive liner. The inner conductive layers are disposed between the plurality of channel layers, and between the active fin and a lowermost channel layer among the plurality of channel layers. The conductive liner has a first thickness on an upper surface of an uppermost channel layer in the vertical direction, and at least one of the inner conductive layers have a second thickness in the vertical direction. The first thickness is less than the second thickness.
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公开(公告)号:US20210005729A1
公开(公告)日:2021-01-07
申请号:US17024813
申请日:2020-09-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: JONGHAN LEE , WANDON KIM , JAEYEOL SONG , JEONGHYUK YIM , HYUNGSUK JUNG
IPC: H01L29/423 , H01L27/088 , H01L29/51 , H01L21/28 , H01L21/8234 , H01L21/768
Abstract: Disclosed are semiconductor devices and methods of manufacturing the same. The semiconductor device comprises a gate electrode on a substrate, an upper capping pattern on the gate electrode, and a lower capping pattern between the gate electrode and the upper capping pattern. The lower capping pattern comprises a first portion between the gate electrode and the upper capping pattern, and a plurality of second portions extending from the first portion onto corresponding side surfaces of the upper capping pattern. The upper capping pattern covers a topmost surface of each of the second portions.
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公开(公告)号:US20190165114A1
公开(公告)日:2019-05-30
申请号:US15990983
申请日:2018-05-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: JONGHAN LEE , WANDON KIM , JAEYEOL SONG , JEONGHYUK YIM , HyungSuk JUNG
IPC: H01L29/423 , H01L21/28 , H01L29/51 , H01L27/088
Abstract: Disclosed are semiconductor devices and methods of manufacturing the same. The semiconductor device comprises a gate electrode on a substrate, an upper capping pattern on the gate electrode, and a lower capping pattern between the gate electrode and the upper capping pattern. The lower capping pattern comprises a first portion between the gate electrode and the upper capping pattern, and a plurality of second portions extending from the first portion onto corresponding side surfaces of the upper capping pattern. The upper capping pattern covers a topmost surface of each of the second portions.
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