公开(公告)号：US20190198489A1

公开(公告)日：2019-06-27

申请号：US16162598

申请日：2018-10-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Choon KIM ,  Young-Deuk KIM ,  Woo-Hyun PARK

IPC: H01L25/18 ,  H05K1/18 ,  H01L23/427

Abstract: An electronic device includes a substrate, a first electronic product arranged on the substrate, a second electronic product arranged on the substrate to be spaced apart from the first electronic product, and a heat dissipating assembly covering the first and second electronic products, the heat dissipating assembly comprising a heat dissipating chamber including a hermetically sealed space having a first portion having one or more gaps in which a flowable heat dissipation fluid is disposed and having a second portion in which a solid thermal conductive member is disposed to prevent the flow of the heat dissipation fluid across the second portion with respect to a plan view, wherein the first portion of the heat dissipating chamber has a first thermal conductivity and overlaps with the first electronic product in the plan view, wherein the solid thermal conductive member has a second thermal conductivity less than the first thermal conductivity, wherein the solid thermal conductive member overlaps with the second electronic product in the plan view, wherein the overlapping area of the solid thermal conductive member with the second electronic product is greater than 50% of an area of the second electronic product in the plan view.

公开(公告)号：US20210398870A1

公开(公告)日：2021-12-23

申请号：US17462269

申请日：2021-08-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-Tae HWANG ,  Jae-Choon KIM ,  Kyung-Suk OH ,  Woon-Bae KIM ,  Jae-Min JUNG

IPC: H01L23/31 ,  H01L23/498 ,  H05K1/14

Abstract: A chip on film package includes: a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.

公开(公告)号：US20160372423A1

公开(公告)日：2016-12-22

申请号：US15156327

申请日：2016-05-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mi-Na CHOI ,  Young-Deuk KIM ,  Jae-Choon KIM ,  Eon-Soo JANG ,  Hee-Jung HWANG

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L23/562 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/49175 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/45099

Abstract: A package substrate may include an insulating substrate, internal circuits and a warpage-suppressing member. The insulating substrate may have a plurality of mount regions in which semiconductor chips may be mounted, and a peripheral region. The internal circuits may be arranged in the mount regions. The warpage-suppressing member is different from the semiconductor chips and may be arranged in at least one of the mount regions to suppress a warpage of the insulating substrate. Thus, warpage of the package substrate may be suppressed during a reflow process.

Abstract translation: 封装基板可以包括绝缘基板，内部电路和翘曲抑制部件。 绝缘基板可以具有可以安装半导体芯片的多个安装区域和周边区域。 内部电路可以布置在安装区域中。 翘曲抑制部件与半导体芯片不同，并且可以布置在至少一个安装区域中，以抑制绝缘基板的翘曲。 因此，可以在回流工艺期间抑制封装衬底的翘曲。