公开(公告)号：US20240353484A1

公开(公告)日：2024-10-24

申请号：US18591091

申请日：2024-02-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinhyuk Choi ,  Sumin Park ,  Myungki Song ,  Kongwoo Lee ,  Kyusang Lee ,  Beomsoo Hwang ,  Jayul Kim

IPC: G01R31/28

CPC classification number: G01R31/2891 ,  G01R31/2893

Abstract: A measuring apparatus for a semiconductor device includes a lower frame that provides a lower measurement space configured for performing a first measurement process, a lower measuring portion in the lower frame and configured to measure the first semiconductor substrate on a lower substrate stage, a lower vibration damping portion configured to offset a first vibration of the lower measuring portion with respect to a ground, an upper frame that provides an upper measurement space configured for performing a second measurement process, an upper measuring portion in the upper frame to measure a second semiconductor substrate=on an upper substrate stage, an upper vibration damping portion configured to offset a second vibration of the upper measuring portion with respect to the ground, and a plurality of support structures that support the upper frame such that the upper frame is spaced apart from the lower frame.