公开(公告)号：US20240178025A1

公开(公告)日：2024-05-30

申请号：US18217020

申请日：2023-06-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunwoong Choi ,  Kongwoo Lee ,  Beomsoo Hwang ,  Myungki Song ,  Kyusang Lee ,  Jinhyuk Choi

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68

CPC classification number: H01L21/67288 ,  H01L21/67265 ,  H01L21/67742 ,  H01L21/681

Abstract: A semiconductor processing device includes a stage configured to receive a bare wafer placed thereon, a laser sensor located above the stage in a vertical direction, orthogonal to an upper surface of the bare wafer, a camera sensor located above the stage in a first direction, a lighting device radiating an imaging region imaged by camera sensor with light, and a controller, configured to rotate the bare wafer using the stage, obtain a plurality of sub-images of the bare wafer captured by the camera sensor to generate an original image of the bare ware, and detect a first defect of the bare wafer using the original image, wherein the controller is configured to detect a second defect of the bare wafer by measuring a distance between the laser sensor and the bare wafer, while rotating the bare wafer using the stage.

公开(公告)号：US12224191B2

公开(公告)日：2025-02-11

申请号：US18117259

申请日：2023-03-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Beomsoo Hwang ,  Kongwoo Lee ,  Myungki Song ,  Kyusang Lee ,  Seojoo Choi ,  Jinhyuk Choi

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/687

Abstract: A wafer transfer apparatus includes a controller, a wafer transfer robot including a hand unit configured to hold a wafer, a driving unit connected to the hand unit and configured to move the wafer, and a sensor unit provided on the driving unit, and a plurality of transfer structures configured to exchange the wafer with the wafer transfer robot, each of the plurality of transfer structures including a plurality of markers recognizable by the sensor unit, where the sensor unit includes a camera sensor recognizing the plurality of markers and a laser sensor configured to measure distances to the plurality of markers by emitting a laser to the plurality of markers and receiving the laser reflected from the plurality of markers.

公开(公告)号：US20240353484A1

公开(公告)日：2024-10-24

申请号：US18591091

申请日：2024-02-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinhyuk Choi ,  Sumin Park ,  Myungki Song ,  Kongwoo Lee ,  Kyusang Lee ,  Beomsoo Hwang ,  Jayul Kim

IPC: G01R31/28

CPC classification number: G01R31/2891 ,  G01R31/2893

Abstract: A measuring apparatus for a semiconductor device includes a lower frame that provides a lower measurement space configured for performing a first measurement process, a lower measuring portion in the lower frame and configured to measure the first semiconductor substrate on a lower substrate stage, a lower vibration damping portion configured to offset a first vibration of the lower measuring portion with respect to a ground, an upper frame that provides an upper measurement space configured for performing a second measurement process, an upper measuring portion in the upper frame to measure a second semiconductor substrate=on an upper substrate stage, an upper vibration damping portion configured to offset a second vibration of the upper measuring portion with respect to the ground, and a plurality of support structures that support the upper frame such that the upper frame is spaced apart from the lower frame.

公开(公告)号：US12217984B2

公开(公告)日：2025-02-04

申请号：US17722838

申请日：2022-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhyuk Choi ,  Myungki Song ,  Kongwoo Lee ,  Kyusang Lee ,  Beomsoo Hwang ,  Keonwoo Kim ,  Jonghwi Seo

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

Abstract: A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the plurality of EFEMs may include an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to overlap with at least one of the plurality of load ports in a vertical direction.

公开(公告)号：US20230080991A1

公开(公告)日：2023-03-16

申请号：US17722838

申请日：2022-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhyuk Choi ,  Myungki Song ,  Kongwoo Lee ,  Kyusang Lee ,  Beomsoo Hwang ,  Keonwoo Kim ,  Jonghwi Seo

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677

Abstract: A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the plurality of EFEMs may include an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to overlap with at least one of the plurality of load ports in a vertical direction.

公开(公告)号：US20240021452A1

公开(公告)日：2024-01-18

申请号：US18117259

申请日：2023-03-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Beomsoo Hwang ,  Kongwoo Lee ,  Myungki Song ,  Kyusang Lee ,  Seojoo Choi ,  Jinhyuk Choi

IPC: H01L21/67 ,  H01L21/687 ,  B65G47/90

CPC classification number: H01L21/67259 ,  H01L21/67201 ,  H01L21/68707 ,  B65G47/905 ,  B65G47/907

Abstract: A wafer transfer apparatus includes a controller, a wafer transfer robot including a hand unit configured to hold a wafer, a driving unit connected to the hand unit and configured to move the wafer, and a sensor unit provided on the driving unit, and a plurality of transfer structures configured to exchange the wafer with the wafer transfer robot, each of the plurality of transfer structures including a plurality of markers recognizable by the sensor unit, where the sensor unit includes a camera sensor recognizing the plurality of markers and a laser sensor configured to measure distances to the plurality of markers by emitting a laser to the plurality of markers and receiving the laser reflected from the plurality of markers.

公开(公告)号：US20230230865A1

公开(公告)日：2023-07-20

申请号：US18062285

申请日：2022-12-06

Applicant: Samsung Electronics Co., Ltd

Inventor： Jinhyuk CHOI ,  Kongwoo Lee ,  Beomsoo Hwang ,  Myungki Song ,  Duckjin Kim ,  Kyusang Lee ,  Hyunjoo Jeon

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67742 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67201 ,  H01L21/67745

Abstract: A semiconductor substrate processing apparatus includes a substrate transfer module including a chamber having an internal space extending in a first direction within the chamber, at least one pair of first load ports at opposite sides of the chamber, to face in a second direction intersecting the first direction, and configured to rotate and move a substrate carrier, a load lock at a rear surface of the chamber, and a robot arm configured to move in the first direction in the internal space of the chamber, a transfer chamber connected to the load lock of the substrate transfer module, a plurality of processing chambers connected to the transfer chamber, and a transfer arm inside the transfer chamber, and configured to unload the semiconductor substrate from the load lock and to load the semiconductor substrate into at least one of the plurality of processing chambers.