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公开(公告)号：US20240353484A1
公开(公告)日：2024-10-24
申请号：US18591091
申请日：2024-02-29
发明人： Jinhyuk Choi , Sumin Park , Myungki Song , Kongwoo Lee , Kyusang Lee , Beomsoo Hwang , Jayul Kim
IPC分类号： G01R31/28
CPC分类号： G01R31/2891 , G01R31/2893
摘要： A measuring apparatus for a semiconductor device includes a lower frame that provides a lower measurement space configured for performing a first measurement process, a lower measuring portion in the lower frame and configured to measure the first semiconductor substrate on a lower substrate stage, a lower vibration damping portion configured to offset a first vibration of the lower measuring portion with respect to a ground, an upper frame that provides an upper measurement space configured for performing a second measurement process, an upper measuring portion in the upper frame to measure a second semiconductor substrate=on an upper substrate stage, an upper vibration damping portion configured to offset a second vibration of the upper measuring portion with respect to the ground, and a plurality of support structures that support the upper frame such that the upper frame is spaced apart from the lower frame.
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公开(公告)号：US11756314B2
公开(公告)日：2023-09-12
申请号：US17039259
申请日：2020-09-30
发明人： Jinhyuk Choi
IPC分类号： G06V20/56 , B60W30/09 , B60W30/095 , B60W10/20 , B60W40/105 , G06N3/04 , G06N3/08 , G06V20/58 , G06F18/21 , G06F18/22 , G06V10/764 , G06V10/82 , B60W10/06
CPC分类号： G06V20/588 , B60W10/20 , B60W30/09 , B60W30/0956 , B60W40/105 , G06F18/21 , G06F18/22 , G06N3/04 , G06N3/08 , G06V10/764 , G06V10/82 , G06V20/58 , G06V20/584 , B60W10/06 , B60W2420/42 , B60W2510/0638 , B60W2520/10 , B60W2520/28 , B60W2540/18 , B60W2552/53
摘要： An electronic device, to detect an object, may continuously obtain a driving image and convert the driving image into a top-view image, generate a change value including a horizontal change value based on a steering angle and a vertical change value based on a vehicle speed, compensate the top-view image based on a plurality of lanes to generate first data and compensate the first data based on the change value to generate second data, generate third data based on performing a subtraction operation on a first frame and a second frame of the second data, and a group the third data and extract a grouped object.
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公开(公告)号：US20240178025A1
公开(公告)日：2024-05-30
申请号：US18217020
申请日：2023-06-30
发明人： Hyunwoong Choi , Kongwoo Lee , Beomsoo Hwang , Myungki Song , Kyusang Lee , Jinhyuk Choi
IPC分类号： H01L21/67 , H01L21/677 , H01L21/68
CPC分类号： H01L21/67288 , H01L21/67265 , H01L21/67742 , H01L21/681
摘要： A semiconductor processing device includes a stage configured to receive a bare wafer placed thereon, a laser sensor located above the stage in a vertical direction, orthogonal to an upper surface of the bare wafer, a camera sensor located above the stage in a first direction, a lighting device radiating an imaging region imaged by camera sensor with light, and a controller, configured to rotate the bare wafer using the stage, obtain a plurality of sub-images of the bare wafer captured by the camera sensor to generate an original image of the bare ware, and detect a first defect of the bare wafer using the original image, wherein the controller is configured to detect a second defect of the bare wafer by measuring a distance between the laser sensor and the bare wafer, while rotating the bare wafer using the stage.
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公开(公告)号：US11994562B2
公开(公告)日：2024-05-28
申请号：US17309295
申请日：2019-11-18
发明人： Sengtai Lee , Daejin Kwak , Jisu Ryu , Yonghyun Park , Jinhyuk Choi , Yonghwan Hyun
IPC分类号： G01R31/3835 , G01R31/392 , H02J7/00 , G01R31/36
CPC分类号： G01R31/3835 , G01R31/392 , H02J7/0029 , H02J7/0049 , G01R31/3646
摘要： Various embodiments of the present invention relate to an electronic device for diagnosing a battery, and the electronic device may include a battery; and a power management module operatively connected with the battery, and including a charging circuit which controls charge of the battery, wherein the power management module is configured to monitor a charge state of the battery, if the battery reaches a first designated state, identify a time taken to change from the first designated state to a second designated state, and determine whether the battery is abnormal, based at least in part on the identified time. Other various embodiments are possible.
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公开(公告)号：US11804393B2
公开(公告)日：2023-10-31
申请号：US17718574
申请日：2022-04-12
发明人： Jinhyuk Choi , Jonghwi Seo , Kongwoo Lee , Beomsoo Hwang
IPC分类号： H01L21/677 , H01L21/687 , H01L21/67
CPC分类号： H01L21/67745 , H01L21/67167 , H01L21/68707
摘要： A wafer processing apparatus of an embodiment of the present disclosure may include an equipment front end module (EFEM), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. In addition, the EFEM may include an atmosphere control chamber configured to store a wafer carrier accommodating wafers, an upper air supplier configured to supply air into the atmosphere control chamber, an EFEM chamber under the atmosphere control chamber, a load lock arranged to be vertically overlapped by at least a portion of the EFEM chamber, and an EFEM arm configured to transfer the wafer carrier.
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公开(公告)号：US20230080991A1
公开(公告)日：2023-03-16
申请号：US17722838
申请日：2022-04-18
发明人： Jinhyuk Choi , Myungki Song , Kongwoo Lee , Kyusang Lee , Beomsoo Hwang , Keonwoo Kim , Jonghwi Seo
IPC分类号： H01L21/67 , H01L21/687 , H01L21/677
摘要： A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the plurality of EFEMs may include an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to overlap with at least one of the plurality of load ports in a vertical direction.
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7.发明授权公开(公告)号：US11933851B2
公开(公告)日：2024-03-19
申请号：US16968906
申请日：2019-02-21
发明人： Yonghwan Hyun , Sengtai Lee , Jinhyuk Choi
IPC分类号： G01R31/36 , G01R31/387 , H01M10/44 , H02J7/00
CPC分类号： G01R31/3648 , G01R31/3646 , G01R31/387 , H01M10/44 , H02J7/00714
摘要： According to various embodiments of the present invention, an electronic device may comprise a battery, a power management module, and a processor. The processor may be configured to: acquire power for battery charging from a source outside the electronic device through the power management module, charge the battery at a designated current value by using the power, check charging state information based on charging time and battery capacity according to charging in a designated charging state measurement interval after the charging is started, and when the charging state information satisfies a given condition, perform a designated operation associated with the battery. Various other embodiments are also possible.
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8.发明公开公开(公告)号：US20240021452A1
公开(公告)日：2024-01-18
申请号：US18117259
申请日：2023-03-03
发明人： Beomsoo Hwang , Kongwoo Lee , Myungki Song , Kyusang Lee , Seojoo Choi , Jinhyuk Choi
IPC分类号： H01L21/67 , H01L21/687 , B65G47/90
CPC分类号： H01L21/67259 , H01L21/67201 , H01L21/68707 , B65G47/905 , B65G47/907
摘要： A wafer transfer apparatus includes a controller, a wafer transfer robot including a hand unit configured to hold a wafer, a driving unit connected to the hand unit and configured to move the wafer, and a sensor unit provided on the driving unit, and a plurality of transfer structures configured to exchange the wafer with the wafer transfer robot, each of the plurality of transfer structures including a plurality of markers recognizable by the sensor unit, where the sensor unit includes a camera sensor recognizing the plurality of markers and a laser sensor configured to measure distances to the plurality of markers by emitting a laser to the plurality of markers and receiving the laser reflected from the plurality of markers.
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公开(公告)号：US20230072147A1
公开(公告)日：2023-03-09
申请号：US17718574
申请日：2022-04-12
发明人： Jinhyuk Choi , Jonghwi Seo , Kongwoo Lee , Beomsoo Hwang
IPC分类号： H01L21/677 , H01L21/67 , H01L21/687
摘要： A wafer processing apparatus of an embodiment of the present disclosure may include an equipment front end module (EFEM), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. In addition, the EFEM may include an atmosphere control chamber configured to store a wafer carrier accommodating wafers, an upper air supplier configured to supply air into the atmosphere control chamber, an EFEM chamber under the atmosphere control chamber, a load lock arranged to be vertically overlapped by at least a portion of the EFEM chamber, and an EFEM arm configured to transfer the wafer carrier.
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公开(公告)号：US11557052B2
公开(公告)日：2023-01-17
申请号：US17173803
申请日：2021-02-11
发明人： Jinhyuk Choi
摘要： Vanishing point extraction includes obtaining a straight line including a vanishing point of a first image; obtaining a plurality of sample points in the first image based on processing the first image according to an object included in the first image and the straight line including the vanishing point of a first image, such that the plurality of sample points are determined as pixels in the first image having coordinates that overlap with coordinates of pixels of both the straight line and the object included in the first image; obtaining at least one matching point, in a second image, that corresponds to at least one sample point of the plurality of sample points in the first image the second image generated subsequently to the first image being generated; and obtaining a vanishing point of the second image based on the at least one matching point of the second image.
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