公开(公告)号：US09772296B2

公开(公告)日：2017-09-26

申请号：US14460814

申请日：2014-08-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung-Bok Kang ,  Seok-Min Kang ,  Bon-Ok Koo ,  Kyoung-Hwan Kim ,  Myung-Woo Kim ,  In-Gi Kim ,  Hyun-Chul Kim ,  Sung-Ki Roh ,  Gyung-Jin Min ,  Eun-Seok Lee ,  Jin-Suk Hong

IPC: G01N21/95 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/8851 ,  G01N2021/8887

Abstract: In a method of inspecting a surface of a substrate, a first surface image of the substrate before loaded into a process chamber may be obtained. The first surface image may be processed to detect a defect on the surface of the substrate. Thus, the surfaces of all of the substrate may be inspected during a process may be performed without transferring the substrates.

公开(公告)号：US09999957B2

公开(公告)日：2018-06-19

申请号：US15001410

申请日：2016-01-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun-Seok Choi ,  Chang-Gil Ryu ,  Geun-Young Song ,  Ki-Yeon Chu ,  Jin-Suk Hong

IPC: B24B37/32 ,  B24B55/02 ,  B24B37/30

CPC classification number: B24B37/32 ,  B24B37/30 ,  B24B55/02

Abstract: A polishing head includes a substrate carrier to suck and to pressurize a substrate, and a retainer ring secured under the substrate carrier, the retainer ring surrounding a circumference of the substrate and including a cooling channel therethrough to circulate a coolant fluid.

公开(公告)号：US10340158B2

公开(公告)日：2019-07-02

申请号：US15058277

申请日：2016-03-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun-Seok Lee ,  Chang-Gil Ryu ,  Geun-Young Song ,  Jae-Chang Lee ,  Yun-Seok Choi ,  Jin-Suk Hong

IPC: H01L21/67 ,  B08B3/10 ,  B08B1/04 ,  B08B3/02 ,  B05B1/20 ,  B05B13/04 ,  B08B1/00

Abstract: Provided is a substrate cleaning apparatus including: a cleaning bath configured to accommodate a substrate having a first surface and a second surface; a substrate support configured to support the substrate; first and second nozzle bars provided in the cleaning bath to be rotatable in a plane parallel with the substrate, each of the first and the second nozzle bars including a passage; a plurality of nozzles provided along a longitudinal direction of each of the first and the second nozzle bars and configured to spray the cleaning solution from the passage of each of the first and the second nozzle bars to the substrate; and first and second brushes, the first brush provided on a first side of the substrate and configured to clean the first surface and the second brush provided on a second side of the substrate and configured to clean the second surface of the substrate.