公开(公告)号：US20170352640A1

公开(公告)日：2017-12-07

申请号：US15684425

申请日：2017-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： JaeYong PARK ,  Junyoung KO ,  Whasu SIN ,  Kyhyun JUNG

IPC: H01L23/00 ,  B23K1/005 ,  B23K26/38 ,  H05K13/04 ,  B23K1/00 ,  B23K1/018 ,  B23K101/42

CPC classification number: H01L24/799 ,  B23K1/0016 ,  B23K1/0056 ,  B23K1/018 ,  B23K26/38 ,  B23K2101/42 ,  H01L24/98 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K13/0486 ,  Y10T29/49821 ,  Y10T29/53274

Abstract: A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.

公开(公告)号：US20150179601A1

公开(公告)日：2015-06-25

申请号：US14632657

申请日：2015-02-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： JaeYong PARK ,  Junyoung KO ,  Whasu SIN ,  Kyhyun JUNG

IPC: H01L23/00 ,  B23K1/018 ,  B23K26/38

CPC classification number: H01L24/799 ,  B23K1/0016 ,  B23K1/0056 ,  B23K1/018 ,  B23K26/38 ,  B23K2101/42 ,  H01L24/98 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K13/0486 ,  Y10T29/49821 ,  Y10T29/53274

Abstract: An apparatus for removing a semiconductor chip from a board may include: a laser configured to irradiate the board with a laser beam to heat bumps mounting the semiconductor chip on the board; a picker configured to separate the semiconductor chip from the board; a vacuum portion configured to provide a vacuum to the picker; and an intake. If solder pillars, that are residues of the bumps, are melted by the laser beam, the intake removes the solder pillars using the vacuum provided from the vacuum portion. An apparatus for removing a semiconductor chip from a board may include: a stage configured to support the board on which the semiconductor chip is mounted by bumps; a laser configured to irradiate the board with a laser beam to heat the bumps mounting the semiconductor chip on the board; and a picker configured to separate the semiconductor chip from the board.

Abstract translation: 一种用于从板上去除半导体芯片的装置可以包括：激光器，被配置成用激光束照射板，以加热将半导体芯片安装在板上的凸块; 拾取器，被配置为将半导体芯片与板分离; 真空部分，被配置为向拾取器提供真空; 和摄入。 如果作为凸块的残留物的焊料柱被激光束熔化，则吸入件使用从真空部分提供的真空去除焊料柱。 用于从板上去除半导体芯片的装置可以包括：被配置为通过凸块来支撑半导体芯片安装在其上的板的台; 激光器，被配置为用激光束照射所述板，以加热将所述半导体芯片安装在所述板上的所述凸块; 以及构造成将半导体芯片与板分离的拾取器。