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公开(公告)号:US20210182558A1
公开(公告)日:2021-06-17
申请号:US16761957
申请日:2018-04-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Do Gon KIM , Kyung Su KIM , Sung Jin KIM , Kumar ANKIT , Gang Hui LEE , Hyung Min LEE , Jae Hyun PARK
Abstract: The present invention relates to an artificial intelligence (AI), which emulates functions of a human brain, such as recognition and reasoning, by utilizing a machine learning algorithm such as deep learning, and relates to context awareness based artificial intelligence application technology for obtaining interest information of a user from an image displayed to the user. An electronic device, according to one embodiment of the present invention acquires context data related to the image, and uses the context data to select a node of interest corresponding to the context data from among nodes of an index tree for searching for sample images which correspond to candidate objects extracted from the image by using a model generated as a result of machine learning, wherein the node of interest is selected by using a result of comparison between a subject of each node of the index tree and the context data; and an object of interest is selected from among the candidate objects included in the image by using the node of interest.
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公开(公告)号:US20240234177A1
公开(公告)日:2024-07-11
申请号:US18495224
申请日:2023-10-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hun Yong PARK , Yeon Tae KIM , Jang Hwi LEE , Sang Woo BAE , Kyung Su KIM , Tae Soon PARK , Jung Chul LEE , Sung Ho JANG , Won Don JOO
IPC: H01L21/67 , C23C16/44 , C23C16/452 , H01L21/02
CPC classification number: H01L21/67115 , C23C16/4412 , C23C16/452 , H01L21/0228
Abstract: A wafer processing apparatus may include a chamber providing an internal space; and a first rib on an outer side of a first sidewall of the chamber. An outer side of the first rib may include a first portion and a second portion. A light transmittance of the first portion may be different from a light transmittance of the second portion.
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