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1.发明申请公开(公告)号：US20230023401A1
公开(公告)日：2023-01-26
申请号：US17958694
申请日：2022-10-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hoondo HEO , Minuk KIM , Kyungtae NAM , Valeriy PRUSHINSKIY , Sanggon SHIN , Sunmyung LEE , Suk HYUN
Abstract: An electronic device includes a cover window defining a front surface of the electronic device; a first sensor provided under the cover window and configured to detect a pressure applied to the cover window; a second sensor provided on a same layer as the first sensor and configured to detect the pressure applied to the cover window; a first adhesive member provided on at least one area under the second sensor, wherein the second sensor is less deformed than the first sensor by the pressure applied to the cover window provided by the first adhesive member; and a processor configured to: acquire a first pressure change amount detected by the first sensor and a second pressure change amount detected by the second sensor; and detect the pressure applied to the cover window based on the first pressure change amount and the second pressure change amount.
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公开(公告)号：US20240098352A1
公开(公告)日：2024-03-21
申请号：US18521098
申请日：2023-11-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yongjae LEE , Kyungtae NAM , Valeriy PRUSHINSKIY , Bonggyo SEO
Abstract: A lens assembly is provided. The lens assembly includes an image sensor, at least four lenses successively arranged along an optical axis from an object side toward the image sensor side, and at least one band pass filter having a transmittance of 90% to 90% with regard to at least some of light in the wavelength area of 800˜1000 nm. At least one of the lenses is disposed between the band pass filter and the image sensor. With regard to light in the wavelength area of 400˜700 nm, at least one of the lenses has a transmittance of 0% to 10%, and all of the lenses have an average transmittance of 0% to 5%.
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公开(公告)号：US20230247789A1
公开(公告)日：2023-08-03
申请号：US18296664
申请日：2023-04-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chaeup YOO , Sanggon Shin , Kyungtae NAM , Oleg FEYGENSON , Hyungjin KIM , Jungkyu LEE
CPC classification number: H05K7/1427 , H05K1/0277 , H04M1/0277 , H01Q1/12
Abstract: An electronic device may include a housing comprising a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a third surface surrounding the space formed by the first surface and the second surface; a metal frame forming at least one region of the housing, the metal frame comprising a groove formed at a first point; a flexible printed circuit board (FPCB) disposed in the inner space of the housing; a conductive connection member coupled to the FPCB, a first portion of the conductive connection member being fixed in one region of the FPCB, and a second portion of the conductive connection member having elasticity; and a wireless communication circuit disposed on the FPCB or electrically connected to the FPCB, wherein: the second portion of the conductive connection member is at least partially inserted into the groove of the metal frame; and the wireless communication circuit transmits and receives signals in a designated frequency band by supplying power to the metal frame at the first point through the FPCB and the conductive connection member.
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公开(公告)号：US20230023774A1
公开(公告)日：2023-01-26
申请号：US17696968
申请日：2022-03-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Minkwan KIM , Daeeun JEONG , Kyungtae NAM
Abstract: A method of manufacturing a magnetoresistive random-access memory (MRAM) device includes forming an insulating interlayer on a substrate, forming a contact plug extending through the insulating interlayer, forming a first blocking layer covering an upper surface of the contact plug, the first blocking layer including an amorphous material, forming a lower electrode layer on the first blocking layer, and forming a magnetic tunnel junction structure layer on the lower electrode layer.
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