DIELECTRIC STRUCTURE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

    公开(公告)号:US20240274661A1

    公开(公告)日:2024-08-15

    申请号:US18507606

    申请日:2023-11-13

    CPC classification number: H01L29/0657 H01L29/0692

    Abstract: A dielectric structure may include: an insulating layer extending in a first direction; a plurality of conductor layers disposed on a first surface of the insulating layer and spaced apart from each other in the first direction; at least one semiconductor layer disposed on a second surface of the insulating layer, opposite to the first surface, and overlapping each of at least two conductor layers adjacent to each other among the plurality of conductor layers in a second direction intersecting the first direction; a first protective layer covering the plurality of conductor layers on the first surface of the insulating layer; and a second protective layer covering the at least one semiconductor layer on the second surface of the insulating layer.

    SUBSTRATE SUPPORT, THIN FILM PROCESSING DEVICE, AND THIN FILM DEPOSITION CONTROL METHOD USING THE SAME

    公开(公告)号:US20250075323A1

    公开(公告)日:2025-03-06

    申请号:US18442991

    申请日:2024-02-15

    Abstract: A substrate support according to an embodiment includes: a body portion that has a substrate disposition surface at an upper portion thereof; an RF electrode that is disposed inside the body portion; a heater electrode that is disposed below the RF electrode; and a shaft that is formed on a lower portion surface disposed at an opposite side of the substrate disposition surface and has a hollow. The RF electrode includes a first outer RF electrode surrounding the outside of the substrate disposition surface, an inner RF electrode disposed parallel to the substrate disposition surface below the substrate disposition surface, a second outer RF electrode disposed between the inner RF electrode and the heater electrode, an inner electrode conductor having one end connected to the inner RF electrode to be disposed to penetrate the shaft, and an outer electrode conductor having one end connected to the second outer RF electrode to be disposed to penetrate the shaft, and the first outer RF electrode, the inner RF electrode, and the second outer RF electrode are spaced apart from each other to have a non-contact structure.

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