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公开(公告)号:US20230266258A1
公开(公告)日:2023-08-24
申请号:US18113121
申请日:2023-02-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: INHYE PARK , SUYOUNG LEE , YUJIN CHO , JONG CHEON SUN , CHUNGSAM JUN
IPC: G01N23/2251
CPC classification number: G01N23/2251 , G01N2223/6116 , G01N2223/646
Abstract: A method of inspecting a semiconductor device includes charging an inspection region of a semiconductor device using a charging electron beam, and scanning the inspection region using a scanning electron beam. The charging of the inspection region includes dividing the inspection region into a charging region and a non-charging region, and charging the charging region using the charging electron beam. The scanning of the inspection region includes irradiating the scanning electron beam to the inspection region, and detecting secondary electrons emitted from the inspection region by the scanning electron beam.
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公开(公告)号:US20230197402A1
公开(公告)日:2023-06-22
申请号:US17891204
申请日:2022-08-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: YUJIN CHO , JONGHYUK KANG , INHYE PARK , SUYOUNG LEE , CHUNGSAM JUN , HONGCHE NOH , JANGHEE LEE
IPC: H01J37/28 , H01J37/244 , H01J37/26 , H01J37/147
CPC classification number: H01J37/28 , H01J37/244 , H01J37/265 , H01J37/1471 , H01J2237/2817 , H01J2237/0048 , H01J2237/24592
Abstract: Disclosed are semiconductor inspection apparatuses and methods. The semiconductor inspection apparatus comprises a stage that supports a semiconductor device, a first column that irradiates a first electron beam toward the semiconductor device on the stage, a second column that irradiates a second electron beam toward the semiconductor device, and a detector that detects a secondary electron generated by the second electron beam. The first column is disposed to make a first angle with a top surface of the semiconductor device. The second column is disposed to make a second angle with the top surface of the semiconductor device. The first angle and the second angle are different from each other.
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公开(公告)号:US20240175915A1
公开(公告)日:2024-05-30
申请号:US18203138
申请日:2023-05-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: SEKYE JEON , JINWOO LEE , JONGCHEON SUN , SUYOUNG LEE , HYEONGCHEOL LEE , CHUNGSAM JUN
IPC: G01R31/28
CPC classification number: G01R31/2853 , G01R31/287
Abstract: In a substrate inspection method, a substrate is provided on a substrate stage, the substrate having internal wires and connection wires, the internal wires respectively provided between stacked insulating layers, the connection wires respectively extending from the internal wires and exposed to an upper surface of the substrate. An electric circuit of the internal wires in the substrate is modeled to generate a circuit model. AC power is applied to the substrate stage to obtain measured capacitance values of the internal wires through currents that are obtained from the connection wires. DC power is applied to the substrate stage to obtain measured resistance values of the internal wires through voltages that are obtained from the connection wires. Impedance values of the internal wires are calculated through the measured capacitance values and the measured resistance values. The impedance values and the circuit model are compared to determine reliability of the substrate.
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公开(公告)号:US20170133199A1
公开(公告)日:2017-05-11
申请号:US15252828
申请日:2016-08-31
Applicant: Samsung Electronics Co., Ltd.
Inventor: SUYOUNG LEE , TAMAMUSHI SHUICHI , BYUNGGOOK KIM , BYOUNGSUP AHN
IPC: H01J37/302 , H01J37/24 , G03F7/20 , H01J37/04
CPC classification number: H01J37/302 , H01J37/045 , H01J37/3177 , H01J2237/0432 , H01J2237/0437
Abstract: A system includes an aperture array comprising a plurality of active apertures, respective ones of the active apertures configured to selectively deflect beams passing therethrough. The system also includes a limiting aperture configured to pass beams not deflected by the active apertures to a target object. The system further includes a control circuit configured to control the active apertures to provide first and second different exposure duration resolutions.
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