-
1.发明授权公开(公告)号：US11837573B2
公开(公告)日：2023-12-05
申请号：US17166805
申请日：2021-02-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junhyung Kim , Joongha Lee , Sangha Park , Sunghyup Kim , Kyeongbin Lim
IPC: H01L23/00
CPC classification number: H01L24/75 , H01L2224/75252 , H01L2224/75303 , H01L2224/75502 , H01L2924/3511
Abstract: A chip bonding apparatus includes: a bonding contact configured to apply a bonding force to a semiconductor chip disposed on a substrate, the bonding contact having a first surface configured to face the semiconductor chip and a second surface opposite the first surface, the bonding contact including a protruding portion on the first surface, the protruding portion configured to contact the semiconductor chip, the bonding contact including a cavity formed in a region vertically overlapping the protruding portion, a heater disposed to be in contact with the second surface of the bonding contact to cover the cavity, and configured to heat the bonding contact, a bonding head disposed above the heater and configured to transmit the bonding force, and a partition wall structure protruding from a bottom surface of the cavity to partition an inner space of the cavity.
-
公开(公告)号：US11341973B2
公开(公告)日：2022-05-24
申请号：US16474465
申请日：2017-12-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Cheheung Kim , Sungchan Kang , Sangha Park , Yongseop Yoon , Choongho Rhee
Abstract: Provided are a method and device for recognizing a speaker by using a resonator. The method of recognizing the speaker includes receiving a plurality of electrical signals corresponding to a speech of the speaker from a plurality of resonators having different resonance bands; obtaining a difference of magnitudes of the plurality of electrical signals; and recognizing the speaker based on the difference of magnitudes of the plurality of electrical signals.
-
3.发明申请公开(公告)号：US20210398935A1
公开(公告)日：2021-12-23
申请号：US17166805
申请日：2021-02-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junhyung Kim , Joongha Lee , Sangha Park , Sunghyup Kim , Kyeongbin Lim
IPC: H01L23/00
Abstract: A chip bonding apparatus includes: a bonding contact configured to apply a bonding force to a semiconductor chip disposed on a substrate, the bonding contact having a first surface configured to face the semiconductor chip and a second surface opposite the first surface, the bonding contact including a protruding portion on the first surface, the protruding portion configured to contact the semiconductor chip, the bonding contact including a cavity formed in a region vertically overlapping the protruding portion, a heater disposed to be in contact with the second surface of the bonding contact to cover the cavity, and configured to heat the bonding contact, a bonding head disposed above the heater and configured to transmit the bonding force, and a partition wall structure protruding from a bottom surface of the cavity to partition an inner space of the cavity.
-
公开(公告)号：US10541670B2
公开(公告)日：2020-01-21
申请号：US15870546
申请日：2018-01-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yongseop Yoon , Sungchan Kang , Cheheung Kim , Sangha Park , Choongho Rhee , Hyeokki Hong
Abstract: Provided are micromechanical resonators and resonator systems including the micromechanical resonators. The micromechanical resonators may each include a supporting beam including a fixed end fixed on a supporting member and a loose end configured to vibrate, and a lumped mass arranged on the loose end, wherein the loose end has a width greater than a width of the fixed end, and a width of the lumped mass is greater than that the width of the fixed end.
-
公开(公告)号：US11887606B2
公开(公告)日：2024-01-30
申请号：US17741087
申请日：2022-05-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Cheheung Kim , Sungchan Kang , Sangha Park , Yongseop Yoon , Choongho Rhee
Abstract: Provided are a method and device for recognizing a speaker by using a resonator. The method of recognizing the speaker includes receiving a plurality of electrical signals corresponding to a speech of the speaker from a plurality of resonators having different resonance bands; obtaining a difference of magnitudes of the plurality of electrical signals; and recognizing the speaker based on the difference of magnitudes of the plurality of electrical signals.
-
Patent Agency Ranking
公开(公告)号：US10602261B2
公开(公告)日：2020-03-24
申请号：US16127565
申请日：2018-09-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sungchan Kang , Cheheung Kim , Sangha Park , Yongseop Yoon , Choongho Rhee , Hyeokki Hong
Abstract: A directional microphone is provided which includes a substrate having a cavity that penetrates therethrough, a resonator array of at least one resonator, and a cover member. Each of the resonator array and the cover member covers covering at least a part of the cavity.
-
公开(公告)号：US10594296B2
公开(公告)日：2020-03-17
申请号：US15492494
申请日：2017-04-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Choongho Rhee , Sungchan Kang , Cheheung Kim , Sangha Park , Yongseop Yoon
IPC: H01L41/08 , H03H9/02 , H03H9/24 , H01L41/083 , H01L41/113 , H01L41/187
Abstract: A multi resonator system is provided including a support substrate and a plurality of multi resonators. Each of the plurality of multi resonators includes a plurality of resonators, and one end of each of the plurality of resonators is fixed to the support substrate. Center frequencies of different ones of the plurality of multi resonators are different from each other, and the plurality of resonators within each individual multi resonator all have a same center frequency.
-
公开(公告)号：US10141007B1
公开(公告)日：2018-11-27
申请号：US15899884
申请日：2018-02-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Cheheung Kim , Sungchan Kang , Sangha Park , Yongseop Yoon , Choongho Rhee , Hyeokki Hong
Abstract: A sound and vibration spectrum analyzing device includes a plurality of resonators having different center frequencies, the plurality of resonators being configured to acquire a spectrum of sound and vibration. The sound and vibration spectrum analyzing device is configured to analyze the spectrum of sound and vibration, based on a first frequency signal of a first resonance mode and a second frequency signal of a second-order or higher resonance mode of at least some of the plurality of resonators.
-
公开(公告)号：US10076308B2
公开(公告)日：2018-09-18
申请号：US14595518
申请日：2015-01-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangha Park , Sungchan Kang , Seokwhan Chung
CPC classification number: A61B8/463 , A61B8/14 , A61B8/5207 , A61B8/54 , G01S7/5202 , G01S7/52038 , G01S15/8952 , G01S15/8963
Abstract: An ultrasonic diagnosis apparatus may comprise: a probe comprising a transducer configured to transmit a signal to an object and configured to receive an echo signal from the object; a controller configured to control the probe; and/or an image generation unit configured to generate an image of the object based on the echo signal. The controller may be further configured to drive the transducer such that the signal transmitted simultaneously comprises a fundamental frequency and at least one harmonic. A method of generating an ultrasonic image may comprise: transmitting a signal to an object by using a transducer; receiving an echo signal from the object by using the transducer; and/or generating an image of the object based on the echo signal. The transmitting of the signal to the object may comprise driving the transducer such that the signal transmitted simultaneously comprises a fundamental frequency and at least one harmonic.
-
公开(公告)号：US20220270615A1
公开(公告)日：2022-08-25
申请号：US17741087
申请日：2022-05-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Cheheung KIM , Sungchan Kang , Sangha Park , Yongseop Yoon , Choongho Rhee
Abstract: Provided are a method and device for recognizing a speaker by using a resonator. The method of recognizing the speaker includes receiving a plurality of electrical signals corresponding to a speech of the speaker from a plurality of resonators having different resonance bands; obtaining a difference of magnitudes of the plurality of electrical signals; and recognizing the speaker based on the difference of magnitudes of the plurality of electrical signals.
-
-
-
-
-
-
-
-
-
Search Results
26
records
(took 0.017 seconds)
