公开(公告)号：US20170309793A1

公开(公告)日：2017-10-26

申请号：US15364739

申请日：2016-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： JONG WAN SEO ,  Jin Ha KIM ,  Kwang Bok WOO ,  Dong Hoon LEE ,  Won Joon LEE ,  Sun Hwan HWANG

IPC: H01L33/50 ,  H01L33/38 ,  H01L33/46 ,  H01L33/62

CPC classification number: H01L33/504 ,  H01L33/38 ,  H01L33/46 ,  H01L33/50 ,  H01L33/502 ,  H01L33/62

Abstract: A semiconductor light emitting device may include a semiconductor light emitting diode (LED) chip, a light-transmitting film on the LED chip, and a light-transmitting bonding layer between the light-transmitting film and the semiconductor LED chip. At least one of the light-transmitting film and the light-transmitting bonding layer may include a wavelength conversion material configured to convert light emitted by the semiconductor LED chip into light having a wavelength different from a wavelength of the emitted light. The light-transmitting bonding layer may have a lateral inclined region extending to the lateral surface to form an inclined surface. The semiconductor light emitting device may further include a reflective packaging portion surrounding the light-transmitting bonding layer, covering the first surface such that an electrode of the LED chip is at least partially exposed. The reflective packaging portion may include a reflective material.