Abstract:
A power control device and an image forming apparatus including the same are disclosed. A power control device meets the need for low power consumption by minimizing standby power consumption in a plug-on state of an electronic apparatus, and meets the safety requirements by increasing a discharging rate of an X-cap or an E-cap in a plug-off state. The power control device includes a first capacitor charged by AC power during input of the AC power, a rectifier converting the AC power to DC power, a second capacitor disposed at an output of the rectifier, and a discharge circuit including at least one discharge resistor, and a first switch and a second switch configured to be alternately turned on/off in response to supply and interruption of the AC power, and discharging at least one of the first and second capacitors via the at least one discharge resistor, in response to turn-off of the first switch and turn-on of the second switch.
Abstract:
An LED lens includes a recess disposed in a quadrangular bottom surface of the LED lens and configured to have a light source disposed therein, wherein an internal surface of the recess, including lateral surfaces and top surfaces, is a light incident surface. The LED lens further includes a top surface forming a light exit surface, having a size greater than that of the bottom surface, and having a quadrangular shape; and lateral surfaces of the LED lens, disposed between the top and bottom surfaces of the LED lens, forming a reflective surface, and guiding light incident to the LED lens through the light incident surface to the light exit surface. The top surfaces of the light incident surface form an inverted quadrangular pyramid.
Abstract:
Provided is an apparatus configured to detect fine particles, including a fine particle trap including a plurality of through holes that are configured to trap the fine particles, a measurer including a light source configured to emit light to the plurality of through holes, and a detector configured to detect light scattered, reflected, or transmitted through the plurality of through holes and measure a spectrum, and a processor configured to estimate a number of the fine particles trapped in the plurality of through holes based on of the measured spectrum, wherein the plurality of through holes have a diameter equal to or less than 10 μm.
Abstract:
A semiconductor light emitting device may include a semiconductor light emitting diode (LED) chip, a light-transmitting film on the LED chip, and a light-transmitting bonding layer between the light-transmitting film and the semiconductor LED chip. At least one of the light-transmitting film and the light-transmitting bonding layer may include a wavelength conversion material configured to convert light emitted by the semiconductor LED chip into light having a wavelength different from a wavelength of the emitted light. The light-transmitting bonding layer may have a lateral inclined region extending to the lateral surface to form an inclined surface. The semiconductor light emitting device may further include a reflective packaging portion surrounding the light-transmitting bonding layer, covering the first surface such that an electrode of the LED chip is at least partially exposed. The reflective packaging portion may include a reflective material.
Abstract:
A light emitting diode (LED) lens comprises a light incident surface on a bottom surface of the LED lens facing a light source. A light exit surface, having a size greater than the bottom surface, is defined by a top surface of the LED lens. A planar portion, emitting light incident through the light incident surface, is in a central region of the light exit surface. At least one protrusion portion, protruding to be stepped with respect to the planar portion, is in a region of the light exit surface except for the central region. A reflective surface, defined by lateral surfaces of the LED lens between the top surface of the LED lens and the bottom surface thereof, guides the light incident through the light incident surface, and contacts a lower portion of the light exit surface corresponding to a boundary between the protrusion and the planar portions.
Abstract:
A gene amplification chip includes a chamber layer, a cover layer, a bottom layer, an inlet, and an outlet. The chamber layer has a first passage and through holes which are formed on one side of the first passage. The cover layer is disposed on one side of the chamber layer and has a cover channel formed to communicate with the first passage and the through holes, wherein the cover channel, the first passage and the through holes allow passage of liquids in a divided manner. The bottom layer is disposed on another side of the chamber layer and has a bottom channel formed to communicate with the first passage and the through holes. The inlet is formed in the cover layer and communicates with the cover channel. The outlet communicates with any one of the cover channel and the bottom channel.
Abstract:
In example embodiments, a semiconductor light emitting device includes a light emitting structure, first and second insulating layers, a barrier metal layer, and an electrode. The light emitting structure includes an active layer between a first and second conductivity-type semiconductor layer. The first insulating layer is on the light emitting structure and defines a first one and a second one of first openings that respectively expose the first and second conductivity-type semiconductor layers. The barrier metal layer is on the first insulating layer and electrically connected to the first and second conductivity-type semiconductor layers through the first and second one of the first openings. The second insulating layer is on the barrier metal layer and defines a second opening that partially exposes the barrier metal layer. The electrode is on the barrier metal layer and electrically connected to the first and second conductivity-type semiconductor layers through the barrier metal layer.
Abstract:
There is provided a light emitting diode (LED) package substrate including: a substrate including a chip mounting region on which a plurality of LED chips is mountable; a conductive layer including a plurality of electrode patterns disposed on the chip mounting region; and a groove part, forming a dam, wherein the groove part surrounds the chip mounting region and is spaced apart from the chip mounting region by a predetermined interval.
Abstract:
The present disclosure provides methods and apparatuses for biomaterial detection sensors. In some embodiments, a biomaterial detection sensor includes a membrane including a plurality of wells. Each of the plurality of wells is configured to encapsulate a biomaterial contained in a sample solution. A surface of the membrane is selectively modified into at least one of a hydrophilic surface and a hydrophobic surface. In some embodiments, a method of manufacturing a biomaterial detection sensor includes depositing a first membrane and a second membrane on respective surfaces of a wafer, forming a window by etching the first membrane and the first surface of the wafer, forming a plurality of wells on the second membrane, modifying a surface of the second membrane into at least one of a hydrophilic surface and a hydrophobic surface; and transferring a two-dimensional graphene oxide material onto a bottom of each of the plurality of wells.
Abstract:
A discharge circuit unit for minimizing standby power occurring in a standby mode and an image forming apparatus having the same are provided. The discharge circuit unit is connected to an input line of alternating current (AC) power and discharges a capacitive element for reducing noises. The discharge circuit unit includes a discharge circuit including first and second resistance units connected in series to discharge the capacitive element in response to a discharge control signal generated when an input of the AC power is interrupted, and a detection circuit that detects whether the input of the AC power is interrupted, and includes third and fourth resistance units connected in series so as to generate the discharge control signal when it is detected that the input of the AC power is interrupted. Each of the first to fourth resistance units includes at least one of a resistor and a switch.