公开(公告)号：US11916042B2

公开(公告)日：2024-02-27

申请号：US17169701

申请日：2021-02-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Won-Young Kim

IPC: H01L29/40 ,  H01L23/48 ,  H01L23/52 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06506 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: A semiconductor package includes a substrate, a master chip on the substrate, a first slave chip on a top surface of the master chip and partially exposing the top surface of the master chip, the first slave chip having a same size as the master chip and having a same storage capacity as the master chip, and a first chip connector on the exposed top surface of the master chip and coupled to the master chip and the first slave chip.

公开(公告)号：US20170133333A1

公开(公告)日：2017-05-11

申请号：US15295104

申请日：2016-10-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Young Kim ,  Sun-Won Kang ,  Jin-Chan Ahn

IPC: H01L23/00

CPC classification number: H01L24/02 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/0233 ,  H01L2224/0235 ,  H01L2224/02373 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/04073 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: Provided are a semiconductor device and a semiconductor package including the same. The semiconductor device comprises a semiconductor chip body including a first chip pad on a top surface, a passivation film disposed on the semiconductor chip body and a first redistribution layer that is disposed between the passivation film and the semiconductor chip body with an opening to expose a first chip center pad region at least partially overlapping the first chip pad, a first redistribution center pad region connected to the first chip center pad region, and a first edge pad region spaced apart from the first redistribution center pad region, through the passivation film, wherein a top surface of the first chip center pad region and a top surface of the first redistribution center pad region are not disposed on the same plane.

公开(公告)号：US20190252332A1

公开(公告)日：2019-08-15

申请号：US16393135

申请日：2019-04-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Young Kim ,  Sun-Won Kang ,  Jin-Chan Ahn

IPC: H01L23/00

CPC classification number: H01L24/02 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/0233 ,  H01L2224/0235 ,  H01L2224/02373 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/04073 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: Provided are a semiconductor device and a semiconductor package including the same. The semiconductor device comprises a semiconductor chip body including a first chip pad on a top surface, a passivation film disposed on the semiconductor chip body and a first redistribution layer that is disposed between the passivation film and the semiconductor chip body with an opening to expose a first chip center pad region at least partially overlapping the first chip pad, a first redistribution center pad region connected to the first chip center pad region, and a first edge pad region spaced apart from the first redistribution center pad region, through the passivation film, wherein a top surface of the first chip center pad region and a top surface of the first redistribution center pad region are not disposed on the same plane.

公开(公告)号：US10297559B2

公开(公告)日：2019-05-21

申请号：US15295104

申请日：2016-10-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Young Kim ,  Sun-Won Kang ,  Jin-Chan Ahn

IPC: H01L23/00

Abstract: Provided are a semiconductor device and a semiconductor package including the same. The semiconductor device comprises a semiconductor chip body including a first chip pad on a top surface, a passivation film disposed on the semiconductor chip body and a first redistribution layer that is disposed between the passivation film and the semiconductor chip body with an opening to expose a first chip center pad region at least partially overlapping the first chip pad, a first redistribution center pad region connected to the first chip center pad region, and a first edge pad region spaced apart from the first redistribution center pad region, through the passivation film, wherein a top surface of the first chip center pad region and a top surface of the first redistribution center pad region are not disposed on the same plane.

公开(公告)号：US12165974B2

公开(公告)日：2024-12-10

申请号：US17392936

申请日：2021-08-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Young Kim ,  Sunwon Kang

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/528 ,  H01L23/538 ,  H01L25/065

Abstract: Disclosed is a semiconductor package including a semiconductor chip that includes a chip pad on one surface of the semiconductor chip, a redistribution pattern on the one surface of the semiconductor chip and electrically connected to the chip pad, and a photosensitive dielectric layer between the semiconductor chip and the redistribution pattern. The photosensitive dielectric layer may be in physical contact with the redistribution pattern. The redistribution pattern includes a signal redistribution pattern, a ground redistribution pattern, and a power redistribution pattern. A vertical distance between the chip pad and the signal redistribution pattern may be greater than a width of the signal redistribution pattern.

公开(公告)号：US10784216B2

公开(公告)日：2020-09-22

申请号：US16393135

申请日：2019-04-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Young Kim ,  Sun-Won Kang ,  Jin-Chan Ahn

IPC: H01L23/00

Abstract: Provided are a semiconductor device and a semiconductor package including the same. The semiconductor device comprises a semiconductor chip body including a first chip pad on a top surface, a passivation film disposed on the semiconductor chip body and a first redistribution layer that is disposed between the passivation film and the semiconductor chip body with an opening to expose a first chip center pad region at least partially overlapping the first chip pad, a first redistribution center pad region connected to the first chip center pad region, and a first edge pad region spaced apart from the first redistribution center pad region, through the passivation film, wherein a top surface of the first chip center pad region and a top surface of the first redistribution center pad region are not disposed on the same plane.