公开(公告)号：US12118708B2

公开(公告)日：2024-10-15

申请号：US17465179

申请日：2021-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min-Cheol Kang ,  Do-Nyun Kim ,  Jaehoon Kim ,  Woojoo Sim

IPC: G06T7/00 ,  G06N3/045

CPC classification number: G06T7/0006 ,  G06T7/97 ,  G06T2207/10061 ,  G06T2207/20081 ,  G06T2207/20221 ,  G06T2207/30148

Abstract: Disclosed is a wafer defect inference system, which includes a test equipment that receives a first image obtained by imaging circuit patterns formed on a semiconductor wafer by using a scanning electron microscope and a second image obtained by imaging a layout image of a mask for implementing the circuit pattern on the semiconductor wafer and combines the first image and the second image to generate a combination image, and at least one computing device that is capable of communicating with the test equipment and infers a defect associated with the circuit pattern formed on the semiconductor wafer. The computing device receives the combination image, performs machine learning for inferring the defect based on the combination image, and generates an output image including information about the defect based on the machine learning.

公开(公告)号：US11747721B2

公开(公告)日：2023-09-05

申请号：US17154279

申请日：2021-01-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Useong Kim ,  Mincheol Kang ,  Woojoo Sim

IPC: G03F7/20 ,  G06N3/08 ,  G03F1/36 ,  G03F7/00 ,  H01L21/027

CPC classification number: G03F1/36 ,  G03F7/70308 ,  G03F7/70441 ,  G06N3/08 ,  H01L21/027

Abstract: Provided are a method of forming a mask, the method accurately and quickly restoring an image on the mask to the shape on the mask, and a mask manufacturing method using the method of forming the mask. The method of forming a mask includes obtaining first images by performing rasterization and image correction on shapes on the mask corresponding to first patterns on a wafer, obtaining second images by applying a transformation to the shapes on the mask, performing deep learning based on a transformation relationship between ones of the first images and ones of the second images corresponding to the first images, and forming a target shape on the mask corresponding to a target pattern on the wafer, based on the deep learning. The mask is manufactured based on the target shape on the mask.