公开(公告)号：US20190186960A1

公开(公告)日：2019-06-20

申请号：US16131467

申请日：2018-09-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungeun JO ,  YOUNGSHIN KWON ,  Minjin KIM ,  WOONBAE KIM ,  YOUNGDOO JUNG ,  Eunhee JUNG ,  INHO CHOI

IPC: G01D11/24 ,  G01N33/00

Abstract: Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.

公开(公告)号：US20190212312A1

公开(公告)日：2019-07-11

申请号：US16124385

申请日：2018-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minjin KIM ,  YOUNGDOO JUNG ,  Eunhee JUNG ,  Sungeun JO ,  INHO CHOI

IPC: G01N33/00 ,  G01N27/12 ,  G01N27/407 ,  G01N27/04 ,  H01L23/498 ,  H01L23/31 ,  H05K1/03 ,  H01L23/00

CPC classification number: G01N33/0027 ,  G01D11/245 ,  G01N27/048 ,  G01N27/123 ,  G01N27/128 ,  G01N27/407 ,  H01L23/02 ,  H01L23/3107 ,  H01L23/49805 ,  H01L24/48 ,  H01L27/0248 ,  H01L2224/48227 ,  H05K1/0306 ,  H05K2201/10151

Abstract: A gas sensor package includes a package substrate having a hole, the hole having an end that is opened at a first surface of the package substrate; a gas sensor disposed in the hole of the package substrate; a fixing plate disposed on the first surface of the package substrate, the fixing plate having a vent hole extending between a top surface and a bottom surface of the fixing plate, the bottom surface of the fixing plate facing toward the package substrate and the top surface of the fixing plate facing away from the package substrate, and the fixing plate overlapping the hole of the package substrate when viewed in a plan view; and a protective film attached to the fixing plate. The protective film overlaps the vent hole when viewed in a plan view.

公开(公告)号：US20190204281A1

公开(公告)日：2019-07-04

申请号：US16109758

申请日：2018-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： INHO CHOI ,  Minjin KIM ,  Sungwoo PARK ,  YOUNGDOO JUNG ,  Eunhee JUNG ,  Sungeun JO

IPC: G01N33/00 ,  H01L23/10 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC classification number: G01N33/006 ,  G01N33/0031 ,  H01L23/10 ,  H01L23/3121 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/564 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2924/3025

Abstract: Disclosed is a gas sensor package. The gas sensor package comprises a package substrate, a controller on the package substrate, a plurality of gas sensors on the controller, and a lid on the package substrate and the lid comprising a hole extending between a first surface and a second surface of the lid, the first surface of the lid facing away the package substrate and the second surface of the lid facing toward the package substrate. The gas sensors sense different types of gases.

公开(公告)号：US20170098578A1

公开(公告)日：2017-04-06

申请号：US15158890

申请日：2016-05-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JANGWOO LEE ,  YOUNGDOO JUNG

IPC: H01L21/78 ,  H01L23/00 ,  H01L21/02

CPC classification number: H01L21/78 ,  H01L21/02076 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/03 ,  H01L24/11 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A method of fabricating a semiconductor package is disclosed. The method includes forming a plurality of semiconductor chips and a mold layer covering the semiconductor chips on a substrate, forming outer terminals on a bottom surface of the substrate, coating a water-soluble material on the bottom surface of the substrate and the outer terminals to form a coating layer, cutting the substrate and the mold layer to separate the semiconductor chips from each other, and forming a shielding layer on the cutted mold layer.