INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

    公开(公告)号:US20250132234A1

    公开(公告)日:2025-04-24

    申请号:US18652312

    申请日:2024-05-01

    Abstract: Disclosed are interposers and semiconductor packages. The interposer includes a core layer, an upper wiring layer on the core layer, a plurality of lower pads on a bottom surface of the core layer, a plurality of through vias that vertically penetrate the core layer and electrically connect the upper wiring layer to the lower pads, and a dummy structure on a lower portion of the core layer. The dummy structure includes a dummy layer whose bottom surface is coplanar with the bottom surface of the core layer, a barrier layer between the core layer and the dummy layer, and a dielectric layer between the core layer and the barrier layer. The dummy structure is horizontally spaced apart and electrically insulated from the through vias.

    ELECTRONIC DEVICE AND METHOD FOR PROVIDING DRAWING ENVIRONMENT

    公开(公告)号:US20210304482A1

    公开(公告)日:2021-09-30

    申请号:US17267015

    申请日:2019-04-25

    Abstract: An electronic device according to various embodiments of the present invention includes: a touch screen display; a processor operatively connected to the display; and a memory operatively connected to the processor. The memory may include instructions which, when executed, cause the processor to: display, on the display, a user interface including a first section configured to receive a drawing input and a second section including a plurality of colors and one or more line widths, which are to be selected for the drawing input; execute an animation image file to be displayed on the first section, the animation image file including a procedure of drawing an object with at least one color among the plurality of colors and at least one line width among the one or more line widths; receive, from the display, an input for stopping the execution of the image file; and display a drawing output on the display according to the drawing input, the drawing output including at least one among the color and the line width used when the drawing input is received. Various other embodiments are also possible.

    SEMICONDUCTOR PACKAGE
    6.
    发明申请

    公开(公告)号:US20220199577A1

    公开(公告)日:2022-06-23

    申请号:US17478247

    申请日:2021-09-17

    Abstract: A semiconductor package includes a base substrate and an interposer substrate. The interposer substrate includes a semiconductor substrate, a first passivation layer, a wiring region, a through via penetrating through the semiconductor substrate and the first passivation layer, and a second passivation layer covering at least a portion of the first passivation layer and having an opening exposing a lower surface of the through via. The semiconductor package further includes a conductive pillar extending from the opening of the second passivation layer; and a conductive bump disposed between the conductive pillar and the base substrate. The opening of the second passivation layer has inclined side surfaces such that a width of the opening decreases towards the first passivation layer, and side surfaces of the conductive pillar are positioned to overlap the inclined side surfaces of the second passivation layer in a vertical direction.

Patent Agency Ranking