公开(公告)号：US20140061890A1

公开(公告)日：2014-03-06

申请号：US14013714

申请日：2013-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Do Lee ,  Taewoo Kang ,  Donghan Kim ,  JongBo Shim ,  Yang-hoon Ahn ,  SeokWon Lee ,  Dae-young Choi

IPC: H01L23/34

CPC classification number: H01L23/34 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/367 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/49827 ,  H01L25/0652 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/18161

Abstract: A semiconductor package may include a semiconductor chip mounted on a substrate, a molding part protecting the semiconductor chip and having a top surface at a substantially equal height to a top surface of the semiconductor chip, a heat exhausting part on the molding part and the semiconductor chip, and an adhesive part between the heat exhausting part and the molding part and between the heat exhausting part and the semiconductor chip. An interface between the heat exhausting part and the adhesive part has a concave-convex structure.

Abstract translation: 半导体封装可以包括安装在基板上的半导体芯片，保护半导体芯片并具有与半导体芯片的顶表面大致相同高度的顶表面的模制部件，模制部件上的热排出部分和半导体 散热部和模制部之间以及排热部和半导体芯片之间的粘接部。 散热部与粘接部之间的界面具有凹凸结构。