公开(公告)号：US09366805B2

公开(公告)日：2016-06-14

申请号：US14056427

申请日：2013-10-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Hyun Park ,  Jun Seok An ,  Yong Hun Kwon ,  Nae Won Jang

IPC: G02F1/1335 ,  F21V8/00

CPC classification number: G02B6/0091 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/0088 ,  G02B6/009 ,  G02B6/0093 ,  G02F1/133608

Abstract: A LED module includes a printed circuit board, LEDs which are vertically mounted on the printed circuit board and which emit light onto a side surface, and a contact member which is provided to come into contact with a light guide plate. The printed circuit board may be movably coupled to a bottom chassis. When the light guide plate undergoes thermal expansion, the LED module may move by pressing of the light guide plate acting on the contact member. Accordingly, a gap between the light guide plate and the LEDs may be uniformly maintained even when the light guide plate undergoes thermal expansion or is returned to an original state.

Abstract translation: LED模块包括印刷电路板，垂直安装在印刷电路板上并将光发射到侧表面上的LED以及设置成与导光板接触的接触构件。 印刷电路板可以可移动地联接到底部底盘。 当导光板经受热膨胀时，LED模块可以通过按压作用在接触构件上的导光板而移动。 因此，即使在导光板发生热膨胀或返回原来状态的情况下，也可以均匀地保持导光板与LED之间的间隙。

公开(公告)号：US10950640B2

公开(公告)日：2021-03-16

申请号：US16551114

申请日：2019-08-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Gu Jin ,  Yong Hun Kwon ,  Young Chan Kim ,  Sae Young Kim ,  Sung Young Seo ,  Moo Sup Lim ,  Tae Sub Jung ,  Sung Ho Choi

IPC: H01L27/146

Abstract: An image sensor includes a plurality of pixels, at least one of the pixels comprising: a photodiode configured to generate charges in response to light; and a pixel circuit disposed on the substrate, and including a storage transistor configured to store the charges generated by the photodiode, and a transfer transistor connected between the storage transistor and a floating diffusion node, wherein a potential of a boundary region between the storage transistor and the transfer transistor has a first potential when the transfer transistor is in a turned-off state, and has a second potential, lower than the first potential, when the transfer transistor is in a turned-on state.

公开(公告)号：USRE48053E1

公开(公告)日：2020-06-16

申请号：US15205650

申请日：2016-07-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Suk Ju Choi ,  Kun Ho Cho ,  Yong Hun Kwon ,  Kye Hoon Lee ,  Gil Tae Hur ,  Young Min Lee

IPC: G02F1/1335 ,  G02F1/1333 ,  F21V8/00

Abstract: A liquid crystal display (LCD) includes a cover assembly; a liquid crystal panel; a light guide plate configured to guide light to the liquid crystal panel; a printed circuit board (PCB) to which the light guide plate is mounted; and a light emitting diode (LED) package which is mounted on the PCB and emits light to a lateral side of the light guide plate. The PCB includes a base substrate; a connecting hole which is formed in the base substrate to couple the base substrate to the cover assembly with a connecting member; an insulating layer which is coated on the base substrate while avoiding a head part of the connecting member; and a spacer tape which is provided on an upper side of the insulating layer so that the light guide plate is evenly mounted on the PCB.

公开(公告)号：US20140104538A1

公开(公告)日：2014-04-17

申请号：US14056427

申请日：2013-10-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Hyun Park ,  Jun Seok An ,  Yong Hun Kwon ,  Nae Won Jang

IPC: F21V8/00

CPC classification number: G02B6/0091 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/0088 ,  G02B6/009 ,  G02B6/0093 ,  G02F1/133608

Abstract: A LED module includes a printed circuit board, LEDs which are vertically mounted on the printed circuit board and which emit light onto a side surface, and a contact member which is provided to come into contact with a light guide plate. The printed circuit board may be movably coupled to a bottom chassis. When the light guide plate undergoes thermal expansion, the LED module may move by pressing of the light guide plate acting on the contact member. Accordingly, a gap between the light guide plate and the LEDs may be uniformly maintained even when the light guide plate undergoes thermal expansion or is returned to an original state.

Abstract translation: LED模块包括印刷电路板，垂直安装在印刷电路板上并将光发射到侧表面上的LED以及设置成与导光板接触的接触构件。 印刷电路板可以可移动地联接到底部底盘。 当导光板经受热膨胀时，LED模块可以通过按压作用在接触构件上的导光板而移动。 因此，即使在导光板发生热膨胀或返回原来状态的情况下，也可以均匀地保持导光板与LED之间的间隙。

公开(公告)号：US08665398B2

公开(公告)日：2014-03-04

申请号：US13718581

申请日：2012-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Suk Ju Choi ,  Kun Ho Cho ,  Yong Hun Kwon ,  Kye Hoon Lee ,  Gil Tae Hur ,  Young Min Lee

IPC: G02F1/1335

CPC classification number: G02B6/0083 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0085 ,  G02B6/009 ,  G02F1/133308 ,  G02F2001/133314 ,  G02F2001/133317 ,  G02F2001/13332 ,  G02F2201/46

Abstract: An apparatus includes a chassis assembly; a liquid crystal display panel; a light guide plate configured to guide light to the liquid crystal display panel; a light emitting diode (LED) module including a printed circuit board (PCB), a plurality of LED packages which are mounted on the PCB and emit light to a lateral side of the light guide plate, and a connector connected to the PCB such that the connector is located behind the light guide plate; and a white strip member disposed between the PCB of the LED module and the light guide plate. An edge portion of a bottom surface of the light guide plate is supported by the PCB.

Abstract translation: 一种装置包括底盘组件; 液晶显示面板; 配置为将光引导到液晶显示面板的导光板; 包括印刷电路板（PCB）的发光二极管（LED）模块，安装在PCB上并向导光板的侧面发光的多个LED封装以及连接到PCB的连接器，使得 连接器位于导光板的后面; 以及布置在LED模块的PCB和导光板之间的白色条状构件。 导光板底面的边缘部分由PCB支撑。

公开(公告)号：US11525922B2

公开(公告)日：2022-12-13

申请号：US16427576

申请日：2019-05-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Gu Jin ,  Young Chan Kim ,  Tae Sub Jung ,  Yong Hun Kwon ,  Sung Young Seo ,  Moo Sup Lim ,  Sung Ho Choi

IPC: H01L27/146 ,  G01S17/89 ,  G01S17/08

Abstract: An image sensor may include a first photo gate and a second photo gate each extending substantially in parallel in a first direction, the first photo gate and the second photo gate isolated from direct contact with each other in a second direction, the second direction substantially orthogonal to the first direction, a first overflow gate between the first photo gate and the second photo gate, the first overflow gate extending in the first direction, a first charge collection region on the first photo gate, a second charge collection region on the second photo gate and isolated from direct contact with the first charge collection region in the second direction, a first floating diffusion region that may receive first charge from the first charge collection region and output the first charge, and a second floating diffusion region that may receive second charge from the second charge collection region and output the second charge.

公开(公告)号：US11456327B2

公开(公告)日：2022-09-27

申请号：US16524806

申请日：2019-07-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Gu Jin ,  Young Chan Kim ,  Yong Hun Kwon ,  Eung Kyu Lee ,  Chang Keun Lee ,  Moo Sup Lim ,  Tae Sub Jung

IPC: H01L27/146 ,  H01L31/167

Abstract: An image sensor includes a semiconductor substrate including a plurality of pixel regions, a first surface, and a second surface opposing the first surface, a plurality of transistors adjacent to the first surface of the semiconductor substrate in each of the plurality of pixel regions, a microlens on the second surface of the semiconductor substrate, and a plurality of conductive patterns in contact with the semiconductor substrate and closer to the second surface of the semiconductor substrate than to the first surface of the semiconductor substrate in each of the plurality of pixel regions.

公开(公告)号：US20200286942A1

公开(公告)日：2020-09-10

申请号：US16524806

申请日：2019-07-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Gu JIN ,  Young Chan Kim ,  Yong Hun Kwon ,  Eung Kyu Lee ,  Chang Keun Lee ,  Moo Sup Lim ,  Tae Sub Jung

IPC: H01L27/146 ,  H01L31/167

Abstract: An image sensor includes a semiconductor substrate including a plurality of pixel regions, a first surface, and a second surface opposing the first surface, a plurality of transistors adjacent to the first surface of the semiconductor substrate in each of the plurality of pixel regions, a microlens on the second surface of the semiconductor substrate, and a plurality of conductive patterns in contact with the semiconductor substrate and closer to the second surface of the semiconductor substrate than to the first surface of the semiconductor substrate in each of the plurality of pixel regions.