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公开(公告)号:US11525922B2
公开(公告)日:2022-12-13
申请号:US16427576
申请日:2019-05-31
Applicant: Samsung Electronics Co., Ltd.
Inventor: Young Gu Jin , Young Chan Kim , Tae Sub Jung , Yong Hun Kwon , Sung Young Seo , Moo Sup Lim , Sung Ho Choi
IPC: H01L27/146 , G01S17/89 , G01S17/08
Abstract: An image sensor may include a first photo gate and a second photo gate each extending substantially in parallel in a first direction, the first photo gate and the second photo gate isolated from direct contact with each other in a second direction, the second direction substantially orthogonal to the first direction, a first overflow gate between the first photo gate and the second photo gate, the first overflow gate extending in the first direction, a first charge collection region on the first photo gate, a second charge collection region on the second photo gate and isolated from direct contact with the first charge collection region in the second direction, a first floating diffusion region that may receive first charge from the first charge collection region and output the first charge, and a second floating diffusion region that may receive second charge from the second charge collection region and output the second charge.
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公开(公告)号:US11456327B2
公开(公告)日:2022-09-27
申请号:US16524806
申请日:2019-07-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Young Gu Jin , Young Chan Kim , Yong Hun Kwon , Eung Kyu Lee , Chang Keun Lee , Moo Sup Lim , Tae Sub Jung
IPC: H01L27/146 , H01L31/167
Abstract: An image sensor includes a semiconductor substrate including a plurality of pixel regions, a first surface, and a second surface opposing the first surface, a plurality of transistors adjacent to the first surface of the semiconductor substrate in each of the plurality of pixel regions, a microlens on the second surface of the semiconductor substrate, and a plurality of conductive patterns in contact with the semiconductor substrate and closer to the second surface of the semiconductor substrate than to the first surface of the semiconductor substrate in each of the plurality of pixel regions.
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公开(公告)号:US20220084812A1
公开(公告)日:2022-03-17
申请号:US17318629
申请日:2021-05-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sung Hyun Park , Seo Hyun Kim , Seung Ho Kim , Young Chan Kim , Young-Hoo Kim , Tae-Hong Kim , Hyun Woo Nho , Seung Min Shin , Kun Tack Lee , Hun Jae Jang
Abstract: A wafer cleaning method is provided. The wafer cleaning method includes providing a wafer on a stage that is inside of a chamber. The wafer is fixed to the stage by moving a grip pin connected to an edge of the stage. First ultrapure water is supplied onto the wafer while the wafer is rotating at a first rotation speed. The grip pin is released from the wafer by moving the grip pin. A development process is performed by supplying liquid chemical onto the wafer while the wafer is rotating at a second rotation speed that is less than the first rotation speed.
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公开(公告)号:US20200286942A1
公开(公告)日:2020-09-10
申请号:US16524806
申请日:2019-07-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Young Gu JIN , Young Chan Kim , Yong Hun Kwon , Eung Kyu Lee , Chang Keun Lee , Moo Sup Lim , Tae Sub Jung
IPC: H01L27/146 , H01L31/167
Abstract: An image sensor includes a semiconductor substrate including a plurality of pixel regions, a first surface, and a second surface opposing the first surface, a plurality of transistors adjacent to the first surface of the semiconductor substrate in each of the plurality of pixel regions, a microlens on the second surface of the semiconductor substrate, and a plurality of conductive patterns in contact with the semiconductor substrate and closer to the second surface of the semiconductor substrate than to the first surface of the semiconductor substrate in each of the plurality of pixel regions.
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公开(公告)号:US09966407B2
公开(公告)日:2018-05-08
申请号:US14830805
申请日:2015-08-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Young Chan Kim , Jung Chak Ahn , Hyuk Soon Choi , Kyung Ho Lee , Jun Suk Lee , Young Woo Jung
IPC: H01L27/14 , H01L27/146 , H04N5/3745
CPC classification number: H01L27/14643 , H01L27/14603 , H01L27/1461 , H01L27/14612 , H01L27/14614 , H01L27/14623 , H01L27/14627 , H01L27/1463 , H01L27/1464 , H01L27/14641 , H04N5/37452 , H04N5/37457
Abstract: A unit pixel of an image sensor which operates in global shutter mode is provided. The unit pixel includes a photo diode area including a photo diode configured to accumulate photocharges generated from incident light during a first period and a storage diode area including a storage diode configured to receive and store the photocharges from the photo diode. The photo diode corresponds to a micro lens that focuses the incident light.
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公开(公告)号:US10991748B2
公开(公告)日:2021-04-27
申请号:US16124226
申请日:2018-09-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Min-Sun Keel , Doo Won Kwon , Hyun Surk Ryu , Young Chan Kim , Young Gu Jin
IPC: H01L27/146 , H01L23/00 , H04N13/204 , G06T7/521 , H04N5/378
Abstract: A three-dimensional (3D) image sensor includes a first substrate having an upper pixel. The upper pixel includes a photoelectric element and first and second photogates connected to the photoelectric element. A second substrate includes a lower pixel, which corresponds to the upper pixel, that is spaced apart from the first substrate in a vertical direction. The lower pixel includes a first transfer transistor that transmits a first signal provided by the first photogate. A first source follower generates a first output signal in accordance with the first signal. A second transfer transistor transmits a second signal provided by the second photogate. A second source follower generates a second output signal in accordance with the second signal. First and second bonding conductors are disposed between the first and second substrates and electrically connect the upper and lower pixels.
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公开(公告)号:US20200174133A1
公开(公告)日:2020-06-04
申请号:US16427576
申请日:2019-05-31
Applicant: Samsung Electronics Co., Ltd.
Inventor: Young Gu JIN , Young Chan Kim , Tae sub Jung , Young Hun Kwon , Sung Young Seo , Moo Sup Lim , Sung Ho Choi
IPC: G01S17/89 , H01L27/146 , G01S17/08
Abstract: An image sensor may include a first photo gate and a second photo gate each extending substantially in parallel in a first direction, the first photo gate and the second photo gate isolated from direct contact with each other in a second direction, the second direction substantially orthogonal to the first direction, a first overflow gate between the first photo gate and the second photo gate, the first overflow gate extending in the first direction, a first charge collection region on the first photo gate, a second charge collection region on the second photo gate and isolated from direct contact with the first charge collection region in the second direction, a first floating diffusion region that may receive first charge from the first charge collection region and output the first charge, and a second floating diffusion region that may receive second charge from the second charge collection region and output the second charge.
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公开(公告)号:US12165866B2
公开(公告)日:2024-12-10
申请号:US17318629
申请日:2021-05-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sung Hyun Park , Seo Hyun Kim , Seung Ho Kim , Young Chan Kim , Young-Hoo Kim , Tae-Hong Kim , Hyun Woo Nho , Seung Min Shin , Kun Tack Lee , Hun Jae Jang
Abstract: A wafer cleaning method is provided. The wafer cleaning method includes providing a wafer on a stage that is inside of a chamber. The wafer is fixed to the stage by moving a grip pin connected to an edge of the stage. First ultrapure water is supplied onto the wafer while the wafer is rotating at a first rotation speed. The grip pin is released from the wafer by moving the grip pin. A development process is performed by supplying liquid chemical onto the wafer while the wafer is rotating at a second rotation speed that is less than the first rotation speed.
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公开(公告)号:US11810941B2
公开(公告)日:2023-11-07
申请号:US17217167
申请日:2021-03-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Min-Sun Keel , Doo Won Kwon , Hyun Surk Ryu , Young Chan Kim , Young Gu Jin
IPC: H01L27/146 , H01L23/00 , H04N13/204 , G06T7/521 , H04N25/75
CPC classification number: H01L27/14647 , H01L24/05 , H01L24/13 , H01L24/16 , H01L27/14612 , H01L27/14634 , H01L27/14636 , H04N13/204 , G06T7/521 , G06T2207/10024 , G06T2207/10028 , H01L24/14 , H01L2224/0401 , H01L2224/05554 , H01L2224/06131 , H01L2224/13013 , H01L2224/13016 , H01L2224/13147 , H01L2224/14131 , H01L2224/16014 , H01L2224/16145 , H04N25/75
Abstract: A three-dimensional (3D) image sensor includes a first substrate having an upper pixel. The upper pixel includes a photoelectric element and first and second photogates connected to the photoelectric element. A second substrate includes a lower pixel, which corresponds to the upper pixel, that is spaced apart from the first substrate in a vertical direction. The lower pixel includes a first transfer transistor that transmits a first signal provided by the first photogate. A first source follower generates a first output signal in accordance with the first signal. A second transfer transistor transmits a second signal provided by the second photogate. A second source follower generates a second output signal in accordance with the second signal. First and second bonding conductors are disposed between the first and second substrates and electrically connect the upper and lower pixels.
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公开(公告)号:US10950640B2
公开(公告)日:2021-03-16
申请号:US16551114
申请日:2019-08-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Young Gu Jin , Yong Hun Kwon , Young Chan Kim , Sae Young Kim , Sung Young Seo , Moo Sup Lim , Tae Sub Jung , Sung Ho Choi
IPC: H01L27/146
Abstract: An image sensor includes a plurality of pixels, at least one of the pixels comprising: a photodiode configured to generate charges in response to light; and a pixel circuit disposed on the substrate, and including a storage transistor configured to store the charges generated by the photodiode, and a transfer transistor connected between the storage transistor and a floating diffusion node, wherein a potential of a boundary region between the storage transistor and the transfer transistor has a first potential when the transfer transistor is in a turned-off state, and has a second potential, lower than the first potential, when the transfer transistor is in a turned-on state.
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