Abstract:
A heat assisted magnetic recording (HAMR) assembly includes a slider, a laser diode and solder connections between the laser diode and the slider. The solder connections mechanically and electrically attach the laser diode to the slider. Each solder connection has a total volume per unit area (i.e., height) of less than or equal to about 15 μm. The solder connections have a first intermetallic zone adjacent to the laser diode, a second intermetallic zone adjacent to the slider, and a eutectic zone of eutectic material between the first and second intermetallic zones. The eutectic zone occupies greater than or equal to about 35% of the total volume per unit area of the solder connection.
Abstract:
A light delivery system in a slider includes a channel waveguide, a mode-index refractive surface, a solid immersion mirror, and a near field transducer. The mode-index refractive surface shapes the angular spectrum of the light on its path to the solid immersion mirror in a manner so as to change the distribution of light energy focused on to the near field transducer.
Abstract:
A light delivery system in a slider includes a channel waveguide, a mode-index refractive surface, a solid immersion mirror, and a near field transducer. The mode-index refractive surface shapes the angular spectrum of the light on its path to the solid immersion mirror in a manner so as to change the distribution of light energy focused on to the near field transducer.
Abstract:
A heat assisted magnetic recording (HAMR) assembly includes a slider, a laser diode and solder connections between the laser diode and the slider. The solder connections mechanically and electrically attach the laser diode to the slider. Each solder connection has a total volume per unit area (i.e., height) of less than or equal to about 15 μm. The solder connections have a first intermetallic zone adjacent to the laser diode, a second intermetallic zone adjacent to the slider, and a eutectic zone of eutectic material between the first and second intermetallic zones. The eutectic zone occupies greater than or equal to about 35% of the total volume per unit area of the solder connection.