FLEX CIRCUIT HAVING A MULTIPLE LAYERED STRUCTURE AND INTERCONNECT
    6.
    发明申请
    FLEX CIRCUIT HAVING A MULTIPLE LAYERED STRUCTURE AND INTERCONNECT 有权
    具有多层结构和互连的柔性电路

    公开(公告)号:US20150201493A1

    公开(公告)日:2015-07-16

    申请号:US14594606

    申请日:2015-01-12

    Abstract: A flex circuit including a multiple layer structure is disclosed. The multiple layered structure includes a first or top layer and a second or base layer. Top traces and bond pads are fabricated on the top or obverse layer and interlayer traces and bond pads are fabricated between the first and second layers to provide an electrical interconnect to electrical components on a head assembly. In an illustrated embodiment, the flex circuit includes portions including the first or base layer and the second or top layer and one or more reduced thickness portion including the first or base layer and not the second layer. In one embodiment, the gimbal portion of the flex circuit includes the first layer and not the second layer of the multiple layer structure and in another embodiment a bending portion of the flex circuit includes the first base layer and not the second layer of the multiple layered structure to provide a reduced thickness to facilitate bending, for example in a micro-actuation region of the load beam.

    Abstract translation: 公开了一种包括多层结构的柔性电路。 多层结构包括第一或顶层和第二或基层。 顶部迹线和接合焊盘制造在顶部或正面层上,层间迹线和接合焊盘制造在第一和第二层之间,以提供与头部组件上的电气部件的电互连。 在所示的实施例中,柔性电路包括包括第一或第二层或第二层或顶层的部分和包括第一层或第二层而不是第二层的一个或多个减薄厚度部分。 在一个实施例中,柔性电路的万向节部分包括第一层而不是多层结构的第二层,在另一个实施例中,柔性电路的弯曲部分包括第一基底层而不是第二层的多层结构 结构以提供减小的厚度以便于弯曲,例如在负载梁的微致动区域中。

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