公开(公告)号：US11019748B2

公开(公告)日：2021-05-25

申请号：US15853203

申请日：2017-12-22

Applicant: Seagate Technology LLC

Inventor： Vivekananda Avvaru ,  Shankar Gopalakrishna ,  Saju Cheeran Verghese Francis ,  Odie Killen

IPC: H05K7/20 ,  H05K7/14 ,  F21V33/00 ,  G11B33/14 ,  F21Y115/10

Abstract: A system includes a drawer and a fan assembly. The drawer includes a mounting structure with a support surface and an aperture. The fan assembly extends through the aperture and includes a fan module and a top cover. The top cover is coupled to the support surface.

公开(公告)号：US10354699B1

公开(公告)日：2019-07-16

申请号：US16000581

申请日：2018-06-05

Applicant: Seagate Technology LLC

Inventor： Shankar Gopalakrishna ,  Anil Koyad Choyikkunnil ,  Saju Cheeran Verghese Francis ,  Naveen Kumar

IPC: G06F1/18 ,  G11B33/12

Abstract: A storage chassis may be adapted, or configured, to secure a plurality of carrierless devices (e.g., without the use of a carrier or drive tray) received thereby. The storage chassis may include a base, a first drive wall coupled to and extending from the base, and a second drive wall coupled to and extending from the base. Each of the first and second drive walls may include a top edge spaced away from a bottom portion of the base. The base, the first drive wall, and the second drive wall may define a row of drive slots and each drive slot may be configured to receive a carrierless device. Further, the storage chassis may include a plurality of locking units configured to extend across corresponding drive slots between the top edge of the first drive wall and the top edge of the second drive wall.

公开(公告)号：US11229140B2

公开(公告)日：2022-01-18

申请号：US15824816

申请日：2017-11-28

Applicant: Seagate Technology LLC

Inventor： Anil Koyad Choyikkunnil ,  Shankar Gopalakrishna ,  Saju Cheeran Verghese Francis ,  Kiran Padmakumari Devapalan

IPC: H05K7/18 ,  H05K7/14 ,  H05K5/02 ,  G11B33/12

Abstract: Carriers may be adapted, or configured, to allow devices received thereby to move towards and away from an interface end region. When devices are positioned proximate the interface end region of the carriers, interfaces of the devices may be presented by the carriers for operable coupling to an enclosure. When devices are positioned away from the interface end region of the carriers, interface adapters may be coupled to the interfaces of the devices, which may present a different interface for operable coupling to an enclosure.

公开(公告)号：US20190182982A1

公开(公告)日：2019-06-13

申请号：US15835147

申请日：2017-12-07

Applicant: Seagate Technology LLC

Inventor： Shankar Gopalakrishna ,  Kiran Devapalan ,  Saju Cheeran Verghese Francis ,  Vivekananda Avvaru ,  Anil KC

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/18 ,  H05K7/14

CPC classification number: H05K7/20172 ,  G06F1/181 ,  G06F1/20 ,  H05K7/1402 ,  H05K7/1422 ,  H05K7/20581 ,  H05K7/20727

Abstract: A fan assembly includes a fan module having a plurality of mounting openings, a housing partially surrounding the fan module, and a plurality of dampers that extend through the plurality of mounting openings to couple the fan module to the housing.

公开(公告)号：US10955881B2

公开(公告)日：2021-03-23

申请号：US15584741

申请日：2017-05-02

Applicant: Seagate Technology, LLC

Inventor： Shankar Gopalakrishna ,  Vivekananda Avvaru ,  Saju Cheeran Verhgese Francis

IPC: G06F1/20 ,  H01L23/40 ,  G06F1/18 ,  H01L23/02 ,  H01L23/367 ,  F28D15/00

Abstract: An electronic memory module can be cooled by a cooling assembly that consists of at least a printed circuit board connected to at least one data storage component. The memory module may be housed within, and in physical contact with, a cooling frame that surrounds a periphery of the printed circuit board. The cooling frame can have a seating tab that is separated from the memory module, spans the memory module, and supports a heatsink in contact with the at least one data storage component.

公开(公告)号：US20190274231A1

公开(公告)日：2019-09-05

申请号：US15911353

申请日：2018-03-05

Applicant: Seagate Technology LLC

Inventor： Shankar Gopalakrishna ,  Anil Koyad Choyikkunnil ,  Yogeesha Manjunathaiah ,  Saju Cheeran Verghese Francis ,  Y. Suresh Reddy

IPC: H05K7/20 ,  F24F13/14 ,  F24F13/24

Abstract: An air intake control system can consist of an aero-acoustic assembly positioned within an enclosure. The aero-acoustic assembly may have an intake occupied by a plurality of louvers with each of the plurality of louvers configured to move between open and closed positions in response to airflow passing through the intake.

公开(公告)号：US11856725B2

公开(公告)日：2023-12-26

申请号：US17546743

申请日：2021-12-09

Applicant: Seagate Technology LLC

Inventor： Anil Koyad Choyikkunnil ,  Shankar Gopalakrishna ,  Saju Cheeran Verghese Francis ,  Kiran Padmakumari Devapalan

IPC: H05K7/18 ,  H05K7/14 ,  H05K5/02 ,  G11B33/12

CPC classification number: H05K7/183 ,  G11B33/124 ,  G11B33/128 ,  H05K5/02 ,  H05K7/14

Abstract: Carriers may be adapted, or configured, to allow devices received thereby to move towards and away from an interface end region. When devices are positioned proximate the interface end region of the carriers, interfaces of the devices may be presented by the carriers for operable coupling to an enclosure. When devices are positioned away from the interface end region of the carriers, interface adapters may be coupled to the interfaces of the devices, which may present a different interface for operable coupling to an enclosure.

公开(公告)号：US10485136B2

公开(公告)日：2019-11-19

申请号：US15835147

申请日：2017-12-07

Applicant: Seagate Technology LLC

Inventor： Shankar Gopalakrishna ,  Kiran Devapalan ,  Saju Cheeran Verghese Francis ,  Vivekananda Avvaru ,  Anil KC

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/18 ,  H05K7/14

Abstract: A fan assembly includes a fan module having a plurality of mounting openings, a housing partially surrounding the fan module, and a plurality of dampers that extend through the plurality of mounting openings to couple the fan module to the housing.

公开(公告)号：US10455715B2

公开(公告)日：2019-10-22

申请号：US15829298

申请日：2017-12-01

Applicant: Seagate Technology LLC

Inventor： Anil Koyad Choyikkunnil ,  Kiran Padmakumari Devapalan ,  Shankar Gopalakrishna ,  Saju Cheeran Verghese Francis

IPC: H05K5/02 ,  H05K5/00 ,  H05K7/14 ,  G11B33/12 ,  G11B33/02

Abstract: Carriers may be adapted, or configured, to secure one of a plurality of varying-sized devices received thereby. Regardless of the size of the device, an interface of the device may be positioned proximate an interface opening of the carrier for, for example, operable coupling to an enclosure. The carrier may include a first side rail, a second side rail, and a movable rail that moves between the first and second side rail to adapt, or configure, the carrier to secure the one of the plurality of varying-sized devices received thereby. For example, the movable rail may be linearly translatable between the first and second side rails.

公开(公告)号：US20190174642A1

公开(公告)日：2019-06-06

申请号：US15829298

申请日：2017-12-01

Applicant: Seagate Technology LLC

Inventor： Anil Koyad Choyikkunnil ,  Kiran Padmakumari Devapalan ,  Shankar Gopalakrishna ,  Saju Cheeran Verghese Francis

IPC: H05K5/02 ,  H05K7/14 ,  H05K5/00

CPC classification number: H05K5/0217 ,  G11B33/022 ,  G11B33/124 ,  H05K5/0004 ,  H05K7/1487

Abstract: Carriers may be adapted, or configured, to secure one of a plurality of varying-sized devices received thereby. Regardless of the size of the device, an interface of the device may be positioned proximate an interface opening of the carrier for, for example, operable coupling to an enclosure. The carrier may include a first side rail, a second side rail, and a movable rail that moves between the first and second side rail to adapt, or configure, the carrier to secure the one of the plurality of varying-sized devices received thereby. For example, the movable rail may be linearly translatable between the first and second side rails.